• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.55-59
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• 1999

One of lead free glass, Bi based solder glass is investigated for electronic packaging application. The melting temperature of glass about $550^{\circ}C$ at Bi based glass (70wt% $B_2O_3$ + l5wt%$B_2O_3$ + 8wt% $SiO_2$ + 2wt% $P_2O_5$ + 4wt% $A1_2O_3$ +lwt% ZnO) and varied with $P_2O_5$ content in this system. Crystallized glasses were obtainded after 1hr heat teratment at $450^{\circ}C$ with 10wt% of $P_2O_5$ addition. Much higher melting temperature was observed at $B_2O_3$ rich composition area.

• Journal of the Korean Ceramic Society
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• v.38 no.7
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• pp.628-633
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• 2001

전자 패키징에 적용 가능한 저융점 유리 중에서 납성분이 포함되어 있지 않는 Bi계 유리의 연구를 행하였다. 기판과의 일체화를 위한 유리의 응용으로, 소자와의 반응 억제와 열응력 완화를 위해 유리의 저융점화 및 열팽창계수를 제어하였다. 본 연구에서 제조된 Bi계 유리는 DTA와 TMA의 열분석을 통해 5$50^{\circ}C$ 부근에서 연화점이 있고, 열팽창계수는 7.52~12.09$\times$$10^{-6}$/$^{\circ}C$의 범위였으며, 비유전율은 9~13이었다. 본 연구의 납성분을 포함되어 있지 않는 유리조성은 우수한 내산성을 나타내었다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.