• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.05a
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• pp.38-46
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• 1999

Dispersion strengthened Cu alloys have been manufactured by spray forming and also by reactive spray forming, followed by hot extrusion of the spray deposited billets. The size of dispersed particles in the reactive spray formed alloy was much finer than that in the spray formed alloy. That was because the dominant chemical reaction between Ti and B had occurred in Cu-Ti-B alloy melt in spray forming while it had occurred after deposition of droplets in reactive spray forming. The yield strength of the reactive spray formed alloy was greater than that of the spray formed alloy. To understand the mechanism responsible for this observed strengthening, the yield strength of two Cu alloys were analyzed using the dislocation pile-up model and Orowan mechanism, which were fairly consistent with the experimental results. Increase in yield strength of reactive spray formed alloy relative to spray formed alloy was largely attributed to nano-scale TiB dispersoids.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1205-1206
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• 2006

Dispersion-strengthened copper with $TiB_2$ was produced by ball-milling and spark plasma sintering (SPS).Ball-milling was performed at a rotation speed of 300rpm for 30 and 60min in Ar atmosphere by using a planetary ball mill (AGO-2). Spark-plasma sintering was carried out at $650^{\circ}C$ for 5min under vacuum after mechanical alloying. The hardness of the specimens sintered using powder ball milled for 60min at 300rpm increased from 16.0 to 61.8 HRB than that of specimen using powder mixed with a turbular mixer, while the electrical conductivity varied from 93.40% to 83.34%IACS. In the case of milled powder, hardness increased as milling time increased, while the electrical conductivity decreased. On the other hand, hardness decreased with increasing sintering temperature, but the electrical conductiviey increased slightly