• Applied Chemistry for Engineering
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• v.34 no.4
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• pp.365-382
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• 2023

A lithium metal anode with high energy density has the potential to revolutionize the field of energy storage systems (ESS) and electric vehicles (EVs) that utilize rechargeable lithium-based batteries. However, the formation of lithium dendrites during cycling reduces the performance of the battery while posing a significant safety risk. In this review, we discuss various strategies for achieving dendrite-free lithium metal anodes, including electrode surface modification, the use of electrolyte additives, and the implementation of protective layers. We analyze the advantages and limitations of each strategy, and provide a critical evaluation of the current state of the art. We also highlight the challenges and opportunities for further research and development in this field. This review aims to provide a comprehensive overview of the different approaches to achieving dendrite-free lithium metal anodes, and to guide future research toward the development of safer and more efficient lithium metal anodes.

• Journal of Korea Foundry Society
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• v.32 no.2
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• pp.91-97
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• 2012

The effects of Bi and Sb additions on the microstructures and casting properties in lead-free Cu-Zn-Sn broze were investigated. (1) When only Bi was added to the bronze, Bi was precipitated on the ${\delta}$ phase of ${\alpha}$ dendrite cell boundary. When Bi and Sb were added together, Bi was precipitated on the ${\delta}_A$ which was the Sb-rich area in the ${\delta}$ phase. (2) The addition of Sb accelerated the formation of ${\delta}$ phase, and when Sb, Bi and Pb were added, Bi and Pb were precipitated as mixed solution in the ${\delta}_A$ phase. (3) The combined addition of Sb and Bi resulted in the suppression of shrinkage due to the complementary effects of the mass feeding of ${\alpha}$-dendrite cluster covered with ${\delta}$ phase and sealing of micro-shrinkage in the ${\delta}$ phase by solidification expansion of Bi.

• Journal of Electrochemical Science and Technology
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• v.14 no.1
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• pp.85-95
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• 2023

In recent years, solid-state Li metal batteries (SSLBs) have attracted significant attention as the next-generation batteries with high energy and power densities. However, uncontrolled dendrite growth and the resulting pulverization of Li during repeated plating/stripping processes must be addressed for practical applications. Herein, we report a plastic-crystal-based polymer/ceramic composite solid electrolyte (PCCE) to resolve these issues. To fabricate the one-side ceramic-incorporated PCCE (CI-PCCE) film, a mixed precursor solution comprising plastic-crystal-based polymer (succinonitrile, SN) with garnet-structured ceramic (Li₇La₃Zr₂O₁₂, LLZO) particles was infused into a thin cellulose membrane, which was used as a mechanical framework, and subsequently solidified by using UV-irradiation. The CI-PCCE exhibited good flexibility and a high room-temperature ionic conductivity of over 10^-3 S cm^-1. The Li symmetric cell assembled with CI-PCCE provided enhanced durability against Li dendrite penetration through the solid electrolyte (SE) layer than those with LLZO-free PCCEs and exhibited long-term cycling stability (over 200 h) for Li plating/stripping. The enhanced Li⁺ transference number and lower interfacial resistance of CI-PCCE indicate that the ceramic-polymer composite layer in contact with the Li anode enabled the uniform distribution of Li⁺ flux at the interface between the Li metal and CI-PCCE, thereby promoting uniform Li plating/stripping. Consequently, the Li//LiFePO₄ (LFP) full cell constructed with CI-PCCE demonstrated superior rate capability (~120 mAh g^-1 at 2 C) and stable cycle performance (80% after 100 cycles) than those with ceramic-free PCCE.

• Journal of Electrochemical Science and Technology
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• v.14 no.2
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• pp.162-173
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• 2023

Aqueous zinc-ion batteries are considered as promising alternatives to lithium-ion batteries for energy storage owing to their safety and cost efficiency. However, their lifespan is limited by the irreversibility of Zn anodes because of Zn dendrite growth and side reactions such as the hydrogen evolution reaction and corrosion during cycling. Herein, we present a strategy to restrict direct contact between the Zn anode and aqueous electrolyte by fabricating a protective layer on the surface of Zn foil via phosphidation method. The Zn₃(PO₄)₂ protective layer effectively suppresses Zn dendrite growth and side reactions in aqueous electrolytes. The electrochemical properties of the Zn₃(PO₄)₂@Zn anode, such as the overpotential, linear polarization resistance, and hydrogen generation reaction, indicate that the protective layer can suppress interfacial corrosion and improve the electrochemical stability compared to that of bare Zn by preventing direct contact between the electrolyte and the active sites of Zn. Remarkably, MnO₂ Zn₃(PO₄)₂@Zn exhibited enhanced reversibility owing to the formation a stable porous layer, which effectively inhibited vertical dendrite growth by inducing the uniform plating of Zn²⁺ ions underneath the formed layer.

