• Journal of the Korean Institute of Telematics and Electronics B
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• v.28B no.11
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• pp.859-865
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• 1991

The paper proposes a design of high-speed dynamic CMOS PLA (Programmable Logic Array) which performs stable circuit operation. The race problem which nay occur in a NOR-NOR implementation of PLA is free in the proposed dynamic CMOS PLA by delaying time between the clocks to the AND- and to the OR-planes. The delay element has the same structure as the product line of the longest delay in the AND p`ane. Therefore it is unnecessary to design the delay element or to calculate correct delay time. The correct delay generated by the delay element makes the dynamic CMOS PLA to perform correct and stable circuit operation. Theproposed dynamic CMOS PLA has few variation of switching delay with the increasing number of inputs or outputs in PLA. It is verified by SPICE circuit simulation that the proposed dynamic CMOS PLA has the better performance over existing dynamic CMOS PLA's.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.4
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• pp.136-141
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• 1996

In this paper, a new CMOS on-chip current reference circit for memory, operational amplifiers, comparators, and data converters is proposed. The reference current is almost independent of temeprature and power-supply variations. In the proposed circuit, the current component with a positive temeprature coefficient cancels that with a negative temperature coefficient each other. While conventional curretn and voltage reference circuits require BiCMOS or bipolar process, the presented circuit can be integrated on a single chip with other digiral and analog circits using a standard CMOS process and an extra mask is not needed. The prototype is fabricated employing th esamsung 1.0um p-well double-poly double-metal CMOS process and the chip area is 300um${\times}$135 um. The proposed reference current circuit shows the temperature coefficient of 380 ppm/.deg. C with the temperature changes form 30$^{\circ}C$ to 80$^{\circ}C$, and the output variation of $\pm$ 1.4% with the supply voltage changes from 4.5 V to 5.5 V.

• Journal of the Korean Institute of Telematics and Electronics
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• v.21 no.5
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• pp.55-60
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• 1984

With the advancement of CMOS technology, it has become attractive to employ complex gate structures in realizing digital circuits. A new test generation algorithm for CMOS complex gates to detect all stuck-open and stuck-on faults considering internal gate response and unknown state is proposed. Minimal and complete set can be derived by this algorithm. Also, it is verified that such a test set is generated applying this algorithm to arbitrary CMOS complex gates by computer.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.34C no.1
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• pp.1-11
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• 1997

A BiCMOS circuit consists of the CMOS part which performs the logic function, and the bipolar part which drives output load. In BiCMOS circuits, transistor stuck-open faults exhibit delay faults in addition to sequential beavior. Also, stuck-on faults enhanced IDDQ (quiscent power supply current) at steady state. In this paper, a method is proposed which efficiently generates test patterns to detect stuck-open faults and stuck-on faults in BiCMOS circuits. The proposed method divides the BiCMOS circuit into pull-up part and pull-down part, and generates test patterns detect faults occured in each part by structural property of the BiCMOS circuit.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.118-119
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• 2007

High performance three-dimensional (3-D) stacked poly-Si complementary metal-oxide semiconductor (CMOS) inverters with a high quality laser crystallized channel were fabricated. Low temperature crystallization methods of a-Si film using the excimer-laser annealing (ELA) and sequential lateral solidification (SLS) were performed. The NMOS thin-film-transistor (TFT) at lower layer of CMOS was fabricated on oxidized bulk Si substrate, and the PMOS TFT at upper layer of CMOS was fabricated on interlayer dielectric film. The 3-D stacked poly-Si CMOS inverter showed excellent electrical characteristics and was enough for the vertical integrated CMOS applications.

• Journal of Satellite, Information and Communications
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• v.10 no.2
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• pp.30-33
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• 2015

In this paper, we proceeded a study on the Hybrid RF based development of the smart phone Application skin disease monitoring using CMOS camera. we proposed an image transfer technology which can use the CMOS camera and we developed the smart phone application which can be possible to use a remote monitoring for skin disease. Image transfer technology using Hybrid RF communication applied for WiFi using CMOS camera. We implemented the function which can use a remote monitoring using Wi-Fi. These suggestion can be a good example for endoscopic applications using hybrid RF based smart phone application of skin disease monitoring using CMOS camera.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.6
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• pp.428-435
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• 1998

SOI-like-bulk CMOS device is proposed, which having the advantages of SOI(Silicon On Insulator) and protects short channel effects efficiently with adding partial epitaxial process at standard CMOS process. SOI-like-bulk NMOS and PMOS with 0.25${\mu}{\textrm}{m}$ gate length have designed and optimized through analyzing the characteristics of these devices and applying again to the design of processes. The threshold voltages of the designed NMOS and PMOS are 0.3[V], -0.35[V] respectively and those have shown the stable characteristics under 1.5[V] gate and drain voltages. The leakage current of typical bulk-CMOS increase with shortening the channel length, but the proposed structures on this a study reduce the leakage current and improve the subthreshold characteristics at the same time. In addition, subthreshold swing value, S is 70.91[mV/decade] in SOI-like-bulk NMOS and 63.37[mV/ decade] SOI-like-bulk PMOS. And the characteristics of SOI-like-bulk CMOS are better than those of standard bulk CMOS. To validate the circuit application, CMOS inverter circuit has designed and transient & DC transfer characteristics are analyzed with mixed mode simulation.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.37 no.2
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• pp.60-68
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• 2000

This paper describes a design methodology for the CMOS current source which can be implemented in standard memory process. The proposed techniques provide a good characteristic against the power-supply variation by utilizing a self-bias circuit and the reduction of the first-order component of the temperature variation through the new temperature compensation technique and include a new current-sensing start-up circuit enabling a robust operation against the voltage noise generated during the operation of the chip. In addition to the circuit-design technology, techniques where the proposed CMOS current-reference circuit can be applied to the clocking circuits of a very high-speed DRAM are presented. The feasibility of the suggested design methodology for the CMOS current reference is demonstrated by both the analytical method and the circuit simulation.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.2
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• pp.118-123
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• 1989

In this paper, as we have integrated SCF for voice signal processing using CMOS circuit with the low power dissipation and the easy circuit design, it has been presented the simplified CMOS OP AMP design method with ${\pm}$5V pwoer source in order to use together with digital part. After an example about SCF CMOS OP AMP design, it has been performed layout appling channel width and length obtained by design method, and then its characteristics were simulated by SPICE 2G program. Therefoe, this design method will be applied the general CMOS OP AMP design in the electronic circuit.