• Journal of Korea Multimedia Society
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• v.10 no.9
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• pp.1197-1208
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• 2007

These days, most of SMART card, JAVA card, picked up the JAVA Card Platform gets the position as a standard. Java Card technology provides implantation, platform portability and high security function to SMART Card. Compared to normal Smart Card, JAVA card has a defect that is a low running speed caused by a distinctive feature of JAVA programming language. Factors that affect JAVA Card execution speed are the method how to save the data and install the applets of JAVA Card installation instrument. In this paper, I will offer the plan to improve JAVA Card program's loading and execution speed. At Java Card program, writing, updating and deleting process for data at EEPROM can be improved of Java Card speed by using high speed RAM. For this, at JAVA Card as a application of RAM, I will present prefetching LRU-ORL Buffer Cache Technique that is suitable for Java Card environment. As a data character, managing all data created from JAVA Curd at Buffer Cache, decrease times of recording at maximum for EEPROM so that JAVA Card program upload and execution speed will be improved.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.5
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• pp.367-373
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• 2001

A programmable A/D converter is designed with 8 N and P channel MOSFETs, respectively. In order to observe linear programmability of the EEPROM device during programming mode, a cell is developed with a 1.2 ${\mu}{\textrm}{m}$ double poly CMOS fabrication process in MOSIS. It is observed that the high resolution, of say 10m Volt, is valid in the range 1.25volts to 2volts. The experimental result is used for simulating the programmable 8 bit A/D converter with Hspice. The A/D converter is demonstrated to consume low power, 37㎽ by utilizing a programming operation. In addition, the converter is attained at the conversion frequency of 333 MHz.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.9
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• pp.56-63
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• 1997

There generally exists a large variation in the thereshold voltages of the flash EEPROM cells after they are erased by using th fowler-nordheim tunneling, thereby getting some cells to be overeased. If the overerased cells are programmed with the conventional one-step programming scheme where an 12-13V pulse with the duration of 100.mu.S is applie don the control gate for the programming, they can suffer from the significant degradation of the reliability of the gate oxide. A two-step programming schem, where an 8/12 V pulse with a duration of 50.mu.S for each voltage is applied on the control gate for the programming, has been studied to solve the problem. The experimental results hav eshown that there is little difference in the programming characteristics between those two schemes, whereas the degradation of the gate oxide due to the programming can be significantly reduced with the two-step programming scheme compared to that with the one-step programming scheme. This is possibly because the positive charge stored in the floating gate of the overerased cells is compensate dwith the electrons injected into the floating gate while the 8V pulse is applied on the control gate, which leaves the overerased cells in the normally erased state after the duration of the 8V pulse.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.107-116
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• 1996

Recently, the flash memory has been abstracting great attention in the semiconductor market in the world because of its potential applications as mass storage devices. One of the most significant barriers to the scalling-down of the stacked-gate devices such as EPROM's and flash EEPROM's is the large subthreshold leakage in the unselected cells connected with the bit line of a selected cell in the array during programming. The large subthreshold leakge is majorly due to the capacitive coupling between the floating gates of the unselectd cells and the bit line of selected cell. In this paper, a new programming method to redcue significantly the drain turn-on leakage in the unselected cells during programming has been studied, where a little positive voltage (0.25-0.75V) is applied to the soruce during programming unlike the conventional programming method in which the source is grounded. The resutls of the PISCES simulations and the electrical measurements for the standard EPROM with 0.35.mu.m effective channel length and 1.0.mu.m effective channel width show that the subthreshold leakage in the unselectd cells is significantly large when the source is grounded, whereas it is negligibly small when the source is biased ot a little positive voltage during programming. On the other hadn, the positive bias on the source is found to have little effects on the programming speed of the EPROM.

• Electrical & Electronic Materials
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• v.6 no.4
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• pp.330-338
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• 1993

Channel의 폭과 길이가 15 x 15.mu.m, 15 x 1.5.mu.m, 1.9 x 1.7.mu.m인 비휘발성 SNOSFET EEPROM 기억소자를 CMOS 1 Mbit 설계규칙에 의하여 제작하고 체널크기에 따른 $I_{D}$- $V_{G}$특성 및 스위칭 특성을 조사하여 비교하였다. 게아트에 전압을 인가하여 질화막에 전하를 주입시키거나 소거시킨 후 특성을 측정한 결과, 드레인전류가 적게 흐르는 저전도상태와 전류가 많이 흐르는 고전도상태로 되는 것을 확인하였다. 15 x 15.mu.m의 소자는 전형적인 long channel특성을 나타냈으며 15 x 1.5.mu.m, 1.9 x 1.7.mu.m는 short channel특성을 보였다. $I_{D}$- $V_{G}$ 특성에서 소자들의 임계 문턱전압은 저전도상태에서 $V_{W}$=+34V, $t_{W}$=50sec의 전압에서 나타났으며 메모리 윈도우 폭은 15 x 15.mu.m, 15 x 1.5.mu.m, 1.9 x 1.7.mu.m의 소자에서 각각 6.4V, 7.4V, 3.5V였다. 스위칭 특성조사에서 소자들은 모두 논리스윙에 필요한 3.5V 메모리 윈도우를 얻을 수 있었으며 논리회로설계에 적절한 정논리 전도특성을 가졌다.특성을 가졌다.다.다.

