• Fire Science and Engineering
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• v.16 no.3
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• pp.56-60
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• 2002

Recently, with the growth of software for electro-thermal analysis, it has been studied the precise analysis and investigation of cause for the electrical fire using computer simulation on the basis of theory for electro-thermal analysis. But it is very lacking for the precise analysis and investigation of cause for the electrical fire. In this paper, we have simulated the thermal analysis for electrical wire according to the value of current in a overload and a short with the electrical wire of the L's company product(600 V VVF) using the electro-thermal finite element method(Flux2D).

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• Fire Science and Engineering
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• v.16 no.4
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• pp.72-76
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• 2002

Nowaday, with the growth of software for electro-thermal analysis, it has been studied the precise analysis and investigation of cause for the electrical fire using computer simulation on the basis of theory for electro-thermal analysis. But it is very lacking for the precise analysis and investigation of cause for the electrical fire. In this paper, we have simulated the thermal analysis for electrical wire according to the value of current and deteriorating time in a overload and a short with the electrical wire of the L's company product(600 V VVF : Three core) using the elec-tro-thermal finite element method(Flux2D).

• Journal of Magnetics
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• v.19 no.2
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• pp.146-150
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• 2014

The objective of this paper is to provide a comparison between two transverse flux rotary machines (TFRM) with different topologies of stator cores. Depending on how to make stator core with laminated steel sheets, the one topology is 'perpendicular stacking core' and the other is 'separated core'. Both of the two cores have been designed considering 3-dimensional (3-D) magnetic flux path with the same output power conditions, but the core losses are quite different and it causes different magnetic and thermal characteristics. For comparison of these two topologies of stator cores, therefore, core losses have been calculated and used as a heat source in no-load conditions, and the thermal stress has been also calculated. 3-D finite element method has been used for the magnetic field, thermal, and stress analysis to consider the 3-D flux path of the TFRM. After comparing the analysis results of the two topologies, experimental results are also presented and discussed.

• Structural Engineering and Mechanics
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• v.62 no.5
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• pp.519-535
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• 2017

In this article, static analysis of a magneto-electro-elastic (MEE) beam subjected to various thermal loading and boundary conditions has been investigated. Influence of pyroeffects (pyroelectric and pyromagnetic) on the direct quantities (displacements and the potentials) of the MEE beam under different boundary conditions is studied. The finite element (FE) formulation of the MEE beam is developed using the total potential energy principle and the constitutive equations of the MEE material taking into account the coupling between elastic, electric, magnetic and thermal properties. Using the Maxwell electrostatic and electromagnetic relations, variation of stresses, displacements, electric and magnetic potentials along the length of the MEE beam are investigated. Effect of volume fractions, aspect ratio and boundary conditions on the direct quantities in thermal environment has been determined. The present investigation may be useful in design and analysis of magnetoelectroelastic smart structures and sensor applications.

• Journal of the Korean Society of Industry Convergence
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• v.7 no.1
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• pp.91-96
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• 2004

Overloading of electrical equipment results in excessive currents. As the heat developed in the cables is proportional to square of the current, they get overheated. The insulation on cables is generally made of materials which are damaged easily by excessive temperature. They may therefore lose their insulating properties and lead to short circuits. Since many insulating materials are combustible, they may even catch fire if the temperature rises to their ignition temperature. In this paper, we have simulated the thermal analysis for cable according to the value of current in a overload and a short with the cable of the L's company product(600 V, VV : Four Core) using the electro-thermal finite element method(Flux2D).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.22 no.4
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• pp.715-722
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• 1998

A large electric system of a vacuum circuit breaker(VCB) has been studied for the electro-thermal analysis by finite element methods. Since the heat generation in VCB causes not only energy loss but deterioration of the VCB system with oxidization of parts, the overheating of the system must be prevented. For the analysis, a finite element formulation is derived for both electric analysis and thermal analysis that are coupled together. Two sets of formulations are uncoupled after finite dimensional approximation. First, the electric potential is obtained for the entire field and scaled to the given electric current. The electric field obtained is then used to calculate the heat generation in the VCB system including contacts and connections for the calculation of the temperature distribution in the entire domain. The finite element analysis is carried out to study the effect of shapes and locations of contacts and connections. From the results, the existing VCB has been modified to enhance its capacity with reduction of heat generation and temperature elevation.

• Journal of computational fluids engineering
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• v.21 no.1
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• pp.1-9
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• 2016

Atmospheric icing may have significant effects not only on safety of aircraft in air, but also on performance of wind turbine and power networks on ground. Thus, ice protection measure should be developed to protect these systems from icing hazards. A very efficient method is the electro-thermal de-icing based on a process by which ice accretion is melted and blown away through aerodynamic forces. In this computational study, a state-of-the-art icing code, FENSAP-ICE, was used for the analysis of electro thermal de-icing system. Computational results including detailed conjugate heat transfer analysis were then validated with experimental data. Further, the computational model was applied to the DU21 airfoil section of NREL 5MW wind turbine with calculated heater parameters.

• Advances in nano research
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• v.8 no.1
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• pp.83-94
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• 2020

An analytical formulation and solution process for the buckling analysis of porous magneto-electro-elastic functionally graded (MEE-FG) beam via different thermal loadings and various boundary conditions is suggested in this paper. Magneto electro mechanical coupling properties of FGM beam are taken to vary via the thickness direction of beam. The rule of power-law is changed to consider inclusion of porosity according to even and uneven distribution. Pores possibly occur inside FGMs due the result of technical problems that lead to creation of micro-voids in these materials. Change in pores along the thickness direction stimulates the mechanical and physical properties. Four-variable tangential-exponential refined theory is employed to derive the governing equations and boundary conditions of porous FGM beam under magneto-electrical field via Hamilton's principle. An analytical model procedure is adopted to achieve the non-dimensional buckling load of porous FG beam exposed to magneto-electrical field with various boundary conditions. In order to evaluate the influence of thermal loadings, material graduation exponent, coefficient of porosity, porosity distribution, magnetic potential, electric voltage and boundary conditions on the critical buckling temperature of the beam made of magneto electro elastic FG materials with porosities a parametric study is presented. It is concluded that these parameters play remarkable roles on the buckling behavior of porous MEE-FG beam. The results for simpler states are proved for exactness with known data in the literature. The proposed numerical results can serve as benchmarks for future analyses of MEE-FG beam with porosity phases.

• Journal of Aerospace System Engineering
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• v.10 no.2
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• pp.1-6
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• 2016

The thermal analysis of electronic equipment is required to predict the reliability of electronic equipment being loaded on a satellite. The transient heat transfer of electronic equipment that was developed recently has been generated using a large-scale integration circuit. If there is a transient heat transfer between EEE(Electric, Electronic and Electro mechanical) parts, it may lead to failure the satellite mission. In this study, we performed the thermal design and analysis for reliability of APD(Antenna Pointing Driver) electronics for activation of a spaceborne X-band 2-axis antenna. The EEE parts were designed using a thermal mathematical model without the thermal mitigation element. In addition, thermal analysis was performed based on the worst case for verifying the reliability of EEE parts. For the thermal analysis results, the thermal stability of electronic equipment has been demonstrated by satisfying the de-rating junction temperature.