• 제목/요약/키워드: Cu-In

검색결과 11,384건 처리시간 0.042초

Sulfanilamide유도체의 동(II)착화합물에 대한 생물약제학적 연구 (Biopharmaceutical studies on copper(II) chelates of sulfanilamide derivatives)

  • 김재백
    • 약학회지
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    • 제15권2호
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    • pp.41-52
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    • 1971
  • Cu(II) chelates of several sulfanilamide derivatives (Sulfa-Cu) were prepared and their effects on solubility, absorptivity in intestinal lumen, biding tendency with serum protein and erythrocytes, concentration in rabbit blood, and acetylation rate were studied in comparison with their free ligand forms. For solubility concerned, the partition coefficients of Sulfa-Cu are decreased as following order: Sulfadimethoxine Copper chelate (SDM-Cu), Sulfamethoxypyridazine Copper chelate (SD-Cu), Sulfamerazine Copper chelate (SM-Cu), Sulfaisoxazole Copper chelate (SIX-Cu). The partition coefficients of SDM-Cu and ST-Cu were much greater than those of ligands. this phenomenone acounts for the rapid absorption of SDM-Cu and ST-Cu in the rat small intestine (in situ). The Sulfa-Cu were absorbed at the intestinal lumen of a rat in the rate of first order and there was no difference between long acting sulfa drugs and their Cu0chelates in biological half lives. In binding experiments, sulfa-Cu binded with serum protein in lower ratio than their ligands except SIX-Cu. On other hand, acetylation rates of sulfa-Cu were higher than those of free sulfa drugs and the acetylation rate were higher than those of free sulfa drugs and powder. In a experiment on Sulfa-Cu concentration in rabbit blood, the half lives of SD-Cu, SIX-cu, ST-Cu, and SM-Cu were longer than those of their ligands. Above all, the half life of SD-Cu appeared to be approximately 3.5 times logner than that of corresponding ligand, SD. When absorption of sulfa drugs or sulfa-Cu at the small intestinal lumen of a rat and the concentration in rabbit blood after absorption were compared, it was found that there was not always conrrelated.

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Phytoremediation of Cu-contaminated Soil and Water by Commelina communis

  • Kim, Sung-Hyun;Lee, In-Sook
    • The Korean Journal of Ecology
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    • 제28권1호
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    • pp.7-13
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    • 2005
  • In the present study, we investigated the tolerance of Commelina communis to growth in Cu-contaminated soil and water We examined the germination rate, root and shoot growth of seedlings, fresh biomass in soil and water, and ability to eliminate Cu. We found that C. communis eliminated 41% of Cu in soil containing 50 mg Cu/kg and removed over 50% of Cu from water containing 100 mg Cu/L Cu. In addition, the plants could accumulate 90 mg Cu/g when grown in soil containing 50 mg Cu/kg and 140 mg Cu/g when grown in soil containing 100 mg Cu/kg thus higher levels of Cu removal were observed in soils containing higher Cu concentrations. In water, the maximal accumulation rate was 4.9 mg Cu/g root and 1.2 mg Cu/g shoot in water containing 20 mg Cu/L, and 7 days after exposure, Cu absorption saturated. Further, the growth rate of C. communis was not affected by up to 100 mg Cu/kg in the soil. Therefore, the phytotoxic effect of Cu on plants increased as the concentration of Cu was raised, although to different extents depending on whether the Cu was in soil or water. Overall, Cu removal from soil by C. communis was most effective at 100 mg Cu/kg in soil and 10 mg Cu/L in water. Finally, we identified two peaks of Cu-binding ligands in C. communis. Which is a high molecular weight peak (HMWL) at 60 kDa (Fraction 17 to 25) and a Cu binding peptide peak at <1 kDa (Very low molecular weight ligand: VLMWL). Cu-binding peptide (Cu-BP) was observed to have an amino acid composition typical of phytochelations.

