• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.457-457
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• 2012

We presented plasma processing using a DC Arc Plasmatron for diamond deposition on Al2O3 ceramic substrates. Plasma surface treatments were conducted to improve deposition condition before processing for diamond deposition. The Al2O3 ceramic substrates deposited, $5{\times}15mm^2$, were investigated by Scanning Electron Microscopy (SEM), Fourier Transform Infrared Spectroscopy (FTIR) and X-ray Diffraction (XRD). Properties of diamond (111), (220) and (311) peaks were shown in XRD. We identified nanocrystalline diamond films on substrates. The results showed that deposition rate was approximately $2.2{\mu}m/h$ after plasma surface treatments. Comparing the above result with a common processing, deposition rate was improved. Also, the surface condition was improved more than a common processing for diamond deposition on Al2O3 ceramic substrates.

• International Journal of Precision Engineering and Manufacturing
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• v.9 no.1
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• pp.51-53
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• 2008

A new nano-particle deposition system (NPDS) was developed for a ceramic and metal coating process. Nano- and micro-sized powders were sprayed through a supersonic nozzle at room temperature and low vacuum conditions to create ceramic and metal thin films on metal and polymer substrates without thermal damage. Ceramic titanium dioxide ($TiO_2$) powder was deposited on polyethylene terephthalate substrates and metal tin (Sn) powder was deposited on SUS substrates. Deposition images were obtained and the resulting chemical composition was measured using X-ray photoelectron spectroscopy. The test results demonstrated that the new NPDS provides a noble coating method for ceramic and metal materials.

• Journal of Welding and Joining
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• v.18 no.6
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• pp.96-101
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• 2000

Sintered alumina ceramic substrate has been used for the insulating substrate for thick Hybrid IC owing to its cheapness and good insulating properties. Some of thick HIC's are important to eliminate the heat emitted from the parts that are mounted on the ceramic substrate. Sintered ceramic substrate can not transfer and emit the heat efficiently. It's been tried to do plasma spray coating of alumina ceramic on the metal substrates that have a good heat emission property. The most important properties to commercialize this ceramic coated metal substrate are surface roughness and deposition efficiency. In this study, plasma spray coating parameters are optimized to minimize the surface roughness and to maximize the deposition efficiency using Taguchi experimental method. By this optimization, the deposition efficiency was greatly improved from 35% at the frist time to 75% finally.

• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.460-465
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• 2013

Plate-shaped inorganic particles are coated onto a stainless steel substrate by the electrophoretic deposition of a precursor slurry which includes the inorganic particles of $Al_2O_3$ and polymer resin in mixed solvents to mimic the abalone shell structure, which is a composite of plate-shaped inorganic particles and organic interlayer binding materials with a layered orientation. The process parameters of the electrophoretic deposition include the voltage, coating time, and conductivity of the substrate. In addition, the suspension parameters are the particle size, concentration, viscosity, conductivity, and stability. We prepared an organic-inorganic composite coating with a high inorganic solid content by arraying the plate-shaped $Al_2O_3$ particles and electrophoretic resin via an electrophoretic deposition method. We analyzed the effect of the slurry composition and the electrophoretic deposition process parameters on the physical, mechanical and thermal properties of the coating layer, i.e., the thickness, density, particle orientation, Young's modulus and thermogravimetric analysis results.

• Particle and aerosol research
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• v.9 no.3
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• pp.127-132
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• 2013

Recently, Aerosol Deposition method has attracted considerable attention because of its advantages to produce ceramic coatings on various substrates at room temperature. This method is strongly dependent on the raw powder, which should have high mobility with carrier gas and moderate mechanical strength to be crushed onto the substrate. In this report, the effects of the ceramic granules' compressive strength on the ceramic coating formation are discussed. The ceramic granules were prepared by spray-drying method and heat treated at various temperatures. It was found that at the moderate mechanical strength of ceramic granules gave more effective film formation behavior during Aerosol Deposition method.

