• Journal of Electrical Engineering and Technology
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• v.13 no.5
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• pp.2033-2044
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• 2018

This study presents states-of-the art overview of the system level electrostatic discharge (ESD) analysis and testing. After brief description of ESD compliance standards and ESD coupling mechanisms, the study provides an in-depth review and comparison of the various techniques for the system level ESD coupling analysis using time and frequency domain techniques, full wave electromagnetic modeling and hybrid modeling. The methods used for improving system level ESD testing using troubleshooting and determining the root causes of soft failures, the optimization of ESD testing and the countermeasures to mitigate ESD problems are also discussed.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.7
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• pp.1079-1083
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• 2002

We made ESD tester to measure ESD threshold voltage of semiconductor devices. The HBM ESD test is the most popular method to measure the ESD threshold voltage of MMSIC. We use flyback method which is one of the DC-DC converter to get high ESD voltage. With flvback method, we can isolate the 1ow voltage part from the high voltage part of HBM ESD tester. We use an air gap of the relay which is used for switch to satisfy the rise time of ESD standard(MIL-STD). As a result, with the flyback method and the air gap of relay, we can make ESD tester whose parasitic components are minimized.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.8
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• pp.36-46
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• 2010

In multi-GHz RF ICs and high-speed digital interfaces, ESD protection devices introduce considerable parasitic capacitance and resistance to inputs and outputs, thereby degrading the RF performance, such as input/output matching, gain, and noise figure. In this paper, the impact of ESD protection devices on the performance of RF ICs is investigated and design methodologies to minimize this impact are discussed. With RF and ESD test results, the 'RF/ESD co-design' method is discussed and compared to the conventional RF ESD protection method which focuses on minimizing the device size.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.11a
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• pp.469-472
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• 2002

We made ESD tester to measure ESD threshold voltage of semiconductor devices. The HBM ESD test is the most popular method to measure the ESD threshold voltage of MMIC. We use flyback method which is one of the DC-DC converter to get high ESD voltage. With flyback method, we can isolate the low voltage part from the high voltage part of HBM ESD tester. We use an air gap of the relay which is used for switch to satisfy the rise time of ESD standard(MIL-STll-883D). As a result, with the flyback method and the air gap of relay, we can make ESD tester whose parasitic components are minimized.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.05a
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• pp.288-292
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• 2002

We propose the new type of on-chip ESD protection method for RF applications. By using the properties of RF circuits, we can use the short-circuited stub as ESD protection device in front of the DC blocking capacitor Specially, we can use short-circuited stub as the portion of the matching circuit so to reduce the and various parameters of the transmission line. This new type ESD protection method is very different from the conventional ESD protection method. With the new type ESD protection method, we remove the parasitic capacitance of ESD protection device which degrade the performance of core circuit.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.11
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• pp.97-106
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• 1992

In integrated circuits, protection circuits are required to protect the internal nodes from the harmful ESD(Electrostatic discharge). This paper discusses the characteristics of the circuit components in ESD protection circuitry in order to analyze the ESD phenomina, and the design methodalogy of ESD protection circuits, using test pattern with a variation of the number of diode and transistor. The test devices are fabricated using a 0.8$\mu$m CMOS process. SPICE simulation was also carried out to relate output node voltage and measured ESD voltage. With increasing number of diodes and transistors in protection circuit, the ESD voltage also increases. The ESD voltage of the bi-directional circuit for both input and output was 100-300[V], which in higher than that of only output(uni-directional) circuit. In addition, the ESD protection circuit with the diode under the pad region was useful for the reduction of chip size and parasitic resistance. In this case, ESD voltage was improved to a value about 400[V].

• Journal of Fisheries and Marine Sciences Education
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• v.27 no.6
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• pp.1797-1811
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• 2015

This study is to analyze the local community-connected Education for Sustainable Development (ESD) programs that 17 clubs' students and teachers developed and implemented for their ESD club activities in elementary and middle schools. For this study, ESD elements in the programs are analyzed and the way of connection between the local communities' organizations and the ESD clubs is inquired. The process of ESD club activities is also analyzed and the change of students after the local community-connected ESD club activities is examined. Finally, the way of dissemination to local communities after ESD club activities is inquired. This study is to contribute to the practice of the local community-connected ESD in a way that develops core competencies in elementary and middle school students that will allow them to build a sustainable future in local communities.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1289-1294
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• 2008

Electrostatic discharge(ESD) phenomenon is a serious reliability concern. It causes approximately most of all field failures of IC. To quality the ESD immunity of IC product, there are some test methods and standards developed. ESD events have been classified into 3 models, which are HBM, MM and CDM. All the test methods are designed to evaluate the ESD immunity of IC products. This study provides an overview among ESD test methods on ICs and an efficient ESD stress method. We have estimated on all pin combination about the positive and negative ESD stress. We make out the weakest stress mode. This mode called a worst-case mode. We proposed that positive supply voltage pin and I/O pin combination is efficient because it is a worst-case mode.

• Journal of IKEEE
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• v.24 no.3
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• pp.890-894
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• 2020

In this paper, we propose an ESD protection device with improved electrical characteristics through structural changes of LVTSCR, a typical ESD protection device. The proposed ESD protection device has a higher holding voltage than the existing LVTSCR by inserting a long N+ drift region and additional P-Well and N-Well, and improves the latch-up immunity, a chronic disadvantage of a general SCR-based ESD protection device. In addition, the effective base width of parasitic BJTs was set as a design variable, and the electrical characteristics of the proposed ESD protection device were verified through Synopsys' TCAD simulation so that it can be applied to the required application by applying the N-Stack technology.

• Journal of IKEEE
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• v.25 no.1
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• pp.168-173
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• 2021

In this paper, we propose a new structure of ESD protection device that achieves improved electrical characteristics through structural change of LVTSCR, which is a general ESD protection device. In addition, it applies N-Stack technology for optimized design in the ESD Design Window according to the required voltage application. The N-Well area additionally inserted in the existing LVTSCR structure provides an additional ESD discharge path by electrically connecting to the anode, which improves on-resistance and temperature characteristics. In addition, the short trigger path has a lower trigger voltage than the existing LVTSCR, so it has excellent snapback characteristics. In addition, Synopsys' T-CAD Simulator was used to verify the electrical characteristics of the proposed ESD protection device.