• Journal of Mushroom
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• v.17 no.4
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• pp.275-283
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• 2019

Sparassis latifolia is a fungus abundant in β-glucan and amino acids and is highly valued as a medicinal mushroom. Among amino acids, γ-aminobutyric acid (GABA) is a free amino acid and has biological effects, such as increase/decrease of hypertension, improvement of cerebral blood flow, and prevention of dementia. In this study, biological elicitors were used to increase bioactive substances as a biofortification method. Sodium alginate extracted from seaweed (Sargassum horneri, Sargassum fulvellum, Sargassum fusiforme) were used as the elicitor. The levels of β-glucan and GABA in the mycelium and fruiting body grown by adding the elicitor to the medium were investigated. Addition of sodium alginate positively affected GABA production and negatively affected the β-glucan production in these fungi. Sodium alginates extracted from S. fulvellum induced the highest increase in GABA in the mycelium and fruiting bodies. Moreover, we investigated the effects of the extracts from mycelium and fruiting bodies on dendrite development in primary cortical neurons. We found that the extract from the fruiting bodies of sodium alginate treated fungi with increased levels of GABA inhibited the dendrite outgrowth of excitatory neurons, but not inhibitory neurons.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.114-117
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• 2003

본 연구에서는 계산을 통해 나온 Sn-Ag-Cu 삼원계 공정점(Sn-3.7Ag-0.9Cu)을 바탕으로 그 근처의 응고경로가 다른 6가지 조성(Sn-4.6Ag-0.4Cu, Sn-4.9Ag-1.0Cu, Sn-3.9Ag-1.3Cu, Sn-2.2Ag-1.2Cu, Sn-2Ag-0.7Cu, Sn-2.7Ag-0.3Cu)에 대한 솔더합금의 미세조직을 관찰하였다. 응고경로는 $L\;\rightarrow\;L+Primary\;\rightarrow\;L+Primary+Secondary\;\rightarrow\;Ternary\;Eutectic+Primary+Secondary$로 되며 6가지 경우를 예상할 수 있다 솔더합금의 미세조직은 느린 냉각으로 인하여 빠른 냉각, 보통 냉각에 비해 상대적으로 커다란 $\beta-Sn$ dendrite를 보였고 $Ag_3Sn,\;Cu_6Sn_5$과는 다르게 $\beta-Sn$는 약 $30^{\circ}C$의 과냉(DSC분석)이 존재하게 되어 Sn-4.6Ag-0.4Cu의 경우에는 $Ag_3Sn$상이, Sn-2.2Ag-1.2Cu의 경우에는 $Cu_6Sn_5$가 과대성장을 하였다. 솔더의 기계적 특성을 살펴보고자 Cu 기판위에서 각 조성의 솔더볼을 솔더링한 후 다양한 냉각 속도를 적용하여 reflow 솔더링을 하고 솔더/기판 접합에 대한 전단 강도 시험을 실시했다. 냉각 속도가 빠를수록 $\beta-Sn$의 dendrite가 미세해져서 높은 전단 강도를 보였고 6가지 조성의 솔더볼중 공정조직 분율이 낮은 Sn-2Ag-0.7Cu 조성의 경우에서 낮은 전단 강도가 나타났다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.4
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• pp.210-214
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• 2002

The crystallization behavior of amorphous silicon (a-Si) film was investigated by using Cu-field aided lateral crystallization (Cu-FALC) process below $450^{\circ}C$. The lateral crystallization was induced from the Cu deposited region outside of pattern toward the Cu-free region inside of the pattern by applying an electric field during heat treatment. As expected, the lateral crystallization toward Cu-free region proceeded from negative toward positive electrode side. The occurrence of Cu-FALC phenomenon was interpreted in terms of dominant diffusing species in the reaction between Cu and Si. Even at the annealing temperature of $350^{\circ}C$, the large dendrite-shaped branches were formed in the crystallized region and the polarity in the lateral crystallization was clearly observed. Consequently, we could successfully crystallize the a-Si at the temperature as low as $350^{\circ}C$ by an electric field of 30 V/cm with fast crystallization velocity of 12 $\mu$m/h.

• Corrosion Science and Technology
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• v.6 no.2
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• Journal of Welding and Joining
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• v.16 no.3
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• pp.148-156
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• 1998

The purpose of this study is to investigate the characteristics of Pb-Free Sn-2%Ag-Bi solder alloys. The solder alloys used in this study is Sn-2%Ag-(3,5,7,9%) Bi It is examined that their properties such as melting range, wettability, microstructure, microhardness, and tensile property. The addition of Bi(3,5,7,9%) lowered the melting point of the solder and the melting range was 196~203$^{\circ}C$. The wettability of the solder as equal to that of Sn-37% Pb solder. The morphology of structure did not change largely by addition of Bi. But the structure of cellular dendrite of linear type displayed. The tensile strength of the solder was superior to that of Sn-37%Pb solder. But the elongation was inferior to that of Sn-37%Pb solder. The hardness of Sn-2%Ag solder was tow times and that of Sn-2%Ag-Bi solder was three times of that in Sn-37%Pb solder. But the effect of increment of Bi content did not change largely.

• Journal of the Korean Electrochemical Society
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• v.24 no.4
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• pp.113-119
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• 2021

In this study, impurity free V^3.5+ electrolytes were prepared using formic acid as a reducing agent and PtD/C as a catalyst and it was applied to VRFB. The well-oriented 3D dendrite structure of the PtD/C catalyst showed high catalytic activity in formic acid oxidation reaction and vanadium reduction reaction. As a result, the conversion ratio of electrolyte using the PtD/C was 2.73 mol g^-1 h^-1, which was higher than that of 1.67 mol g^-1 h^-1 of Pt/C prepared by the polyol method. In addition, in the VRFB charging and discharging experiment, the V^3.5+ electrolyte produced by the catalytic reaction showed the same performance as the standard V^3.5+ electrolyte prepared by the electrolytic method, thus proving that it can be used as an electrolyte for VRFB.