• Title/Summary/Keyword: Cleaning

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A Study of Cleaning Method of Excavated Gold Brocade (출토 직금직물의 세척방법에 관한 연구)

  • Hong, Moon-Kyung;Lee, Mee-Sik
    • Journal of the Korean Society of Clothing and Textiles
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    • v.34 no.7
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    • pp.1162-1174
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    • 2010
  • Excavated gold brocade, often shows signs of serious damage and contamination from environmental factors such as exposure to soil or human remains. Therefore, most of the conservation procedures are focused on the consolidation of the gold thread and on cleaning with water or organic solvents. Indiscreet cleaning using solvents could damage the gold leaf, which identifies the features of fabric. There is a need to develop cleaning protocols appropriate for relics through the careful analysis of the condition of the relics. This study finds the appropriate cleaning method for the excavated gold brocade. Four different cleaning methods, vacuum cleaning, kneaded rubber eraser cleaning, immersion wet cleaning, and absorption wet cleaning were applied to the excavated gold brocade. The degree of cleaning and damage were examined depending on the cleaning methods, changes to the physical condition (before and after cleaning) were also analyzed through the surface observation. Although immersion cleaning showed the best cleaning result, this method had a risk of damage to the gold thread. Absorption wet cleaning safely eliminated the various soluble contaminants and the rotten smell of relics. Kneaded rubber eraser was suitable for the excavated gold brocade fabric because it can be applied to selective parts, intentionally excluding some sensitive parts such as the gold thread. The vacuum cleaning method required special attention because of a possibility of suctioning off loosely attached gold leaf. Dual cleaning, the kneaded rubber eraser cleaning, followed by the absorption cleaning was the most effective method to preserve and clean excavated gold brocade.

A Study on Optical Analysis and Overprinting Sequence in 2-Color Solid Overprints (2색 중첩 민인쇄의 광학적 해석과 중첩인쇄 순서에 관한 연구)

  • 강상훈
    • Journal of the Korean Graphic Arts Communication Society
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    • v.15 no.2
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    • pp.1-4
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    • 1997
  • Existing cleaning solvent using screen printing are the organic solvents including aromatic compounds carried with poisonous and stench. besides, Cleaning method of current screen printing are for the most part mixed cleaning method of dipping and polish. Using 1,1,1-TCE, CFC-113 alternative system cleaning solvent be substituted for existing cleaning solvent against screen printing ink measured the cleaning efficiency according to gravimetric analysis method and property change of gassamer according to Image Analyzer. Also, Cleaning process system carry with excellent cleaning efficiency studied which was proposed new cleaning process including ultrasonic cleaning process be substituted for existing mixed cleaning method of dipping and polish.

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Design and Development of Fluidized Bed Cleaning System for on Heat Treatment Parts (I) - Design and Development the Experimental Fluidized Bed Cleaner and Experiments on its Cleaning Efficiency - (유동층을 이용한 열처리부품의 세정 시스템 설계 및 개발 (I) -유동층 이용 세정 실험장치 설계, 개발 및 실험 -)

  • Kim C.S.;Kim K.D.
    • Journal of Biosystems Engineering
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    • v.31 no.4
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    • pp.376-384
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    • 2006
  • This study was conducted to perform for comparative analysis of the cleaning efficiency on 3 kinds of cleaning liquid state, 3 steps of cleaning temperature $(45^{\circ}C,\;60^{\circ}C,\;70^{\circ}C,\;)$ and 6 steps of cleaning time (2.5, 5, 7.5, 10, 12.5, 15 minute). 3 kinds of cleaning liquid state are the non fluidized bed, liquid fluidized bed and liquid/solid fluidized bed. UV spectrophotometer was used in estimation of cleaning efficiency, which it is experimental equipment using the absorptiometric analysis method. Cleaning efficiency by cleaning time was increase from 2.5 minutes to 15 minutes, liquid/siolid fluidized bed was indicated the highest cleaning efficiency among the 3 kinds of cleaning liquid state and $70^{\circ}C$ of cleaning temperature at liquid/solid fluidized bed was indicated the highest cleaning efficiency as 98% among the 3 steps of cleaning temperature.

