• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.10
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• pp.63-67
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• 2003

This paper proposes a new BLSA(Bit Line Sense Amplifier) for MRAM. Current BLSA employs a latch-type circuit to amplify a signal from the selected memory cell. The proposed BLSA simplifies the circuit by amplifying the signal using cross-coupled PMOS transistors. It shows the same operation speedas the latch-type BLSA in simulation and occupies only 85% of the area taken by the latch-type BLSA.

• Journal of Electrical Engineering and information Science
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• v.3 no.3
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• pp.300-305
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• 1998

This paper describes new sense amplifier with fast sensing delay time of 0.54ns and 32kb CMOS embedded SRAM with 4.67 ns access time for a 3-V power supply. It was achieved using the sense amplifier with multiple point sensing scheme and highs peed bit-line scheme. The sense amplifier saves 25% of the power dissipation compared with the conventional one while maintaining a very short sensing delay. The SRAM uses 0.5m double-polysilicon and triple-metal CMOS process technology. A die size is 1.78${\times}$mm2.13mm.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.6
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• pp.1-8
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• 2000

In this paper, design of sense amplifier for a flash memory minimizing bit line disturbance due to common bit line is presented. There is a disturbance problem at output modes by using common bit line, when the external devices access an internal flash memory. This phenomenon is resulted form hot carrier between floating gates and bit lines by thin oxide thickness. To minimize bit line disturbance, lower it line voltage is required and need sense amplifier to detect data existence in lower bit line voltage. Proposed circuits is operated at lower bit line voltage and we fabricated a embedded flash memory MCU using 0.6u technology.

• Journal of IKEEE
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• v.17 no.3
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• pp.260-266
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• 2013

The open bit line is vulnerable to noise compared to the folded bit line when read/write for the DRAM. According to the increasing DRAM densities, the core circuit operating conditions is exacerbated by the noise when it comes to the open bit line 6F2(F : Feature Size) structure. In this paper, the interference effects were analyzed by the data patterns between the bit line by experiments. It was beyond the scope of existing research. 68nm Tech. 1Gb DDR2, Advan Tester used in the experiments. The noise effects appears the degrade of internal operation margin of DRAM. This paper investigates sense amplifier power line splits by experiments. The noise can be improved by 0.2ns(1.3%)~1.9ns(12.7%), when the sense amplifier power lines split. It was simulated by 68nm Technology 1Gb DDR2 modeling.

• Proceedings of the IEEK Conference
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• 2002.07c
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• pp.1555-1557
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• 2002

We have investigated the precharge type sense amplifier, it is suitable fur voltage sensing in a NOR type single transistor ferroelectric field effect transistor (1T FeFET) memory read operation. The proposed precharge type sense amplifier senses the bit line voltage of 1T FeFET memory. Therefore, the reference celt is not necessary compared to current sensing in 1T FeFET memory, The high noise margin is wider than the low noise margin in the first inverter because requires tile output of precharge type sense amplifier high sensitivity to transition of input signal. The precharge type sense amplifier has very simple structure and can sense the bit line signal of the 1T FeFET memory cell at low voltage.

• Journal of IKEEE
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• v.20 no.2
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• pp.167-170
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• 2016

Replica bit-line technique is used for making enable signal of sense amplifier which accurately tracks bit-line of SRAM. However, threshold voltage variation in the replica bit-line circuit changes the cell current, which results in variation of the sense amplifier enable time, $T_{SAE}$. The variation of $T_{SAE}$ makes the sensing operation unstable. In this paper, in addition to conventional replica bit-line delay ($RBL_{conv}$), dual replica bit-line delay (DRBD) and multi-stage dual replica bit-line delay (MDRBD) which are used for reducing $T_{SAE}$ variation are briefly introduced, and the maximum possible number of on-cell which can satisfy $6{\sigma}$ sensing yield is determined through simulation at a supply voltage of 0.6V with 14nm FinFET technology. As a result, it is observed that performance of DRBD and MDRBD is improved 24.4% and 48.3% than $RBL_{conv}$ and energy consumption is reduced which 8% and 32.4% than $RBL_{conv}$.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.538-541
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• 1998

This paper describes the development of 5.15ns 32kb asynchronous CMOS SRAM using 0.6.mu.m CMOS technology. The proposed high speed embedded SRAM is realized with optimized control circuit and sense amplifier at a power supply of 3V. Using proposed control circuit, the delay time from address input to wordline 'on' is reduced by 33% and mismatch-insensitive sense amplifier can sense a small difference of bit-line voltage fast and stably.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.526-529
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• 1998

This paper describes new sense amplifier with fast sensing delay time of 0.54ns and 32kb CMOS embedded SRAM with 4.67ns access time for a 3-V powr supply. It was achieved using the sense amplifier with multiple point sensing scheme and high speed bit-line scheme. The sense amplifier saves 25% of the power dissipation compared with the conventional one while maintaining a very short sensing delay. The SRAM uses 0.5.mu.m double-polysilicon and triplemetal CMOS process technology. A die size is 1.78mm*2.13mm.

• Proceedings of the IEEK Conference
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• 2002.07c
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• pp.1559-1562
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• 2002

This paper describes a 0.13um ultra-high speed 1Mb CMOS SRAM macro with 1.7ns access time. It achieves ultra-high speed operation using two novel approaches. First, it uses process insensitive sense amplifier (Double-Equalized Sense Amplifier) which improves voltage offset by about 10 percent. Secondly, it uses new replica-based sense amplifier driver which improves bit- line evaluation time by about 10 percent compared to the conventional technique. The various memory macros can be generated automatically by using a compiler, word-bit size from 64kb to 1 Mb including repairable redundancy circuits.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.433-436
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• 1998

Hot carrier induceed the performance degradation of sense amplifier circuit in DRAM has been measured and analyzed using 0.8.mu.m CMOS process. Simulation and experimental results show that the degradation of the MOS devices affects the decrease of the half-Vcc, voltage gain and the increase of the sensing voltage gain and the increase of the sensing voltage. The dominant degradation mechanism is the capacitance imblance in the bit-line pair. We carried out the spice simulation to investigate the degradation of the sense amplifier circuit.