• Journal of the Korean Institute of Telematics and Electronics
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• v.24 no.4
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• pp.652-657
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• 1987

This paper describes an application of CMOS Gate Array Integrated Cricuits to the implementation of three functional units: A Multiplexer, Time Switch, and Demultiplexer in the Switching Network and Digital Line Concentrator of TDX-1 system, which is a fully digital time division electronic switching system in Korea. The application of CMOS Gate Array Integrated Circuits significantly improves the overall system performance in terms of power consumption, cost, size, reliability, and timing margin, etc.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.7
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• pp.11-19
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• 1998

A signal line potential variation due to the delta-I noise was physically investigated in CMOS integrated circuits. An equivalent circuit for the noise analysis was presented. The signal line was modeled as segmented RC-lumped circuits with the ground noise. Then the equivalent circuit was mathematically analyzed. Therebvy a new signal line potential variation model due to the switching mosie was developed. Th emodel was verified with 0.35.mu.m CMOS deivce model parameters. The model has an excellent agreement with HSPICE simulation. Thus the proposed model can be dirctly employed in the industry to design the high-performance integrted circuit design as well as integrated circuit package design.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.135-139
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• 1996

It is difficult to fabricate precise resistors for the analog integrated circuits using MOS technology. Until now polysilicon resistors were used at the analog integrated circuits, but some deviations of resistance and sensitive variation processes still cause their misactions. In order to improve these misactions, we suggest a CMOS resistor cell which provides precise resistance and excellant linearity. Also we designed the second order active low pass filter using the CMOS resistor cells and verified their superior performances compared to the actual resistors.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.5
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• pp.509-521
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• 1988

In the designs of integrated circuits, the buffer circuits used for driving a large capacitive load from minimum-structured logic circuit outputs have important effects upon system throughputs. Therefore it is important to optimize the buffer circuits. In this paper, the principle of designing CMOS buffer circuits which have the minimum delay and drive the given capacitive load is discussed. That is, the effects of load capacitance upon rise time, fall time, and delay of the CMOS inverter and the effects of parasitic capacitances are finely analysed to calculate the requested minimum-delay CMOS buffer condition. This is different from the method by C.A. Mead et. al.[2.3.4.]which deals with passive-load-nMOS buffers. Large channel width MOS transistor stages are necessary to drive a large capacitive load. The effects of polysilicon gate resistances of such large stages upon delay are also analysed.And, the area of buffer circuits designed by the proposed method is smaller than that of buffer circuits designed by C.A. Mead's method.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.5
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• pp.423-429
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• 2013

A 6-Gb/s differential voltage mode driver is presented whose output impedance and pre-emphasis level can be controlled independently. The voltage mode driver consists of five binary-weighted slices each of which has four sub-drivers. The output impedance is controlled by the number of enabled slices while the pre-emphasis level is determined by how many sub-drivers in the enabled slices are driven by post-cursor input. A prototype transmitter with a voltage-mode driver implemented in a 65-nm CMOS logic process consumes 34.8-mW from a 1.2-V power supply and its pre-emphasized output signal shows 165-mVpp,diff and 0.56-UI eye opening at the end of a cable with 10-dB loss at 3-GHz.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.617-618
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• 2006

A CMOS quadrature Up-converter for a direct-conversion receiver of 5.15-5.825GHz wireless LAN is described. The Up-converter consists of two sub-harmonic mixers, for I and Q channels, and an LO generation network. In order to decrease the number of inductor, I and Q path are merged. The simulation results including all the parasitics show -17.3dB conversion gain at center and -8 dBv oIP3 while consuming 22.968mW under 1.8V supply. The quadrature Up-converter is under fabrication with the other transmitter blocks in a $0.18{\mu}m$ CMOS technology.

• JSTS:Journal of Semiconductor Technology and Science
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• v.7 no.4
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• pp.267-273
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• 2007

A fractional-N frequency synthesizer supports quadruple bands and multiple standards for mobile broadcasting systems. A novel linearized coarse tuned VCO adopting a pseudo-exponential capacitor bank structure is proposed to cover the wide bandwidth of 65%. The proposed technique successfully reduces the variations of KVCO and per-code frequency step by 3.2 and 2.7 times, respectively. For the divider and prescaler circuits, TSPC (true single-phase clock) logic is extensively utilized for high speed operation, low power consumption, and small silicon area. Implemented in $0.18-{\mu}m$ CMOS, the PLL covers $154{\sim}303$ MHz (VHF-III), $462{\sim}911$ MHz (UHF), and $1441{\sim}1887$ MHz (L1, L2) with two VCO's while dissipating 23 mA from 1.8 V supply. The integrated phase noise is 0.598 and 0.812 degree for the integer-N and fractional-N modes, respectively, at 750 MHz output frequency. The in-band noise at 10 kHz offset is -96 dBc/Hz for the integer-N mode and degraded only by 3 dB for the fractional-N mode.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.970-973
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• 2003

Abstract An idea to redce the direct-path short circuit current of the CMOS digital integrated circuit is present. The sample circuit model of the CMOS digital circuit is the CMOS current-control digital output driver circuit, which are also suitable for the low voltage supply integrated circuits as the simple digital inverter, are present in this title. The circuit consists of active MOS load as the current control source, which construct from the saturated n-channel and p-channel MOSFET and the general CMOS inverter circuits. The saturated MOSFET bias can control the output current and the frequency response of the circuit. The experimental results show that lower short circuit current control can make the lower frequency response of the circuit.

• Electronics and Telecommunications Trends
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• v.33 no.6
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• pp.1-11
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• 2018

Several industrial applications such as space exploration, aerospace, automotive, the downhole oil and gas industry, and geothermal power plants require specific electronic systems under extremely high temperatures. For the majority of such applications, silicon-based technologies (bulk silicon, silicon-on-insulator) are limited by their maximum operating temperature. Silicon carbide (SiC) has been recognized as one of the prime candidates for providing the desired semiconductor in extremely high-temperature applications. In addition, it has become particularly interesting owing to a Si-compatible process technology for dedicated devices and integrated circuits. This paper briefly introduces a variety of SiC-based integrated circuits for use under extremely high temperatures and covers the technology trend of SiC CMOS devices and processes including the useful implementation of SiC ICs.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.273-279
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• 2002

This paper presents a fabrication technology for the integration of single crystal Si microstructures with on-chip circuitry. It is a dissolved wafer technique that combines an electro-chemical etch-stop for the protection of circuitry with an impurity-based etch-stop for the microstructures, both of which are defined in an n-epi layer on a p-type Si wafer. A CMOS op. amp. has been integrated with $p^{++}$ Si accelerometers using this process. It has a gain of 68 dB and an output swing within 0.2 V of its power supplies, unaffected by the wafer dissolution. The accelerometers have $3{\;}\mu\textrm{m}$ thick suspension beams and $15{\;}\mu\textrm{m}$ thick proof masses. The structural and electrical integrity of the fabricated devices demonstrates the success of the fabrication process. A variety of lead transfer methods are shown, and process details are discussed.