Surface Cleaning of a Wafer Contaminated by Fingerprint Using a Laser Cleaning Technology (레이저 세정기술을 이용한 웨이퍼의 표면세정)

  • Lee, Myong-Hwa;Baek, Ji-Young;Song, Jae-Dong;Kim, Sang-Bum;Kim, Gyung-Soo
    • Journal of ILASS-Korea
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    • v.12 no.4
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    • pp.185-190
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    • 2007
  • There is a growing interest to develop a new cleaning technology to overcome the disadvantages of wet cleaning technologies such as environmental pollution and the cleaning difficulty of contaminants on integrated circuits. Laser cleaning is a potential technology to remove various pollutants on a wafer surface. However, there is no fundamental data about cleaning efficiencies and cleaning mechanisms of contaminants on a wafer surface using a laser cleaning technology. Therefore, the cleaning characteristics of a wafer surface using an excimer laser were investigated in this study. Fingerprint consisting of inorganic and organic materials was chosen as a representative of pollutants and the effectiveness of a laser irradiation on a wafer cleaning has been investigated qualitatively and quantitatively. The results have shown that cleaning degree is proportional to the laser irradiation time and repetition rate, and quantitative analysis conducted by an image processing method also have shown the same trend. Furthermore, the cleaning efficiency of a wafer contaminated by fingerprint strongly depended on a photothermal cleaning mechanism and the species were removed in order of hydrophilic and hydrophobic contaminants by laser irradiation.

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Development of a Pool Cleaning Robot and its Cleaning Performance Evaluation (수영장 청소 로봇 개발 및 청소성능지표)

  • Kim, Jinhyuk;Kim, Jinhyun
    • The Journal of Korea Robotics Society
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    • v.7 no.4
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    • pp.243-251
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    • 2012
  • In this paper, developing of a pool cleaning robot is addressed. First, we analyze commercial pool cleaning robot mechanisms, and the merits and demerits of wireless version of a pool cleaning robot is introduced. And then the water-jet moving mechanism for a pool cleaning robot is proposed to improve energy efficiency and mechanical design advantage, which is one of the strong candidates for wireless pool cleaning robots. Next, the method of cleaning performance evaluation of pool cleaning robots is firstly defined with five key factors, and it was verified by experimental results. If the cleaning performance can be quantitatively defined, we can design optimally a pool cleaning robot, which results in the cost down.

A comparison of detergency and dimensional stability between wet cleaning and dry cleaning (물세탁과 드라이클리닝의 세탁성능과 형태안정성 비교)

  • Kwak, Soo-Kyung;Kim, Ah-Ri;Oh, Hwawon;Park, Myung-Ja
    • Journal of the Korea Fashion and Costume Design Association
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    • v.21 no.1
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    • pp.181-189
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    • 2019
  • The washability, redeposition, fill power, and fabric damage of wet cleaning and dry cleaning solvents were measured to identify the optimal type of washing that would increase washability while maintaining dimensional stability. The soiled fabric is a polyester cotton blend and the types of soil were wine, blood, make-up and sebum with carbon black. Petroleum and silicone solvents were used in dry cleaning. Results from this study are as follows. First, detergency is significantly influenced by the type of washing and type of soil. Wet cleaning is superior to dry cleaning. Wet cleaning shows a strong washing performance against hydrophilic soils, whereas, dry cleaning is stronger against hydrophobic soils. Second, redeposition is significantly affected by the type of washing, fabrics, and soils. Redeposition occurred little on cotton during wet cleaning, but showed a high rate for nylon. However, when the two types of fabric were dry cleaned, redeposition occurred on both types. Third, the fill power of duck-down is very affected by the type of washing. Resilience is the best in wet cleaning; and in dry cleaning, petroleum solvents showed a higher resilience when as compared to silicone solvents. Last, the level of fabric damage to cotton fabrics is highly influenced by the type of washing. Wet cleaning damages cotton fabrics significantly more than dry cleaning. For dry cleaning, petroleum solvents damage these fabrics slightly more than silicone solvents. In conclusion, the type of soil must initially be identified to determine the optimal type of washing. Special caution is required when textiles with particulate soil and nylon are washed. When considering the resilience of duck-down clothing, wet cleaning is more appropriate than dry cleaning. Dry cleaning, especially when using silicone-based solvents, is more suitable than wet cleaning for maintaining the shape of clothing.