• Journal of the Korean Ceramic Society
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• v.44 no.3 s.298
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• pp.169-174
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• 2007

TRISO coated fuel particle is one of the most important materials for hydrogen production using HTGR (high temperature gas cooled reactors). It is composed of three isotropic layers: inner pyrolytic carbon (IPyC), silicon carbide (SiC), outer pyrolytic carbon (OPyC) layers. In this study, TRISO coated fuel particle layers were deposited through CVD process in a horizontal hot wall deposition system. Also the computational simulations of input gas velocity, temperature profile and pressure in the reaction chamber were conducted with varying process variable (i.e temperature and input gas ratios). As deposition temperature increased, microstructure, chemical composition and growth behavior changed and deposition rate increased. The simulation showed that the change of reactant states affected growth rate at each position of the susceptor. The experimental results showed a close correlation with the simulation results.

• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.533-538
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• 2013

Silicon carbide (SiC) materials are typical ceramic materials with a wide range of uses due to their high hardness and strength and oxidation resistance. In particular, due to the corrosion resistance of the material against acids and bases including the chemical resistance against ionic gases such as plasma, the application of SiC has been expanded to extreme environments. In the SiC deposition process, where chemical vapor deposition (CVD) technology is used, the reactions between the raw gases containing Si and C sources occur from gas phase to solid phases; thus, the merit of the CVD technology is that it can provide high purity SiC in relatively low temperatures in comparison with other fabrication methods. However, the product yield rarely reaches 50% due to the difficulty in performing uniform and dense deposition. In this study, using a computational fluid dynamics (CFD) simulation, the gas velocity inside the reactor and the concentration change in the gas phase during the SiC CVD manufacturing process are calculated with respect to the gas velocity and rotational speed of the stage where the deposition articles are located.

• Journal of the Korean Ceramic Society
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• v.35 no.8
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• pp.827-835
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• 1998

Blanket Copper films were chemically vapor deposited on six kinds for substrates for scrutinizing the change of characteristics induced by the difference of substrates and seeding layers. Both TiN/Si and {{{{ { SiO}_{2 } }}/Si wafers were used as-recevied and with the Cu-seeding layers of 40${\AA}$ and 160${\AA}$ which were produced by sputtering The CVD processes were exectued at the deposition temperatures between 130$^{\circ}C$ and 260$^{\circ}C$ us-ing (hfc)Cu(VTMS) as a precursor. The deposition rate of 40$^{\circ}C$ Cu-seeded substrates was higher than that of other substrates and especially in seeded {{{{ { SiO}_{2 } }}/Si substrate because of the incubation period reducing in-duced by seeding layer at the same deposition time and temperature. The resistivity of 160${\AA}$ Cu seeded substrate was lower then that of 40 ${\AA}$ because the nucleation and growth behavior in Cu-island is different from the behavior in {{{{ { SiO}_{2 } }} substrate due to the dielectricity of {{{{ { SiO}_{2 } }}.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1998.09a
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• pp.91-95
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• 1998

Selectivity of SiC deposition on a Si substrate partially covered with a masking material was investigated by introducing HCl gas into hexamethyldisilane/H2 gas system during the deposition. the schedule of the precursor and HCl gas flows was modified so that the selectivity of SiC deposition between a Si substrate and a mask material should be improved. It was confirmed that the selectivity of SiC deposition was improved by introducing HCl gas. Also, the pulse gas flow technique was effective to enhance the selectivity.

• Journal of the Korean Ceramic Society
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• v.37 no.2
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• pp.194-200
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• 2000

Sb-doped tin oxide films were deposited on Corning glass 1737 substrate by plasma enhanced chemical vapor deposition(PECVD) technique using a gas mixture of SnCl4/SbCl5/O2/Ar. The deposition behaviors of tin oxide films by PECVD were compared with those by thermal CVD, and effects of deposition temperature, r.f. power and Sb doping on the electrical properties of tin oxide films were investigated. PECVD technique largely increased the deposition rate and smoothed the surface of tin oxide films compared with thermal CVD. Electrical resistivity decreased with doping of Sb due to the increase of carrier concentration. However, large doping of Sb diminished carrier concentration and mobility due to the decrease of crystallinity, which resulted in the increase of electrical resistivity. As the deposition temperature and r.f. power increased, Cl content in the film decreased.