• Communications for Statistical Applications and Methods
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• v.7 no.2
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• pp.435-446
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• 2000

Statistical process control(SPC) and engineering process control(EPC) are two strategies for quality improvement that have been developed independently. EPC seeks to minimize variability by adjusting compensatory variables in order to make the process level close to the target, while SPC seeks to reduce variability by monitoring and eliminating causes of variation. One purpose of this paper is to propose the IMA(0,1,1) model as the in-control process model. For the out-of-control process model we consider two cases; one is the case with a step shift in the level, and the other is the case with a change in the nonstationarity. Another purpose is to suggest the use of an integrated process control procedure with adjustment and monitoring, which can consider the proposed process model effectively. An integrated control procedure will improve the process control activity significantly for cases of the proposed model, when compared to the procedure of using either EPC or SPC, since EPC will keep the process close to the target and SPC will eliminate special causes.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.26 no.1
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• pp.7-16
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• 2003

At present, company has to produce a product that consumer like with a competitive price, a good quality, and a fitting time to supply. Process control and quality control are very important to supply with a product uniformly and inexpensively. Process control is given much weight in the quality control in manufacturing system. Statistical process controls(SPC) that are used in process generally have major impact on manufacturing, product design activities, and process development potentially. Control charts in statistical process control method can be interpreted the data from quality characteristics in production process and discriminated between chance variation and assignable variation in process. In addition, control chart can be used to monitor the process output and detect when changes in the inputs are required to bring the process back to an in-control state. The models that relate the influential inputs to process outputs help determine the nature and magnitude of the adjustments required. In this paper, the characteristic of product quality is monitored by control chart during the machining process and construction of quality control cycle is considered to divide into two types in this case that different assignable causes lead to shifts having different magnitudes. Then we are intended to find a process shift magnitude which has economical quality cost policy and are considered to quality cost functions to find a process shift magnitude. Those costs are categorized into the well-known categories of prevention, appraisal, and internal failure and external failure. This paper ends with numerical examples that demonstrate the usefulness of the model.

• Industrial Engineering and Management Systems
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• v.12 no.2
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• pp.112-117
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• 2013

The $\overline{x}$ control chart for the process mean and either the R or s control chart for the process dispersion have been used together to monitor the manufacturing processes. However, it has been pointed out that this procedure is flawed by a fault that makes it difficult to capture the behavior of process condition visually by considering the relationship between the shift in the process mean and the change in the process dispersion because the respective characteristics are monitored by an individual control chart in parallel. Then, the ($\overline{x}$, s) control chart has been proposed to enable the process managers to monitor the changes in the process mean, process dispersion, or both. On the one hand, identifying which process parameters are responsible for out-of-control condition of process is one of the important issues in the process management. It is especially important in the ($\overline{x}$, s) control chart where some parameters are monitored at a single plane. The previous literature has proposed the multiple decision method based on the statistical hypothesis tests to identify the parameters responsible for out-of-control condition. In this paper, we propose how to identify parameters responsible for out-of-control condition using the information criterion. Then, the effectiveness of proposed method is shown through some numerical experiments.

• Korean Management Science Review
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• v.31 no.3
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• pp.27-39
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• 2014

We derive a generalized statistic form of Q control chart, which is especially suitable for short run productions and start-up processes, for the detection of process mean shifts. The generalization means that the derived control chart statistic concurrently uses within lot variability and between lot variability to explain the process variability. The latter variability source is noticeably prevalent in lot type production processes including semiconductor wafer fabrications. We first obtain the generalized Q control chart statistic when both the process mean and process variance are unknown, which represents the case of implementing statistical process control charting for short run productions and start-up processes. Also, we provide the corresponding generalized Q control chart statistics for the rest of three cases of previous Q control chart statistics : (1) both the process mean and process variance are known (2) only the process mean is unknown and (3) only the process variance is unknown.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.9
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• pp.875-880
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• 2015

