• Journal of Welding and Joining
• /
• v.21 no.5
• /
• pp.525-533
• /
• 2003

The dimensional accuracy and global roughness between successive layers of VLM-s, which is a new rapid prototyping process using hotwire cutter and EPS foam, depend significantly on the operating parameters of hotwire cutter. In the present study, the effect of cutting angle on the kerf width and edge shape in hotwire cutting of EPS foam for the case of single-sloped cutting with one cutting angle was investigated. Through single-sloped cutting tests, the modified relationship between kerf width and effective heat input, considering the effect of the cutting angle, and the relationship between the melted area and the cutting angle were obtained. In order to investigate the effect of cutting angles on the thermal field in EPS foam, transient heat transfer analyses using single-sloped volumetric heat flux model and locally-conformed mesh were performed. Through the comparison between experimental and numerical results, it was shown that the proposed analysis model is needed to estimate the three-dimensional temperature distribution of the EPS foam for the case of single-sloped hotwire cutting.

• Laser Solutions
• /
• v.4 no.2
• /
• pp.47-57
• /
• 2001

This study deals with the laser cutting of stencil for the PCB. The most important aim of this study is to determine optimal conditions which make good-qualify stencil in Nd:YAG laser cutting. We made an experiment according to various variables (power. type of mask. gas pressure, cutting speed, and pulse width) and analyzed the cutting characteristics (surface roughness, kerf width. dross) . Each variable has optimal value for good-qualify cut edge under fixed condition. And neural network after learning experimental data with a million time iteration could predict surface roughness of cut edge under arbitrary condition approximately.

• Journal of the Korean Society for Precision Engineering
• /
• v.9 no.4
• /
• pp.147-153
• /
• 1992

This study was undertaken to investigate the cutting behaviour of super duralumin (A2024-T3) with sintered carbide tool(P20). The cutting test was carried out under different conditions such as cutting speed, cutting depth and rake angle, etc. The specific cutting force Kc and Kt of vertical and radial forces decreases as cutting speed increases, especially the decrease rate of Kt becomes larger than of Kc as cutting speed increases. Kc and Kt in small cutting depth are much affected by work-hardening of surface layer. The chip width and shear angle become layer as cutting depth increases, especially chip width at feed of 0.1mm almost approaches cutting width. Relation between the friction coefficient of chip side and tool rake angle side can make the modelization studying the built-up edge size. The shear angle model equation of super duralumin generally agree with theory of Ernst-Merchant.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1997.10a
• /
• pp.989-992
• /
• 1997

The objective of this study is to develop stencil cutting process and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width on the cut edge quality were investigated. In order to analyze the cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. A a results, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial gerber file for PCB stencil manufacturing.

• Journal of the Korean Society for Precision Engineering
• /
• v.31 no.3
• /
• pp.207-213
• /
• 2014

A study was carried out to fabricate the cutting tool geometry with micro/nanoscale on the single crystal diamond tool by using the FIB. The FIB technique is an ideal tool for TEM sample preparation that allows for the fabrication of electron-transparent foils. The FIB is appropriate techniques to sample and subsequently define the chemical composition and the structural state of mineral inclusion on the micro/nanoscale. The combination of FIB with a SEM allows for 3D information to be obtained from samples including 3D imaging. Cutting strategies were demonstrated to improve the performance of cutting tool geometry and to generate high aspect ratio micro cutting tool. A finely focused beam of 30keV Ga+ ions was used to mill cutting tool shapes for various micro patterns. Therefore FIB sputtering is used to shape a variety of cutting tools with dimensions in the $1-5{\mu}m$ range and cutting edge radii of curvature of under 50nm.

• Design & Manufacturing
• /
• v.14 no.3
• /
• pp.63-70
• /
• 2020

As the consumer market in the VR(virtual reality) and the head-up display industry grows, the demand for 5-axis machines and grooving machines using on a ultra-precision machining increasing. In this paper, ultra-precision diamond tools satisfying the cutting edge width of 500 nm were developed through the process research of a focused ion beam. The material used in the experiment was a single-crystal diamond tool (SCD), and the equipment for machining the SCD used a focused ion beam. In order to reduce the influence of the Gaussian beam emitted from the focused ion beam, the lift-off process technology used in the semiconductor process was used. 2.9 ㎛ of Pt was coated on the surface of the diamond tool. The sub-micron tool with a cutting edge of 492.19 nm was manufactured through focused ion beam machining technology. Toshiba ULG-100C(H3) equipment was used to process fine-pattern using the manufactured ultra-precision diamond tool. The ultra-precision machining experiment was conducted according to the machining direction, and fine burrs were generated in the pattern in the forward direction. However, no burr occurred during reverse machining. The width of the processed pattern was 480 nm and the price of the pitch was confirmed to be 1 ㎛ As a result of machining.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.2
• /
• pp.106-113
• /
• 2002

Stencil is used normally as a mask for seeder pasting on pad of PCB. The objective of this study is to develop stencil cutting system and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width old the cut edge quality were investigated. In order to analyse fille cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. As a result, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial Gerber file for PCB stencil manufacturing.

• International Journal of Precision Engineering and Manufacturing
• /
• v.4 no.1
• /
• pp.23-29
• /
• 2003

Stencil is used normally as a mask for solder pasting on pad of a printed circuit board (PCB). The objective of this study is to develop a stencil cutting system and determine the optimal conditions to make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse duration on the cut edge quality were investigated. In order to analyze the cut surface characteristics (roughness, kerfwidth, dross) optical microscopy, SEM microscopy and roughness measurements were used. As a result, the optimal conditions of cutting process parameters were determined, and the practical feasibility of the proposed system was also examined by using a commercial Gerber file for PCB stencil manufacturing.

• Journal of the Korea Furniture Society
• /
• v.16 no.1
• /
• pp.17-23
• /
• 2005

European maple is famous for the optimum solid wood for making bridge which is the most important part in violin acoustics. This study was carried out to investigate the variation of main features, i. e. annual ring width and cutting direction of costly imported violin bridge blanks and to examine the effect of these features of the blanks on the vibrational characteristics of bridge blanks. Imported violin bridge blanks had somewhat large variation in major macroscopical and physical properties and there was little relationship between annual ring density and weight of maple blanks. Resonant frequency of violin bridge blanks had some positive correlation with weight, however, damping having negative relationship with frequency was seldom affected by any physical properties of the maple blanks. Deviation from the radial cutting of tail side(ray direction from top toward feet on the edge of bridge blank) lowered the resonant frequency. Consequently, weight and ray direction should be taken for the critical quality decisive factors(QDF) of incoming bridge blanks by not only inspectors also luthiers who tune the bridge by shaping and are responsible for the final timbre quality of this complicate instrument.

• Proceedings of the Korean Society of Laser Processing Conference
• /
• 2006.11a
• /
• pp.128-132
• /
• 2006

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355nm and 80MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow rate, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repetition rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20{\mu}m$ and $10{\mu}m$ at more than 500mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed of laser material process.