Effects of Supplementary Copper Chelates in the Form of Methionine, Chitosan and Yeast on the Performance of Broilers

  • Lim, H.S.;Paik, I.K.;Sohn, T.I.;Kim, W.Y.
    • Asian-Australasian Journal of Animal Sciences
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    • 제19권9호
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    • pp.1322-1327
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    • 2006
  • An experiment was conducted to investigate the effects of supplemental copper (Cu) chelates (methionine, chitosan and yeast) on the performance, nutrient digestibility, serum IgG level, gizzard erosion, Cu content in the liver and excreta and the level of total cholesterol in breast muscle and serum of broiler chickens. Two hundred and forty hatched broiler chickens (Ross$^{(R)}$ 208) were assigned to 4 treatments: control, 100 ppm Cu in methionine chelate (Met-Cu), 100 ppm Cu in chitosan chelate (Chitosan-Cu) and 100 ppm Cu in yeast chelate (Yeast-Cu). Each treatment had six replicates of 10 (5 males+5 females) birds each. Weight gain and feed intake tended to be higher in Cu chelate treatments than the control; weight gain was significantly higher in the Met-Cu chelate treatment and feed intake was significantly higher in the Yeast-Cu chelate treatment than the control (p<0.05). Feed/gain was significantly different between treatments in which Met-Cu was lowest followed by the control, Chitosan-Cu and Yeast-Cu. DM availability was increased by Cu chelates among which chitosan-Cu showed the highest DM availability. Cu chelates supplementation tended to increase gizzard erosion index, and Cu content in the liver was highest in the Met-Cu treatment. Supplementation of Cu chelates tended to decrease total cholesterol level in breast muscle and serum but tended to increase the level of HDL in serum. It was concluded that dietary supplementation of 100 ppm Cu in chelates increased weight gain, feed intake and DM availability. Met-Cu was more effective than Chitosan-Cu or Yeast-Cu in improving productivity of broiler chickens.

Cu2In3, CuGa, Cu2Se를 이용한 전구체박막을 셀렌화하여 제조한 Cu(In,Ga)Se2 박막의 미세구조 및 농도분포 변화 (Microstructure and Compositional Distribution of Selenized Cu(In,Ga)Se2 Thin Film Utilizing Cu2In3, CuGa and Cu2Se)

  • 이종철;정광선;안병태
    • 한국재료학회지
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    • 제21권10호
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    • pp.550-555
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    • 2011
  • A high-quality CIGS film with a selenization process needs to be developed for low-cost and large-scale production. In this study, we used $Cu_2In_3$, CuGa and $Cu_2Se$ sputter targets for the deposition of a precursor. The precursor deposited by sputtering was selenized in Se vapor. The precursor layer deposited by the co-sputtering of $Cu_2In_3$, CuGa and $Cu_2Se$ showed a uniform distribution of Cu, In, Ga, and Se throughout the layer with Cu, In, CuIn, CuGa and $Cu_2Se$ phases. After selenization at $550^{\circ}C$ for 30 min, the CIGS film showed a double-layer microstructure with a large-grained top layer and a small-grained bottom layer. In the AES depth profile, In was found to have accumulated near the surface while Cu had accumulated in the middle of the CIGS film. By adding a Cu-In-Ga interlayer between the co-sputtered precursor layer and the Mo film and adding a thin $Cu_2Se$ layer onto the co-sputtered precursor layer, large CIGS grains throughout the film were produced. However, the Cu accumulated in the middle of CIGS film in this case as well. By supplying In, Ga and Se to the CIGS film, a uniform distribution of Cu, In, Ga and Se was achieved in the middle of the CIGS film.

ʼn-BGA에서 Sn-Ag-Cu 솔더의 도금층에 따른 솔더링성 연구 (A Study on Solderability of Sn-Ag-Cu Solder with Plated Layers in ʼn-BGA)

  • 신규식;정석원;정재필
    • Journal of Welding and Joining
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    • 제20권6호
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    • pp.59-59
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    • 2002
  • Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

$\mu-BGA$에서 Sn-Ag-Cu 솔더의 도금층에 따른 솔더링성 연구 (A Study on Solderability of Sn-Ag-Cu Solder with Plated Layers in $\mu-BGA$)

  • 신규식;정석원;정재필
    • Journal of Welding and Joining
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    • 제20권6호
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    • pp.783-788
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    • 2002
  • Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp.:$250^{\circ}C$and conveyer speed:0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was $250^{\circ}C$. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn ($5\mu\textrm{m}$), Cu/Ni ($5\mu\textrm{m}$), and Cu/Ni/Au ($5\mu\textrm{m}/500{\AA}$) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