Traditional semiconductor process control has been performed through statistical process control techniques in a constant process-recipe conditions. However, the complexity of the interior of the etching apparatus plasma physics, quantitative modeling of process conditions due to the many difficult features constraints apply simple SISO control scheme. The introduction of the Advanced Process Control (APC) as a way to overcome the limits has been using the APC process control methodology run-to-run, wafer-to-wafer, or the yield of the semiconductor manufacturing process to the real-time process control, performance, it is possible to improve production. In addition, it is possible to establish a hierarchical structure of the process control made by the process control unit and associated algorithms and etching apparatus, the process unit, the overall process. In this study, the research focused on the methodology and monitoring improvements in performance needed to consider the process management of future developments in the semiconductor manufacturing process in accordance with the age of the APC analysis in real applications of the semiconductor manufacturing process and process fault diagnosis and control techniques in progress.

• Communications for Statistical Applications and Methods
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• v.7 no.3
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• pp.773-788
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• 2000

Statistical process control (SPC) and engineering process control (EPC) are based on different strategies for processes quality improvement. SPC reduces process variability by detecting and eliminating special causes of process variation. while EPC reduces process variability by adjusting compensatory variables to keep the quality variable close to target. Recently there has been needs for a process control proceduce which combines the tow strategies. This paper considers a combined scheme which simultaneously applies SPC and EPC techniques to reduce the variation of a process. The process model under consideration is an integrated moving average(IMA) process with a step shift. The EPC part of the scheme adjusts the process back to target at every fixed monitoring intervals, which is referred to a repeated adjustment scheme. The SPC part of the scheme uses an exponentially weighted moving average(EWMA) of observed deviation from target to detect special causes. A Markov chain model is developed to relate the scheme's expected cost per unit time to the design parameters of he combined control scheme. The expected cost per unit time is composed of off-target cost, adjustment cost, monitoring cost, and false alarm cost.

• Journal of Korea Society of Industrial Information Systems
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• v.15 no.1
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• pp.47-57
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• 2010

There have been many problems to apply SPC(Statistical Process Control) which is a traditional process control technology to the process of multi-product, small-sized production because a machine in the process manufactures small numbers, but various kinds of products. Therefore, we need the new process control system that can flexibly control the process by setting up the SPEC rules and the KNOWHOW rules. The SPEC rule contains the combination of diverse conditions to specify the characteristics of various products. The KNOWHOW rule is based on engineers' know-how. The study suggests the Rule-base Process Control that can be optimized to the multi-product, small-sized production. It was validated in the process of semiconductor production.

• International Journal of Quality Innovation
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• v.1 no.1
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• pp.97-105
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• 2000

In this paper, a two-section method for measuring is introduced and the variation sources of measurement process are analysed. Measuring is a special process in general process. Various variation source must be firstly decomposed so that the statistical distribution law of measuring process can be established, and then implement monitoring control of the measuring process. A special method to obtain the measuring variation is discussed, and a monitoring control technique for measuring process is studied based statistical distribution. Towards the end, we briefly introduce software design for the analysis and control of a measurement process.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.403-407
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• 2005

This paper proposes a looperless tension control algorithm which is robust to disturbance and tensional variation in rolling process using SVR(Support Vector Regression). Hot rolling process which is global technology to coil steel after continuous finishing process for welded bars followed by roughing mill process, becomes hot issue. Finishing mill process not only makes it possible to produce ultra thin steel strip(0.8 mm) but enhance the quality of terminals of coil, which increases the productivity due to faster process. Constant tension control between stands in hot rolling process is essential to enhance the quality of steel. Sensorless tension control is under research by some advanced companies to replace the conventional tension control method because in continuous finishing mill process, it is impossible to install the looper used in conventional control system. Simulation results show the effectiveness of the proposed algorithm.

• 제어로봇시스템학회:학술대회논문집
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• 1991.10b
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• pp.1950-1955
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• 1991

A fuzzy dynamic learning controller is proposed and applied to control of time delayed, non-linear and unstable chemical processes. The proposed fuzzy dynamic learning controller can self-adjust its fuzzy control rules using the external dynamic information from the process during on-line control and it can create th,, new fuzzy control rules autonomously using its learning capability from past control trends. The proposed controller shows better performance than the conventional fuzzy logic controller and the fuzzy self organizing controller.