• Journal of the Korean Chemical Society
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• v.51 no.2
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• pp.171-177
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• 2007

Polymer-based electrically conductive pastes have been used to make the conductive paths between voltage sources and devices. The pastes used for these applications consist of two main components: a polymer binder and a conductive filler. Having both low viscosity and good metal-encapsulating properties, cellulose acetate butyrate (CAB) was regarded to be a good candidate as a binder for the conductive paste. We have prepared a formulation for a novel conductive paste based on CAB. Preliminary studies showed that this conductive paste revealed stable conductivity, together with uniform coating and flexibility.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.957-958
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• 2008

• Composites Research
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• v.35 no.2
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• pp.69-74
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• 2022

In this study, the conductive paste used in a wide range such as wiring in the electronic packaging field, the automobile industry, and electronic products is manufactured under various process conditions due to the simplicity of the process, and then the thermal, mechanical, and electrical characteristics are analyzed and simulation studies are conducted to optimize the process. to establish the conditions of the conductive paste manufacturing process. First, a conductive paste was prepared by setting various types of binder resin, an essential component of the conductive paste, and characteristics such as thermal conductivity, tensile strength, and elongation were analyzed. Among the binder resins, the conductive paste applied with a flexible epoxy material had the best physical properties, and a simulation study was conducted based on the physical property data base of the conductive face. As a result of the simulation, the best physical properties were exhibited when the Ag flake volume fraction was 60%.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.721-722
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• 2008

• ETRI Journal
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• v.33 no.6
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• pp.864-870
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• 2011

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.51-54
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• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1908-1912
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• 2008

Conductive polymers, prepared by mixing electrically conductive fillers with a suitable polymeric formulation, are widely used in applications such as interconnecting materials for high density electronic packaging. However, resins of conductive pastes used as binders and vehicles are generally nonconductive, so that they may prevent the electrical contact between conductive fillers and reduce electron transmission. In this study, we improved conductivity of silver paste by the incorporation of cabon nanotubes. It is important to achieve homogeneous dispersion of CNTs to act as reinforcements efficiently in matrix. We carried out acid treatment on nanotubes for their homogeneous dispersion in silver/conducting polymer matrix. The dispersion states of nanotubes were characterized by raman spectra and filed emission scanning electron microscope. The electrical resistivity of CNTs incorporated silver paste was also measured by 4-point probe method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.154-154
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• 2008

Although the screen printing technology using photosensitive carbon nanotube (CNT) paste has many advantages such as low cost, simple process, uniform emission, and capability of mass production, the CNT paste needs to be improved further in CNT dispersion, printability, adhesion, electrical conductivity, population of CNT emitters, etc. Ball milling has been frequently employed to prepare the CNT paste as ball milling can mix its ingredients very well and easily cut the long, entangled CNTs. This study carried out a parametric approach to fabricating the CNT paste in terms of low-energy ball milling and a paste composition. Field emission properties of the CNT paste was characterized with CNT dispersion and electrical conductivity which were measured by a UV-Vis spectrophotometer and a 4-point probe method, respectively. Main variables in formulating the CNT paste include a length of milling time, and amounts of CNTs and conductive inorganic fillers. In particular, we varied not only the contents of conductive fillers but also used two different sizes of filler particles of ${\mu}m$ and nm ranges. Among many variations of conductive fillers, the best field emission characteristics occurred at the 5 wt% fillers with the mixing ratio of 3:1 for ${\mu}m$-and nm-sizes. The amount and size of fillers has a great effect on the morphology, processing stability, and field emission characteristics of CNT emitter dots. The addition a small amount of nm-size fillers considerably improved the field emission characteristics of the photosensitive CNT paste.

• Korean Journal of Clinical Laboratory Science
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• v.56 no.1
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• pp.85-88
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• 2024

Electroencephalography (EEG) is a test that diagnoses epilepsy and measures brain function. During EEG, the space between the electrode and the skin is filled with a conductive paste to reduce the impedance between the electrode and the scalp, which helps measure the EEG signals. This study compared the artifacts of the two representative conductive pastes (Ten20 and Elefix). The artifacts, noise, and satisfaction were surveyed after using the two conductive pastes. The two conductive pastes had similar artifacts and noise, but the survey results showed that the Elefix conductive paste had better satisfaction and adhesion. This result may be explained by the imprinting effect according to the experience of using the Elefix conductive paste first in the EEG class. Hence, further research is needed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.384-385
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• 2006

We studied about conductive pastes of the source-drain contacts for OTFTs(organic thin-film transistors) fabricated by direct printing(screen printing) method. We used Ag and conductive carbon black powder as the conductive fillers of pastes. The conductive pastes were manufactured by various dispersing agents and dispersing conditions and source-drain contacts with $100{\mu}m$ of channel length were fabricated. We could obtain the OTFTs which exhibited different field-effect behaviors over a range of source-dram and gate voltages depending on a kind of conductive fillers used conductive pastes.