$YBa_2Cu_3O_{7-}\delta$, $Y_2BaCuO_5$ 및 Ba-Cu-O계 화합물의 수분과의 반응에 의한 열방출에 관한 연구 (Heat Liberation in the Reaction of $YBa_2Cu_3O_{7-}\delta$, $Y_2BaCuO_5$, and Binary Compounds in the Ba-Cu-O System with Water)

  • 김배연
    • 한국세라믹학회지
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    • 제32권1호
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    • pp.83-89
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    • 1995
  • YBa2Cu3O7-$\delta$, Y2BaCuO5, and binary compounds in the Ba-Cu-O system with the nominal composition of Ba2CuO3, BaCuO2, Ba3Cu4O7, Ba3Cu5O8 were synthesized to investigate the heat evolutions and crystalline phases in the hydration reaction of orthorhombic YBa2Cu3O7-$\delta$ phase. The observed crystalline phases were YBa2Cu3O7-$\delta$, Y2BaCuO5, and BaCuO2, or Ba2Cu3O5+x, and some amount of noncrystalline phase in the Ba-Cu system comounds. In contact with distilled water, YBa2Cu3O7-$\delta$ and Y2BaCuO5 did not have considerable heat liberation, but in the binary compounds of the Ba-Cu-O system, the amount of total heat liberation was increased with respect to the Cu content. It might be that the reaction of high temperature superconductor YBa2Cu3O7-$\delta$ with water and/or moisture originated from the unusual oxidation state of Cu ion and the presence of amorphous Ba-Cu oxide compound. The degradation of high Tc superconductor by moisture and water could be controlled by restricting the heterogeneous distribution of Tc comlposition and the formation of second phase, such as stable Y2BaCuO5, and the resulting unstable Ba-Cu oxide compound.

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CuO가 코팅된 Cu 분말을 혼합한 Camphene 슬러리의 동결건조에 의한 Cu 다공체 제조 (Fabrication of Porous Cu by Freeze-drying Process of Camphene Slurry with CuO-coated Cu Powders)

  • 방수룡;오승탁
    • 한국분말재료학회지
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    • 제21권3호
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    • pp.191-195
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    • 2014
  • This study reports a simple way of fabricating the porous Cu with unidirectional pore channels by freeze drying camphene slurry with Cu oxide coated Cu powders. The coated powders were prepared by calcination of ball-milled powder mixture of Cu and Cu-nitrate. Improved dispersion stability of camphene slurry could be achieved using the Cu oxide coated Cu powders instead of pure Cu powders. Pores in the frozen specimen at $-25^{\circ}C$ were generated by sublimation of the camphene during drying in air, and the green bodies were sintered at $750^{\circ}C$ for 1 h in $H_2$ atmosphere. XRD analysis revealed that the coated layer of Cu oxide was completely converted to Cu phase without any reaction phases by hydrogen heat treatment. The porous Cu specimen prepared from pure Cu powders showed partly large pores with unidirectional pore channels, but most of pores were randomly distributed. In contrast, large and aligned parallel pores to the camphene growth direction were clearly observed in the sample using Cu oxide coated Cu powders. Pore formation behavior depending on the initial powders was discussed based on the degree of powder rearrangement and dispersion stability in slurry.

CuO 대신 Cu 미분말 치환이 NiCuZn Ferrite에 미치는 영향에 관한 연구 (A Study on the Influence of Substituting Cu Eine Particle for CuO on NiCuZn Ferrite)

  • 김재식;고재귀
    • 한국자기학회지
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    • 제13권1호
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    • pp.15-20
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    • 2003
  • Cu 금속 미분말은 확산속도가 CuO 보다 CuO 보다 빠르고 소결시 입자성장을 촉진시키기 때문에 기본조성 (N $i_{0.204}$C $u_{0.204}$Z $n_{0.612}$ $O_{1.02}$)F $e_{1.98}$ $O_{2.98}$에 들어가는 CuO대신 Cu/CuO의 비를 변화시켜 가면서 Cu가 ferrite에 미치는 영향을 조사하였다. Cu를 CuO 대신 치환함으로써 90$0^{\circ}C$에서 완전한 Spinel구조를 가짐을 XRD pattern을 통하여 확인하였고, Cu/CuO 비가 60%일 때가 투자율 1100, Ms 87 emu/g의 최적조건을 얻었다. Cu는 소결시 확산속도를 증가시켜 입자성장에 영향을 주었으며, CuO대신 Cu의 치환은 저온에서 투자율이 개선됨을 확인하고 소결온도를 3$0^{\circ}C$이상 낮출 수 있었다. 소결이 끝난 후에는 CuO와 같은 거동을 하는 것으로 확인되었다.

