• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.6
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• pp.293-299
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• 2004

In this paper, thermal and mechanical properties of electric epoxy with water aging were discussed. We made elastic epoxy specimen adding a ratio of 0〔phr〕20〔phr〕, 35〔phr〕 and 53〔phr〕 with modifier to existing epoxy. We studied mechanical property of elastic resin after absorption in water from 0 to 484 hours. As a result, diffusion factor of elastic epoxy showed 20-21${\times}$10$^{-4}$ $\textrm{mm}^2$/s and general epoxy showed 9.5${\times}$10$^{-4}$ $\textrm{mm}^2$/s. Elastic property increased linearly according to addiction and decreased according to water absorption. Tensile strength was reduced according to addition. It was affected by water absorption of micro-void of elastic epoxy. Hardness inclined to decrease after increasing according to absorbed time. In water-absorption state, it was experimented a change of heat flow by temperature of elastic epoxy and change of thermal expansion coefficient. DSC (Differential Scanning Calorimetry) and TMA (Thermomechanical Analysis) equipments were used to measure Tg. A temperature ringe of DSC was from -0($^{\circ}C$) to 200($^{\circ}C$). One of TMA was from -0($^{\circ}C$) to 350($^{\circ}C$). In addition, we investigated structural analysis of water absorbed specimen using SEM (Scanning Electron Microscope).

• Proceedings of the KIEE Conference
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• 2004.11a
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• pp.197-199
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• 2004

In this paper, we studied a accuracy for CT using elastic epoxy. According to industry development, the quality where also the electric material is various is demanded. Insulation material is widely used because epoxy is superior to electrical and mechanical property. Until now, the possibility where the crack will occur is high because epoxy used to electrical products had high hardness. If thermal expansion is different of two material, contraction of epoxy heavily transformed turns ratio of CT. Elastic epoxy absorbed in expansion and contraction of substance material by temperature. So we could design more exacted CT. We had elastic test of elastic epoxy and made CT using elastic epoxy. At the result, We obtained turns ratio of within 4% superior to existing CT.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.4
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• pp.192-199
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• 2004

Elastic-factor of elastic epoxy were investigated by TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis), TGA (Thermogravimetric Analysis) and FESEM (Field Emission Scanning Electron Microscope) for structure-images analysis as toughness-investigation to improve brittleness of existing epoxy resin. A range of measurement temperature of the TMA and DMTA was changed from -20($^{\circ}C$) to $200^{\circ}(C)$, and TGA was changed from $0^{\circ}(C)$ to $600^{\circ}(C)$. Glass transition temperature (Tg) of elastic epoxy was measured through thermal analysis devices with the content of 0(phr), 20(phr) and 35(phr). Also, thermal expansion coefficient (a), high temperature, modulus and loss factor were investigated through TMA, TGA, and DMTA. In addition, the structure of specimens was analyzed through FESEM, and then elastic-factor of elastic epoxy was visually showed by FESEM. As thermal analysis results, 20(phr) was more excellent than 30(phr) thermally and mechanically. Specially, thermal expansion coefficient, high temperature, modulus, and damping properties were excellent. By structure-images analysis through FESEM, we found elastic-factor of elastic epoxy that is not existing epoxy, and proved high impact.

• Proceedings of the KIEE Conference
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• 2008.09a
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• pp.199-202
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• 2008

In this paper, we studied a accuracy for CT using elastic epoxy. According to industry development, the quality where also the electric material is various is demanded. Insulation material is widely used because epoxy is superior to electrical and mechanical property. Until now, the possibility where the crack will occur is high because epoxy used to electrical products had high hardness. If thermal expansion is different of two material, contraction of epoxy heavily transformed turns ratio of CT Elastic epoxy absorbed in expansion and contraction of substance material by temperature. So we could design more exacted CT We had elastic test of elastic epoxy and made CT using elastic epoxy. At the result, We obtained turns ratio of within 4% superior to existing CT.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.5
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• pp.230-235
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• 2004

In this paper, epoxy elasticity factors were investigated by TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis) and FESEM (Field Emission Scanning Electron Microscope) to improve toughness and reduce brittleness of existing epoxy resin. Dumbbell shaped specimens were made and tested at rates of 0, 20 and 35phr (part per hundred resins). TMA temperatures ranged from -2$0^{\circ}C$ to 20$0^{\circ}C$. Tg (glass transition temperature) of elastic epoxy was measured by thermal analysis. Also investigated were thermal expansion coefficient ($\alpha$), modulus and Tan$\delta$ (loss factor). And we analyzed structure through FESEM, could find elastic-factors of elastic epoxy that is not existing-epoxy. In addition, we measured permittivity and Tan$\delta$ for investigation of the electrical properties of elastic epoxy. Permittivity and Tan$\delta$ depend on elastomer composition. Namely, permittivity and Tan$\delta$ increase according to the elastomer contents. For experimental analysis results, 20phr was considered an excellent specimen.

• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.128-130
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• 2003

As toughness-investigation to improve brittleness of existing epoxy resin, elastic-factor of elastic epoxy using TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis) and FESEM (Field Emission Scanning Electron Microsope) for structure-images analysis were investigated. A range of measurement temperature of the TMA, DMTA was changed from -20[$^{\circ}C$] to 200[$^{\circ}C$]. When modifier was ratio of 0[phr], 20[phr], 35[phr], glass transition temperature (Tg) of elastic epoxy was measured through thermal analysis devices. Also, it was investigated thermal expansion coefficient ($\alpha$), modulus and loss factor through DMTA. In addition, it was analyzed structure through FSSEM and made sure elastic-factor of elastic epoxy visually. As thermal analysis results, 20[phr] was superior than 30[phr] thermally and mechanically. Specially, thermal expansion coefficient, modulus, damping properties were excellent. By structure-images analysis through FESEM, we found elastic-factor of elastic epoxy that is not existing epoxy, and proved high impact.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.460-463
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• 2003

In this paper, we present the properties of water absorption of elastic epoxy for high voltage. The ratio of water absorption shows linearly increase according to ${\sqrt}t$ till 66 hours. And rigid epoxy is 0.053 [%], elastic epoxy at addictives 35 [phr] is 0.309 and it at addictives 70 [phr] is 0.44 [%]. The reason where absorption of elastic epoxy is high is because of micro void. It can be confirmed by SEM analysis. Dieletric constant increased linearly by addictives' concentration and tans is also increased by addictives' concentration.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.208-211
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• 2003

In this paper, mechanical property of electric epoxy with water aging was discussed. We studied mechanical property of elastic resin after absorption in water from 0 to 484 hour. As a result, diffusion factor of elastic epoxy showed $20-21{\times}10^{-4}mm^2/s$ and general epoxy showed $9.5{\times}10^{-4}mm^2/s$. Elastic property increased linearly according to amount of addictives and decreased elastic property according to amount of water absorption. Tensile strength was reduced to add to addictives. It was effected by water absorption of micro-void of elastic epoxy. Hardness inclined to decrease after increasing according to absorbed time.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.319-322
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• 2004

In this paper, we studied on the thermal conductivity and a mechanical property of the elastic epoxy. According to industrial development, insulation materials have various properties. They are solid, liquid, gas state, there are various type. Epoxy, a kind of insulation material, demand of not only high hardness but also elastic property. When the electric current flows into the conductor and the place where the heat occurs, this heat becomes the cause which shortens the life of the electrical appliance. Therefore, for the heat occurred transmit quickly, thermal conductivity of the insulation material is highly demanded. We studied on the thermal conductivity of elastic epoxy on the high voltage. In this result, thermal conductivity confirmed that it followed thermal property of mixed epoxy and addictives. Hardness is decreased when addictives increased.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.2
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• pp.51-54
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• 2004

In this paper, the thermal and mechanical properties of elastic epoxy for the application of high voltage products were investigated. Glass transition temperature (Tg) of elastic epoxies cannot be found from room temperature to 20$0^{\circ}C$ by DSC (Differential Scanning Calorimetry). Weight reduction occurred at 285$^{\circ}C$ and 451$^{\circ}C$ according to a thermogravimeter. The first temperature was affected by addictives and the second by epoxies characteristic. Maximum tensile strain showed 28.3kgf/$\textrm{cm}^2$/$\textrm{cm}^2$ at 20% of mechanical stress in addictives 35 (phr). The SEM (Scanning electron microscope) micrograph of the fracture surface observed void and tearing of elastic epoxy at addictives 35 (phr). On the other side, the SEM micrograph of the rigid epoxy showed a broken trace.