A Method of Nonlinea Color Transform from CIE $L^{*}a^{*}b^{*}$ to CMY Value by Neural Network (신경망에 의한 CIE $L^{*}a^{*}b^{*}$-CMY의 비선형 색변환)

  • 서봉우
    • Journal of the Korean Graphic Arts Communication Society
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    • v.15 no.1
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    • pp.57-69
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    • 1997
  • The field of printing to use pressurized ink using screen gossamer that is called screen printing. Existing cleaning solvents for the screen printing are the organic solvents containing aromatic compounds and stench. Also, Cleaning method of screen printing are for the most part mixed cleaning method of dipping and polish. In this study, we measured the cleaning efficiency by gravimetric analysis and the property change of gossamer by image analyzer using existing cleaning solvent. Also, we investigated a new cleaning process showing excellent cleaning efficiency using the ultrasonic and vibration cleaning method instead of the exsiting mixed cleaning method.

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Effect of Brush Treatment and Brush Contact Sequence on Cross Contaminated Defects during CMP in-situ Cleaning

  • Kim, Hong Jin
    • Tribology and Lubricants
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    • v.31 no.6
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    • pp.239-244
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    • 2015
  • Chemical mechanical polishing (CMP) is one of the most important processes for enabling sub-14 nm semiconductor manufacturing. Moreover, post-CMP defect control is a key process parameter for the purpose of yield enhancement and device reliability. Due to the complexity of device with sub-14 nm node structure, CMP-induced defects need to be fixed in the CMP in-situ cleaning module instead of during post ex-situ wet cleaning. Therefore, post-CMP in-situ cleaning optimization and cleaning efficiency improvement play a pivotal role in post-CMP defect control. CMP in-situ cleaning module normally consists of megasonic and brush scrubber processes. And there has been an increasing effort for the optimization of cleaning chemistry and brush scrubber cleaning in the CMP cleaning module. Although there have been many studies conducted on improving particle removal efficiency by brush cleaning, these studies do not consider the effects of brush contamination. Depending on the process condition and brush condition, brush cross contamination effects significantly influence post-CMP cleaning defects. This study investigates brush cross contamination effects in the CMP in-situ cleaning module by conducting experiments using 300mm tetraethyl orthosilicate (TEOS) blanket wafers. This study also explores brush pre-treatment in the CMP tool and proposes recipe effects, and critical process parameters for optimized CMP in-situ cleaning process through experimental results.

A Study on Ozone Micro Bubble Effects for Solar Cell Wafer Cleaning (신개념 태양전지 세정용 오존마이크로 버블에 관한 연구)

  • Yoon, Jong-Kuk;Koo, Kyung-Wan
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.61 no.1
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    • pp.94-98
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    • 2012
  • The behavior of ozone micro bubble cleaning system was investigated to evaluate the solution as a new method of solar cell wafer cleaning in comparison with former conventional RCA cleaning. We have developed the ozone dissolution system in the ozonated water for more efficient cleaning conditions. The optimized cleaning conditions for solar cell wafer process were 10 ppm of ozone concentration and 12 minutes in cleaning periods, respectively. We have confirmed the cleaning reliability and cell efficiencies after ozone micro bubble cleaning. Using this new cleaning technology, it was possible to obtain higher efficiency, higher productivity, and fast tact time for applying cleaning in the fields on bare ingot wafer, LED wafers as well as the solar cell wafer.

The Study on Wafer Cleaning Using Excimer Laser (엑사이머 레이저를 이용한 웨이퍼 크리닝에 관한 고찰)

  • 윤경구;김재구;이성국;최두선;신보성;황경현;정재경
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • pp.743-746
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    • 2000
  • The removal of contaminants of silicon wafers has been investigated by various methods. Laser cleaning is the new dry cleaning technique to replace wafer wet cleaning in the near future. A dry laser cleaning uses inert gas jet to remove contaminant particles lifted off by the action of a KrF excimer laser. A laser cleaning model is developed to simulate the cleaning process and analyze the influence of contaminant particles and experimental parameters on laser cleaning efficiency. The model demonstrates that various types of submicrometer-sized particles from the front sides of silicon wafer can be efficiently removed by laser cleaning. The laser cleaning is explained by a particle adhesion model. including van der Waals forces and hydrogen bonding, and a particle removal model involving rapid thermal expansion of the substrate due to the thermoelastic effect. In addition, the experiment of wafer laser cleaning using KrF excimer laser was conducted to remove various contaminant particles.

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