• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.97-103
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• 2008

In this investigation, conductivity of conductive inks was measured. A particular attention has been given to the effect of metal powders with various conductivity on the overall conductivity of the bulk ink. The conductivity of various solutions simulating conductive inks consisting of copper and silver was measured and the results have been discussed in relation to various applications of conductive inks in practice. A conductivity model simulating systems consisting of various materials has been introduced and the results were discussed. Materials of good conductivity are adversely affected by mixing with materials of poor conductivity simply through serial connection. However, parallel connection has rather little effect on the overall conductivity. The practical implication of various mixtures of materials on conductive inks has been discussed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.371-374
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• 2007

A method for metal nano powder imprinting is proposed as a patterning process for conductive tracks that is inexpensive and scalable down to the nanoscale. Conductive tracks with line widths of $0.5{\sim}20{\mu}m$ were fabricated using this method. The processing conditions were optimized to avoid various types of defects, and to increase the degree of sintering and electric conductivity of the imprinted conductive tracks. The mean electric resistivity of the conductive tracks imprinted under optimum conditions was $8.95{\mu}{\Omega}{\cdot}cm$, which is in the range required for practical applications.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.217-220
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• 2009

Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

• Journal of the Korean Society of Safety
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• v.28 no.3
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• pp.63-68
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• 2013

This paper is aimed to make an analysis on characteristics of the parallel arc waveform and RMS of current at the electrical tracking state by conductive powder. In order to achieve the goal in this paper, field state investigation at metal processing companies in Chung-Nam province area was conducted. With the field state investigation, conductive powder were collected from metal processing companies. By experiment on electrical connector(breaker, connector) over which the conductive powder were scattered, arc waveform and RMS of current were measured. The measured waveform and RMS(root-mean-square) of current were analyzed to describe characteristics and patterns of electrical arc by the conductive powder. It was proved that conductive powder on electrical connector can flow electrical current enough to make electrical fire with high thermal energy. Also the change of sine waveform and RMS of current can be used to find out relationship between electrical fire and fault signal by conductive powder. The results obtained in this paper will be very helpful for the prevention of electrical fires occurred at the metal processing companies.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.2.3-2.3
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• 2011

With increased interest in printed devices, various metal nano inks have been investigated as candidates materials for printed electrodes and wiring as well as conductive film substituting photo-lithography process. Recent advances in organic conductive polymer allow us to fabricate high performance printed device. Meanwhile, there was several attempts to fabricate conductive films by mixing conductive polymer with metal nano-particle or nano-wires. The presence of Ag nanowires in conductive polymer mixture have shown good potential in organic photovoltaic devices.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.6
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• pp.96-102
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• 2000

The finishing process for dies and molds is an important process because it has influence on final quality of products. And it is difficult to automatize finishing process so that the process has depended on expert's skill until now. However, recently a study on development of die automatic finishing machine has been progressed, and actually this machine is applied to fabrication of die. But the research about tooling system is not enough and finishing tool must have high machining efficiency and adaptability of curved surface. So, this study investigated the application of conductive elastic tool which is composed of metal-resin bonded pellet and elastic backing material. The metal-resin bonded pellet is used to finish the surface by conventional mechanical grinding or electro-chemial grinding method. And elastic backing material is used to follow the curved surface. So conductive elastic tool has long lifetime, uniform removal rate and adaptability of curved surface.

• Design & Manufacturing
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• v.10 no.3
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• pp.14-19
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• 2016

Thermally or electrically conductive filler reinforced polymer composites are extensively being developed as the demand for light weight material increases rapidly in industiral applications need good conductivity such as heat sink of the electronics or light. Carbon or ceramic materials like graphite, carbon nanotube or boron nitride are typical conductive fillers with good thermal or electical conductivity. Using these conductive fillers, the polymer composites in the market show wide range of thermal conductivity from approximately 1 W/mK to 20 W/mK, which is quite enhanced considering the thermal conductivity lower than 0.5 W/mK for most polymeric materials. The practical use of these composites, however, is yet limited to specific applications because most composites are still not conductive enough or too difficult to process, too brittle, too expensive for higher conductivity. For practical use of conductive composite, the thermal conductivity required depending on the heat releasing mode are studied first for simplified unit cooling geometry to propose thermal conductivities of the composites for reasonable cooling performance comparing with the metal heat sink as a reference. Also, as a practical design for heat sink based on polymer composite, composite and metal sheet hybrid structures are investigated for LED lamp heat sink and audio amplication module housing to find that this hybrid structure can be a good solution considering all of the cooling performance, manufacturing, mechanical performance, cost and weight.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.125-126
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• 2008

• Journal of Fashion Business
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• v.22 no.4
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• pp.118-129
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• 2018

The purpose of this study is to develop ECG electrode materials for the heart rate monitoring smart band, a smart device used for ECG and heart rate measurement. The purpose of the evaluation is to assess properties and conductivity of electrodes of the existing heart rate monitoring smart band, and to determine suitability through a representative conductive sample. Because level of thickness does not differ significantly from value of conductive specimen from thickness of the smart band, it can be used as a conductive electrode. Surface conductivity of conductive samples and smart bands, is expected to be available as electrodes except for conductive film. Also, since the knit have conductivity only in the metal processing layer, it is necessary to use electrodes on the part of the metal processing layer that is conductive when applying the knit. Tensile strength and electrical conductivity of the tensile were generally revealed to have a tendency. Thickness of the specimen that can be used as an electrode for the smart band is suitable for all samples, electrical resistance, conductive woven, conductive knit, and conductive cord. In the case of conductive cord, however, the electrode attached to the human body will not conform to the flat shape of the electrode attached to the human body. Therefore, the conductive woven and the conductive knit will be available as an electrode.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1076-1077
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• 2006

Conductive pastes consist of conductive fillers( Au, Ag, Ni, Cu etc.), organic binders, solvents and additives. Meanwhile, there are some metal powders such as copper, nickel etc that are used for pastes which have serious surface corrosion problems. This problem leads to change of the color and decrease in conductivity and affect storage stability of conductive pastes. By using silane coupling agent and dispersion agent, we can ensure both the corrosion stability and long term storage stability, and enhance the high performance electrical and mechanical properties of EMI shielding silicone sealant.