사료내 Cu-methionine Chelate와 Cu-soy Proteinate가 산란계의 생산성, 소장내 미생물 균총 및 면역체계에 미치는 영향 (Effect of Dietary Supplementation of Cu-methionine Chelate and Cu-soy Proteinate on the Performance, Small Intestinal Microflora and Immune Response in Laying Hens)

  • 백인기;김찬호;박광월
    • 한국가금학회지
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    • 제35권3호
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    • pp.303-311
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    • 2008
  • 본 실험은 Cu-methionine chelate(Cu-Met)와 Cu-soy proteinate(Cu-SP)가 산란계의 생산성과 소장내 미생물 균총 및 면역 체계에 미치는 영향을 조사하기 위해 실시하였다. 사양시험은 39주령의 산란계(Hy-line $Brown^{(R)}$) 960수를 선별하여 A형 2단 4열 케이지에 대조구 포함 총 6처리구로 구성하여 처리당 4반복, 반복당 40수씩(2수 수용 케이지 20개) 난괴법으로 임의 배치하였다. 시험 기간 동안 물과 사료는 자유 섭취하게 하였으며, 일반적인 점등 관리(자연 일조+조명; 16 hr)를 실시하였다. 시험구는 대조구, 항생제구(avilamycin 6 ppm), Cu- Met 50(Cu-methionine으로 Cu 50 ppm), Cu-Met 100(Cu- methionine으로 Cu 100 ppm), Cu-SP 50(Cu-soy proteinate로 Cu 50 ppm) 그리고 Cu-SP 100(Cu-soy proteinate로 Cu 100 ppm) 등 총 6처리였다. 일계 산란율(Hen-day egg production)과 산란지수(Hen-house egg production)는 Cu 첨가구들과 항생제 첨가구들이 대조구에 비해 높은 경향을 보였는데, 특히 Cu-Met 100 구는 대조구에 비하여 유의적으로(P<0.05) 높았으며 Cu 처리구들 간에 종류나 첨가 수준에 따른 차이는 유의하지 않았다. 난중에서는 항생제구와 Cu-SP 첨가구들이 대조구보다 무거운 경향을 보였고, Cu-Met 첨가구들보다는 유의하게(P<0.05) 무거웠다. 난각 강도, 난각 두께, 난각색, 난황색, Haugh unit 등 계란 품질에 있어서 처리구간에 유의적인 차이는 나타나지 않았다. Leukocytes와 erythrocytes 관련 모수들은 평균 적혈구 혈색소량(MCH)을 제외한 모든 항목에서 처리간에 유의적인 차이는 나타나지 않았다. MCH는 Cu-SP 100이 대조구와 비교하여 유의적으로 높았다(P<0.05). 혈청 IgG와 IgA의 농도는 처리구간에 유의적인 차이는 나타나지 않았다. 간 내 구리의 함량은 처리간에 유의한(P<0.05) 차이가 있었는데, 구리의 첨가 수준이 높을수록 높아지는 경향이 있었으며 같은 첨가 수준에서는 Cu-SP 첨가구들이 Cu-Met 첨가구들보다 높은 경향이 있었다. 소장 내용물 중 Cl. perfringens의 수는 항생제와 Cu 첨가구들이 대조구에 비해 적었고 E. coli 수는 첨가구들에서 감소하는 경향이 있었으며, Lactobacilli 수는 Cu 첨가구들이 대조구나 항생제구와 비교하였을 때 많았다. 결론적으로 Cu-Met와 Cu-SP는 산란계의 산란율 개선에 있어서 항생제와 유사한 효과를 나타내었다. Cu-SP는 Cu-Met보다 난중을 유의하게 증가시켰으나 다른 항목들에 있어서는 Cu 공급원(Cu-Met vs Cu-SP)과 첨가수준(50 vs 100 ppm)에 따른 유의적 차이는 없었다.