• 마이크로전자및패키징학회지
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• 제19권4호
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• pp.39-43
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• 2012

Via-filling plating and through-hole plating are absolutely imperative for manufacturing of printed-wiring board. This Paper is introducing the latest developments of our company worked on the high-performance of acid copper plating additives for them.

• 마이크로전자및패키징학회지
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• 제11권4호
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• pp.75-80
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• 2004

In copper metallization, resistivity of copper seed layer is very important. Conventionally MOCVD has been used for this purpose however electroless copper plating is simple process and the resistivity of copper deposit is less than that of copper prepared by MOCVD. In this study electroless copper plating was conducted on different substrate to find optimum conditions of electroless copper plating for electronic applications. To find optimum conditions, the effects and selectivity of activation method on several substrates were investigated. The effects of copper bath composition on morphology were investigated. The effects of pH and stabilizer on deposition rate were also investigated. The optimum pH of the bath was 12 with addition of stabilizer. The resistivity of copper was decreased with addition of stabilizer and alter heat treatment.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.1-6
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• 2016

In this article, the recent developments in electroless plating of copper, electroless bath formulation and effect of plating parameters have been reviewed. Cyanide free electroless baths are now being developed and studied due to the various environmental concerns. Various organic chemicals such as complexing agents, reducing agents, and additives such as poly-alcohols and aromatic ring compounds have been added to copper plating baths for promising results. The effects of various reducing and complexing agents, bath conditions like additives, bath pH, and composition have been summarized. Finally the applications of the electroless plating of copper and latest developments have been overviewed for further guidance in this field.

• 한국분말재료학회지
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• 제16권2호
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• pp.131-137
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• 2009

This paper deals with the effects of the surfactant and preplate process (sensitization and activation) on electroless copper plating on carbon nano-fiber (CNF). Ultrasonic irradiation was applied both during dispersion of CNF and during electroless plating containing preplate process. The dispersion of CNF and flatness of the plated copper film were discussed based on the changes in surfactant concentration and preplate process time. It was clearly shown that high concentration of surfactant and long time of preplate process could promote the agglomeration of CNF and uneven copper plating on CNF.

• 공업화학
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• 제33권6호
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• pp.574-580
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• 2022

Dendrite 형태의 구리 입자 표면을 은으로 무전해 도금을 하는 과정에서, 치환도금(displacement plating)과 화학 환원도금(reducing electroless plating)을 병용하여 다양한 silver-coated copper (Ag@Cu) 입자들을 제조하였다. Ag@Cu 입자들의 물리화학적 특성은 SEM-EDS, TGA, XPS, XRD 및 BET 등으로 분석하였으며, 환원반응에 의하여 코팅되는 은은 구리 입자 표면에 나노 입자 형태로 형성되는 것을 확인할 수 있었다. Ag@Cu 입자들을 에폭시 수지와 복합화하여 도전성 필름을 제조하고 그의 열적 안정성을 평가하였다. 치환 반응과 환원 반응의 차이가 Ag@Cu 필름의 초기 저항 및 열적 안정성에 미치는 영향에 관하여 연구하였다.

• 대한금속재료학회지
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• 제47권2호
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• pp.79-90
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• 2009

A study has been made about the effects of powder content, reaction temperature, reaction time, and stirring speed on the preparation of the stainless steel(STS) 304L powders plating with copper by an electroless plating method. The behavior of corrosion resistance of the sintered STS-Cu composite powders was also investigated by the salt spraying test The electroless plating technique was an effective method to manufactur the copper-uniform plating composite powders, the corrosion resistance of this sintered specimen was improved bysuppressing Cr precipitates on grain boundaries in the sintered compacts of composite powders.

• 한국표면공학회지
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• 제47권1호
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• pp.1-6
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• 2014

The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. $NH_4OH$ and $NH_4NO_3$ were used as inorganic additives. The copper layer characteristics - tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and Universal Test Machine. The presence of ammonium nitrate results in reduction of average roughness value from $0.08{\mu}m$ to $0.03{\mu}m$. In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodeposit copper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when adding ammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111), (200) and (220) - and crystallite size (2~30 nm).

• 한국표면공학회지
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• 제50권4호
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• pp.244-250
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• 2017

Effects of plating conditions (dispersant concentration, plating time, and ultrasonication) on electroless Cu plating on SiC fabric woven by crossing of SiC continuous fibers vertically were studied. The ultrasonic dispersion treatment not only did not improve the dispersion of the SiC fibers, but also did not change the plating thickness. The ultrasonication in the pretreatment step of electroless plating did not improve the dispersion of the fibers, while the ultrasonication in the plating step enhanced the dispersion of the fibers and decreased the thickness of the Cu films. It was possible to control the thickness of the Cu coating layer as well as the dispersion of the fibers in the fabric by changing the plating conditions such as dispersant concentration, plating time, and ultrasonication, but it was very difficult to coat copper on the intersection of vertical fibers in the fabric.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.17-21
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• 2008

Sn-Cu계 솔더 범프에서 무전해도금법을 이용한 범프 형성에 대한 연구를 하였다. $20{\mu}m$ via에 전기도금법으로 구리를 채운 웨이퍼 위에 ball형태의 범프를 형성하기 위하여 구리와 주석을 도금하여 약 $10{\mu}m$높이의 범프를 형성하였다. 구리 범프 형성 시 via위에 선택적으로 도금하기 위하여 활성화 처리 후 산세처리를 실시하고 무전해 도금액에 안정제를 첨가하였다. 무전해도금법을 이용하여 주석 범프 형성 시 도금층이 구리 범프에 비해 표면의 균일도가 벌어지는 것으로 관찰되었지만 reflow공정을 실시한 후 ball 형태의 균일한 Sn-Cu 범프를 형성하였다.

• Korean Chemical Engineering Research
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• 제45권4호
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• pp.384-390
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• 2007

본 연구는 $CO_2$ 초임계 유체를 도금액과 혼합하여 PET 필름 위에 무전해 구리도금을 실시하였으며 초임계 유체의 혼용조건에 따른 그 도금 효과를 비교하였다. 이산화탄소 초임계 유체와 도금액의 부피비는 1:9가 최적이였으며 초임계 유체가 10 vol% 이상이 되면 혼합액의 분산성이 불량해져 층분리가 발생하였다. 구리 무전해도금은 $25^{\circ}C$, 15 MPa 에서 수행된 구리막의 표면물성이 가장 균일하였다. 무전해 구리도금에서 도금액과 혼합시킨 초임계 유체의 역할은 단순히 용해도를 높여 주는 것이 아니라 도금막을 구성하는 구리입자를 1차 입자상태로 분산, 유지시킴을 확인하였다.