• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.11
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• pp.26-32
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• 2014

In electrolysis smelting plants that using high DC current, the bus bar is most important facility for delivering the high current. The copper made bus bar is widely used for various advantages as good electrical and thermal conductivity, resonable malleability, ductility, and not rust easily. However, when high current in copper bus bar, temperature rises and maximum allowable current capacity is restricted by temperature of bus bar. In this paper, we investigated temperature variation of copper bus bar by putting cooling water channel imposed to bus bar construction. For the validity, various simulations were carried out.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.11a
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• pp.45-53
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• 2001

Copper bus-bar is made by drawing process and used in many part of industry. When design drawing die for copper bus-bar, design factor is focused on the deformation of die-land by drawing force and shrink fit. In this paper, to determine shrink fit value is analyzed by automatic shrink fit analysis program, APDL/UIDL language in a commercial FEM package, ANSYS, has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process and by using DEFORM software for drawing process analysis. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the drawing die design. The stress analysis of the dies is used to determine optimized dimension of die-land.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.4
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• pp.82-88
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• 2002

Copper bus-bar is made by drawing process and used in many part of industry. Ohen design drawing die for copper bus-bar, design factor is focused on the deformation of die-land by drawing force and shrink fit. In this paper it is analyzed to determine shrink fit value by shrink fit analysis program which is used with APDL/UIDL language in a commercial FEM package, ANSYS. The shrink fit analysis has been developed that enables optimal desist of the dies taking into account the elastic deflections. Elastic deflection is generated in shrink fitting the die inserts and that caused by the stresses generated using DEFORM software for drawing process analysis. This data can be processed as load input data fir a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the drawing die design. The stress analysis of the dies is used to determine optimized dimension of die-land.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.61 no.4
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• pp.220-224
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• 2012

The analysis on the bus bar effect is conducted to develop a cost effective 24kV/2,000A switchgear. The temperature enclosures and bus bars could rise due to several heat sources such as eddy current losses and copper losses. Therefore, a study on the characteristics of the electric field intensity and electromagnetic loss according to the bus bar size in a bus bar compartment is essential to design a electrically reliable high voltage switchgear. It is investigated that the electromagnetic influence to the temperature rising and the dielectric stability according to various bus bar sizes by using finite element method(FEM). The electric field intensity and electromagnetic loss according to various bus bar sizes are calculated to design a reliable and a high voltage switchgear. As results, it is found that the electromagnetic loss and the dielectric stability of bus bar could be determined by a bus bar size. It means that a cost effective 24kV/2,000A high voltage switchgear could be developed by selecting the proper size of a bus bar. Also, it is recognized that the electromagnetic characteristics according to various bus bar sizes in order to design an electrically stable high voltage switchgear when the enclosure size is determined as a fixed value. Futhermore, studies on the various nominal voltage class and bus bar sizes will be conducted to develop a cost effective high voltage switchgear.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.166-171
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• 2001

Copper bus-bar is made by drawing process and used in many part of industry. When design drawing die for copper bus-bar, design factor is focused on the deformation of die-land by drawing force and shrink fit. In this paper, to determine shrink fit value is analyzed by automatic shrink fit analysis program, APDL/UIDL language in a commercial FEM package, ANSYS, has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process and by using DEFORM software for drawing process analysis. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the drawing die design. The stress analysis of the dies is used to determine optimized dimension of die-land.

• The Transactions of the Korean Institute of Electrical Engineers A
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• v.55 no.8
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• pp.334-340
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• 2006

Copper is widely used in electric wire, cable, conductor in electric devices. As the demand for electric power is increasing rapidly, electric power devices are getting amazingly bigger and complicated. The using of light-weight conductor can reduce the size and making cost of the electric devices. In high-frequency application, Electric current in a conductor tends to shift to the surface of the conductor, resulting in an uneven current distribution in the inner conductor. In the extreme case the current may essentially concentrate in the 'skin' of the inner conductor as a surface current. In high frequency application, therefore, inner area of copper conductor may replace with aluminum conductor, which reduces the weight of conductor. This paper describes the manufacture and evaluation of composite conductors made of copper and aluminum. The optimum extruding ratio was 16 at $300^{\circ}C$. The electrical resistance of manufactured composite bus bar was $57{\mu}{\Omega}$ at DC and $49.5{\mu}\{Omega}$ at 300Hz.

• Journal of Welding and Joining
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• v.31 no.6
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• pp.58-64
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• 2013

Several joining methods involving resistance welding, laser welding, ultrasonic welding and mechanical joining are currently applied in manufacturing lithium-ion batteries. Cu and Al alloys are used for tab and bus bar materials, and laser welding characteristics for these alloys were investigated with similar and dissimilar material combinations in this study. The base materials used were Al 1050 and oxygen-free Cu 1020P alloys, and a disk laser was used with a continuous wave mode. In bead-on-plate welding of both alloys, the joint strength was higher than the strength of O tempered base material. In overlap welding, the effect of welding parameters on the tensile shear strength and bead shape was evaluated. Tensile shear strength of overlap welded joint was affected by interfacial bead width and weld defect formation. The tensile-shear specimen was fractured at the heat affected zone by selecting proper laser welding parameters.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.58.1-58.1
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• 2010

In solar cell module manufacturing, single solar cells has to be joined electrically to strings. Copper stripes coated with tin-silver-copper alloy are joined on screen printed silver of solar cells which is called busbar. The bus bar collects the electrons generated in solar cell and it is connected to the next cell in the conventional module manufacturing by a metal stringer using conventional hot air or infrared lamp soldering systems. For thin solar cells, both soldering methods have disadvantages, which heats up the whole cell to high temperatures. Because of the different thermal expansion coefficient, mechanical stresses are induced in the solar cell. Recently, the trend of solar cell is toward thinner thickness below 180um and thus the risk of breakage of solar cells is increasing. This has led to the demand for new joining processes with high productivity and reduced error rates. In our project, we have developed a new method to solder solar cells with a laser heating source. The soldering process using diode laser with wavelength of 980nm was examined. The diode laser used has a maximum power of 60W and a scanner system is used to solder dimension of 6" solar cell and the beam travel speed is optimized. For clamping copper stripe to solar cell, zirconia(ZrO)coated iron pin-spring system is used to clamp both joining parts during a scanner system is traveled. The hot plate temperature that solar cell is positioned during lasersoldering process is optimized. Also, conventional solder joints after $180^{\circ}C$ peel tests are compared to the laser soldering methods. Microstructures in welded zone shows that the diffusion zone between solar cell and metal stripes is better formed than inIR soldering method. It is analyzed that the laser solder joints show no damages to the silicon wafer and no cracks beneath the contact. Peel strength between 4N and 5N are measured, with much shorter joining time than IR solder joints and it is shown that the use of laser soldering reduced the degree of bending of solar cell much less than IR soldering.