• Title/Summary/Keyword: Bond-wire modules

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Design of 77-GHz Automotive Radar Frontend Modules (77 GHz 대역 차량용 레이더의 프론트 엔드 모듈 설계)

  • Park, Sangwook;Kwon, Manseok;Kam, Dong Gun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.25 no.4
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    • pp.487-490
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    • 2014
  • This paper describes a design of an automotive radar frontend module with taking care of the routing of 77-GHz signals on a printed circuit board including wire-bond and waveguide transitions.

Testbed of Power MOSFET Aging Including the Measurement of On-State Resistance (전력용 MOSFET의 온-상태 저항 측정 및 노화 시험 환경 구축)

  • Shin, Joonho;Shin, Jong-Won
    • The Transactions of the Korean Institute of Power Electronics
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    • v.27 no.3
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    • pp.206-213
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    • 2022
  • This paper presents setting up a laboratory-scale testbed to estimate the aging of power MOSFET devices and integrated power modules by measuring its on-state voltage and current. Based on the aging mechanisms of the component inside the power module (e.g., bond-wire, solder layer, and semiconductor chip), a system to measure the on-state resistance of device-under-test (DUT) is designed and experimented: a full-bridge circuit applies current stress to DUT, and a temperature chamber controls the ambient temperature of DUT during the aging test. The on-state resistance of SiC MOSFET measured by the proposed testbed was increased by 2.5%-3% after 44-hour of the aging test.