• Electrical & Electronic Materials
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• v.8 no.6
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• pp.727-736
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• 1995

This paper examines the characteristics and physical properties of the scaled MONOS nonvolatile memory device for low programming voltage EEPROM. The capacitor-type MONOS memory devices with the nitride thicknesses ranging from 41.angs. to 600.angs. have been fabricated. As a result, the 5V-programmable MONOS device has been obtained with a 20ms programming time by scaling the nitride thickness to 57.angs. with a tunneling oxide thickness of 19.angs. and a blocking oxide thickness of 20.angs.. Measurement results of the quasi-static C-V curves indicate, after 10$\^$6/ write/erase cycles, that the devices are degraded due to the increase of the silicon-tunneling oxide interface traps. The 10-year retention is impossible for the device with a nitride less than 129.angs.. However, the MONOS memory device with 10-year retentivity has been obtained by increasing the blocking oxide thickness to 47.angs.. Also, the memory traps such as the nitride bulk trap and the blocking oxide-nitride interface trap have been investigated by measuring the maximum flatband voltage shift and analyzing through the best fitting method.

• Transactions on Electrical and Electronic Materials
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• v.12 no.1
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• pp.35-39
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• 2011

An electrically erasable programmable read-only memory (EEPROM) containing a stacked metal-insulator-metal (MIM) and n-well capacitor is proposed. It was fabricated using a 0.18 $\mu$m standard complementary metal-oxide semiconductor process. The depletion capacitance of the n-well region was effectively applied without sacrificing the cell-area and control gate coupling ratio. The device performed very similarly to the MIM capacitor cell regardless of the smaller cell area. This is attributed to the high control gate coupling ratio and capacitance. The erase speed of the proposed EEPROM was faster than that of the cell containing the MIM control gate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.855-858
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• 2001

The stress induced leakage currents of thin silicon oxides is investigated in the VLSI implementation of a self learning neural network integrated circuits using a linearity synapse transistor. The channel current for the thickness dependence of stress current, transient current, and stress induced leakage currents has been measured in oxides with thicknesses between 41 ${\AA}$, 86${\AA}$, which have the channel width ${\times}$ length 10 ${\times}$1${\mu}$m, 10 ${\times}$0.3${\mu}$m respectively. The stress induced leakage currents will affect data retention in synapse transistors and the stress current, transient current is used to estimate to fundamental limitations on oxide thicknesses. The synapse transistor made by thin silicon oxides has represented the neural states and the manipulation which gaves unipolar weights. The weight value of synapse transistor was caused by the bias conditions. Excitatory state and inhitory state according to weighted values affected the channel current. The stress induced leakage currents affected excitatory state and inhitory state.

• Proceedings of the KIEE Conference
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• 2004.07d
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• pp.2634-2636
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• 2004

다목적실용위성2호의 위성 본체시스템에는 지상과 연락을 담당하는 주 컴퓨터인 OBC, 위성의 자세를 제어를 위한 원격구동장치인 RDU 그리고 위성의 전원분배를 제어장치인 ECU인 3개의 동일 프로세서(386)가 탑재되어 각 담당 임무를 수행하는 분산형 구조를 갖고 있다. 각 프로세서는 EEPROM과 SRAM 데이터 메모리를 갖고 있는데 전원 리셋이 일어나면 모든 프로그램은 EEPROM에서 SRAM으로 복사되어 운영 프로그램이 실행하도록 되어 있다. 그러나 SRAM은 우주환경에서 위성체는 방사선에 노출되어 손상을 입을 때 SEU이 발생되어 정보가 왜곡되거나 상실되는 문제를 갖고 있다. 그러므로 본 논문에서는 변형된 해밍코드 기법을 이용하여 데이터를 수신하는 곳에서 에러를 검출 및 수정하는 디지털 회로 설계방법을 기술하고자 한다.

• Journal of Electrical Engineering and information Science
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• v.2 no.3
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• pp.132-138
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• 1997

Electrical characteristics of split-gate flash EEPROM with triple polysilicon is investigated in terms of effects of floating gate and offset gate. In order to search for t the effects of offset gate on programming characteristics, threshold voltage and drain current are studied with variation of control gate voltage. The programming process is believed to depend on vertical and horizontal electric field as well as offset gate length. The erase and program threshold voltage are found to be almost constant with variation of control gate voltage above 12V, while endurance test indicates degradation of program threshold voltage. With increase of offset gate length, program threshold voltage becomes smaller and the drain source voltage just after program under constant control gate voltage becomes higher.