• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.641-641
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• 2013

We report the transparentsilver nanowire electrode fabricated by a direct printing process, liquid-bridge-mediated nanotransfer molding. We fabricated silver nanowire arrays by liquidbridge- mediated nanotransfer molding using the silver nanoparticle ink and PEDOT:PSS polymer. Weinvestigated the formation of silver nanowire arrays by SEM and transmittance of the transparent silver nanowire electrode. We also measured the conductivity to confirm the potential of our approach.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.126-126
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• 2010

대표적인 친환경 차단부로 Vacuum Interrupter(VI)를 에폭시 수지로 성형한 Embedded VI 의 적용이 확대되고 있다. 이러한 Embedded VI의 제작에 있어, 기존에는 대부분 VI의 Ceramic 표면과 에폭시 성형층의 계면에 고무재질의 완충층을 적용하는 방식으로 제작되었다. 본 연구에서는 이러한 완충층 형성시 발생되는 문제를 해결하기 위한 방법으로 VI외부에 추가적인 완충층을 형성하지 않고, 에폭시 수지를 성형하는 Direct Molding 방안을 제시하고. VI표면과 에폭시간에 화학적 결합 메커니즘을 도출하여 Direct Molding 을 적용한 Embedded VI의 제작기술을 개발하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.12
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• pp.5709-5715
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• 2012

Injection molding product is commonly used for reducing the weight of automotive vehicle, and door regulator guide rail with plastic material is also made by injection molding process. In order to improve the injection molding performance of plastic regulator guide rail, optimal molding condition is suggested by numerical simulation and DOE after obtaining the sensitivity of parameters for regulator rail manufacturing on warpage and fill time. Furthermore, multi direct gate method and optimal cooling circuit are introduced to get the uniform temperature distribution and better cooling efficiency in molding product. The effect of the proposed design on the injection molding performance is verified by the test of prototype of plastic regulator guide rail.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.2
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• pp.1-8
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• 2016

Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.

• Journal of Institute of Control, Robotics and Systems
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• v.9 no.10
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• pp.768-773
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• 2003

Injection molding has been widely used for the mass production of a plastic product. With the development of the relative technique, various injection molding techniques have been developed and we could get more precise plastic product. The temperature of a melting resin is an important factor in the injection molding and this temperature has direct influence on the quality of a plastic product. In the present injection molding machine, the deriation of a temperature controlled by PID control method is within 2$^{\circ}C$ in the injection molding machine but PID control method takes too much time to stabilize after preheating and its overshoot is so big. We applied fuzzy control to alleriate the problem. In this research, we experimented the fuzzy temperature control with the usage of PC based PLC.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.372-372
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• 2012

We have studied a fabrication of Poly (3,4-ethylenedioxythiophene) (PEDOT) wire arrays and structures with various feature sizes from hundreds micrometers to tens nanometers. PEDOT is well-known as a conducting material, can be grown by a vapor pressure polymerization (VPP) method. The VPP technique is a bottom-up processing method that utilizes the organic arrangement of macromolecules to easily produce ordered aggregates. Also, liquid-bridge-mediated nanotransfer molding (LB-nTM), which was reported as a new direct patterning method recently, is based on the direct transfer of various materials from a mould to a substrate through a liquid bridge between them. The PEDOT nanowires grown by VPP method and transferred on a substrate to use LB-nTM method have been investigated by Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Selected Area Electron Diffraction (SAED), X-Ray Diffraction (XRD), X-ray Photoelectron Spectroscopy (XPS), and electrical properties.

• Journal of Korean Society for Quality Management
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• v.29 no.3
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• pp.86-96
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• 2001

The objective of this research is to develop a robust design methodology for plastic injection molded parts wherein warpage will be minimized by a complex method which is a kind of a simple direct search method. The design space considered for optimization is divided Into two sub-design space : mold and process conditions. Warpage is quantified using the Moldflow injection molding simulation software. The design methodology was applied to an actual part of a fax machine, the Guide-ASF model, through two different design policies. The significance of this study is the synthesis of a computer simulation of injection molding process and optimization technique to determine the optimal robust design solution.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.317-318
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.609-610
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• 2012

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.214-219
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• 2005

Pressure distribution in the cavity during injection molding affects part quality. In this study pressure distributions in the runner, near gate in the cavity, and end of ail in the cavity have been measured using direct pressure sensors for various molding conditions. Molding conditions were injection speed, injection pressure, packing time from filing stage, and packing pressure. Through experiments it was realized that the packing time from filling stage and packing pressure are the dominant factors on the part quality such as part shrinkage. Experimental results have been compared with computer simulations.