• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.150-152
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• 2004

The number of layers in rigid PCB(printed circuit board) is restricted, so the number of components can be embedded in module is restricted also. But using flexible multilayer PCB, the layers over than 7 can be evaluated. In this study, to verify the possibility of application of flexible multilayer PCB to RF modules, multilayered embedded capacitor is fabricated and analyzed. The characteristics of embedded capacitor is analyzed and compared to that of MLCC and LTCC capacitor. Embedded capacitor has better electrical features than MLCC and compatible one to LTCC capacitor.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.42 no.4
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• pp.1-6
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• 2005

Recently embedded passive technology which fabricate passive elements such as resistors and capacitors at the inner layer of PCB(Printed Circuit Board) is used to make high performance IT products. However, embedded capacitor has limit in full range circuit applications because of the low capacitance density. In this paper, a new embedded capacitor which has wrinkled electrodes and dielectric layer was proposed to overcome the limits. FEM(Finite Elements Method) technique was used to evaluate capacitance density of the wrinkled type embedded capacitor. Capacitance density of the wrinkled type embedded capacitor is larger than that of conventional planar type embedded capacitor by about 25.6%$\sim$39.6%. In case of thin film type embedded capacitor, proposed wrinkled structure has more enhanced effect on the capacitance density.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.57-58
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• 2005

The properties such as capacitance and resonant frequency are important in embedded capacitors. Accurate equivalent model is required to find these properties of embedded capacitor. In this paper, we investigate to analyze the properties of high-K embedded capacitor which was fabricated by Low Temperature Co-fired Ceramic (LTCC). Modeling based on partial element equivalent circuit (PEEC) method is performed using HSPICE circuit simulation. This modeling methodology can provide the good inspection of embedded capacitor to device engineer.

• The Transactions of the Korean Institute of Power Electronics
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• v.17 no.4
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• pp.306-314
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• 2012

In case of the conventional DC-AC inverter using two DC-DC converters with unipolar output capacitor voltages, for generating the AC output voltage, the output capacitor voltages of its each DC-DC converter must be higher than the DC input voltage. To solve this problem, this paper proposes a single-phase DC-AC inverter using two embedded Z-source converters with bipolar output capacitor voltages. The proposed inverter is composed of two embedded Z-source converters with common DC source and output AC load. The AC output voltage is obtained by the difference of the output capacitor voltages of each converter. Though the output capacitor voltage of converter is relatively low compared to the conventional method, it can be obtained the same AC output voltage. Moreover, by controlling asymmetrically the output capacitor voltage, the AC output voltage of the proposed system is higher than the DC input voltage. To verify the validity of the proposed system, a DSP(TMS320F28335) based single-phase embedded Z-source DC-AC inverter was made and the PSIM simulation was performed under the condition of the DC source 38V. As controlled symmetrically and asymmetrically the output capacitor voltages of each converter, the proposed inverter could produce the AC output voltage with sinusoidal waveform. Particularly, in case of asymmetric control, a higher AC output voltage was obtained. Finally, the efficiency of the proposed system was measured as 95% and 97% respectively in case of symmetric and asymmetric control.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1366-1367
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• 2006

Embedded capacitor technology is one of the effective packaging technologies for further miniaturization and higher performance of electric package systems. So we used the 3D EM simulator for embedded capacitor design in 8-layed PCB(Printed Circuit Board). The designed capacitors value are 2 pF, 5pF, 10 pF, respectly. we investigated characteristics of capacitance - frequency and SRF(Self Resonance Frequency) as changing the rate of hight and width of upper pad of embedded capacitors.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.760-763
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• 2003

Low Temperature Cofired Ceramics (LTCC) technology is a promising technology to integrate many devices in a module by embedding passive components. For the module substrate, most LTCC structures have dielectric constants below 10 to reduce signal delay time. Some components, which need high dielectric constants, have not been yet embedded in LTCC module. So, embedding capacitor with high capacitance by applying another dielectrics with high dielectric constants in LTCC is an important issue to maximize circuit density in LTCC module. In this study, electrical properties of embedded capacitor fabricated by dielectric paste of high dielectric constants (K-100) and co-firing behavior with LTCC were investigated. To prevent camber development of co-fired structure, constrained sintering process was tested. Dielectric properties of embedded capacitors were calculated from their capacitance and impedance value. Temperature coefficient of capacitance were also measured.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.311-312
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• 2007

In this study, composite $BaSrTiO_3$ has been studied for high frequency device applications. Composite $Ba_{0.5}Sr_{0.5}TiO_3$ has high dielectric permittivity and low loss tangent at the relative frequency range from MHz to GHz. 10,30 and 50 wt% of epoxy doped $Ba_{0.5}Sr_{0.5}TiO_3$ powders were prepared with bisphenol A and F polymer employing ball milling process. Epoxy/($BaSrTiO_3$) composites thick films were screen printed on the Cu plated PCB substrates through screen printing methods. The specimens were designed for the embedded capacitor applications. Temperature dependent dielectric permittivity of Epoxy doped $BaSrTiO_3$ ceramics was measured.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.119-119
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• 2005

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.11-12
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• 2008

최근 LSI speed의 고속화에 따라, SSN (Simultaneous Switching Noise)이 매우 큰 문제가 되고 있다. 이에 PDN에 대한 많은 해결책들이 제시되고 있으나 가장 저비용 고효율을 지향할 수 있는 방법이 현재 사용되고 있는 유기기판에 Capacitor를 내장하여 로 사용하는 방법이다. Decoupling capacitor를 두께가 밟은 유기기판에 구현하기 위해서는 유전율이 큰 물질을 사용하는 것이 좋은데 본 연구에서는 $BaTiO_3$를 epoxy 에 혼합하여 10um 두께의 필름으로 제작한 후 유기기판 제조 공정에 사용하여 유기기판을 구현하였다. 이렇게 구현된 capacitor 내장 유기기판을 2 stub의 간단한 회로를 구현하여 유전율 등을 측정하였으며, 고주파 전산모사를 통하여 capacitor의 용량 변화에 따른 고주파 특성의 변화를 연구하였다.

• Transactions on Electrical and Electronic Materials
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• v.10 no.4
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• pp.116-120
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• 2009

Ceramic-polymer composites have been investigated for their suitability as embedded capacitor materials because they combine the processing ability of polymers with the desired dielectric properties of ceramics. This paper discusses the dielectric properties of the ceramic ($BaTiO_3$)-polymer (Epoxy) composition as a function of ceramic particle size at a ceramic loading of 40 vol%. The dielectric constant of these ceramic-polymer composites increases as the powder size decreases. Results show that ceramic-polymer composites have a high dielectric constant associated with the $BaTiO_3$ powder with a 200 nm particle size, high insulation resistance, high breakdown voltage (> 22 KV/mm), and low dielectric loss (0.018-0.024) at 1 MHz.