• Title/Summary/Keyword: Embedding reliability

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A Study on the Design of ESD Protection Circuit for Prevention of Destruction and Efficiency of LDO Regulator (LDO 레귤레이터의 파괴방지 및 효율성을 위한 ESD 보호회로 설계에 대한 연구)

  • Jeong-Min Lee;Sang-Wook Kwon;Seung-Hwan Baek;Yong-Seo Koo
    • Journal of IKEEE
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    • v.27 no.3
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    • pp.258-264
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    • 2023
  • This paper proposes an LDO regulator with a built-in ESD (Electro Static Discharge) protection circuit to effectively operate and prevent destruction of the LDO (Low Drop Out) regulator according to the load current. The proposed LDO regulator can more effectively adjust the gate node voltage of the pass transistor according to the output voltage of the LDO regulator by using an additional feedback current circuit structure. In addition, it is expected to have high reliability for the ESD situation by embedding a new structure that increases the holding voltage by about 2V by reducing the current gain on the SCR loop by adding a P+ bridge to the existing ESD protection device.

The Impact of Coffee Shop Franchise CEO Leadership on Innovation Performance: Mediating Role of Organizational Trust (커피프랜차이즈 최고경영자의 리더십이 혁신성과에 미치는 영향: 조직신뢰의 매개효과)

  • Kang, Tae-Won;Yang, Hyun-Keun
    • The Korean Journal of Franchise Management
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    • v.7 no.2
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    • pp.37-45
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    • 2016
  • Purpose - This study aims to examine the impact of leadership on organizational trust and innovation performance, and to identify whether organizational trust plays a mediating role in the relationship between leadership and innovation performance. Also, this study attempts to find out how to improve organizational efficiency and effectiveness based on leadership-based or trust-based strategies. And, this research proposed that organizational trust plays a core mediating role in the relationship between transactional and transformational leadership and innovation performance. Research design, data, and methodology - In order to test the hypotheses of this study, the survey was conducted towards franchise coffee shop employees between November 7 and 18, 2016. We contacted top executives of coffee shop franchise headquarters and explained the purpose of this study. Among 150 questionnaires distributed, 123 were collected. Of these collected questionnaires, 102 questionnaires were coded and analyzed for further analysis. In order to test the unidimensionality and reliability of the factors, factor analysis and reliability test were performed using SPSS/PC+ 22.0. And, the hypotheses were tested using hierarchical mediated regression analysis. Result - The results are as follows. First, transactional leadership, and intellectual stimulation, motivation of transformational leadership had significant impacts on organizational trust. Second, organizational trust, transactional leadership, and influence of transformational leadership had significant impacts on innovation performance. Third, the mediating test of organizational trust showed that transactional leadership plays a partial mediator, and intellectual of transformational leadership plays a full mediator in the relationship between leadership and innovation performance. Conclusions - The implications of this study are as follows. First, the top management should provide their organizational members incentives or rewards based on their performance. Second, top management should identify and express a clear vision and desirable organizational goals for the future, present an idealized vision, and communicate to organizational members that the vision is achievable, also have organizational members to think creatively and find optimal solutions to difficult problems. In sum, this study revealed the important role of leadership in embedding organizational trust in and improving innovation performance of coffee shop employees and the mediating role of organizational trust in the influence of leadership on innovation performance.

Development of an Adaptive Overcurrent Relaying Algorithm for Distribution Networks Embedding a Large Scaled Wind Farm

  • Jang, Sung-Il;Kim, Ji-Won;Kim, Kwang-Ho
    • KIEE International Transactions on Power Engineering
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    • v.3A no.4
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    • pp.198-205
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    • 2003
  • This paper proposes the adaptive relaying of protective devices applied in the neighboring distribution feeders for reliable and efficient operations of a wind farm interconnected with distribution networks by dedicated lines. A wind farm connected to an electric power network is one of the greatest alternative energy sources. However, the wind turbine generators are influenced by abnormal grid conditions such as disturbances occurring in the neighboring distribution feeders as well as the dedicated power. Particularly, in cases of a fault happening in the neighboring distribution feeders, a wind farm might be accelerated until protective devices clear the fault. Therefore, the delayed operation time of protective devices for satisfying the coordination might overly expose the interconnected wind turbine generators to the fault and cause damage to them. This paper describes the proper delayed operation time of protective relay satisfying the coordination of the distribution networks as well as reducing damage on the interconnected wind farm. The simulation results for the Hoenggye substation model composed of five feeders and one dedicated line using PSCAD/EMTDC showed that the proper delayed time of protective devices reflecting the fault condition and the power output of the wind farm could improve the operational reliability, efficiency, and stability of the wind farm.

Wide-Input Range Dual Mode PWM / Linear Buck Converter with High robustness ESD Protection Circuit

  • Song, Bo-Bae;Koo, Yong-Seo
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.15 no.2
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    • pp.292-300
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    • 2015
  • This paper proposes a high-efficiency, dual-mode PWM / linear buck converter with a wide-input range. The proposed converter was designed with a mode selector that can change the operation between PWM / linear mode by sensing a load current. The proposed converter operates in a linear mode during a light load and in PWM mode during a heavy load condition in order to ensure high efficiency. In addition, the mode selector uses a bit counter and a transmission gate designed to protect from a malfunction due to noise or a time-delay. Also, in conditions between $-40^{\circ}C$ and $140^{\circ}C$, the converter has variations in temperature of $0.5mV/^{\circ}C$ in the PWM mode and of $0.24mV/^{\circ}C$ in the linear mode. Also, to prevent malfunction and breakdown of the IC due to static electricity, the reliability of IC was improved by embedding a self-produced 8 kV-class(Chip level) ESD protection circuit of a P-substrate Triggered SCR type with high robustness characteristics.

Feasibility Study of the Damage Monitoring for Composite Materials by the Piezoelectric Method (압전기법을 이용한 복합재료 손상모니터링의 가능성에 관한 연구)

  • Hwang, Hui-Yun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.32 no.11
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    • pp.918-923
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    • 2008
  • Since crack detection for laminated composites in-service is effective to improve the structural reliability of laminated composites, it have been tried to detect cracks of laminated composites by various nondestructive methods. An electric potential method is one of the widely used approaches for detection of cracks for carbon fiber composites, since the electric potential method adopts the electric conductive carbon fibers as reinforcements and sensors and the adoption of carbon fibers as sensors does not bring strength reduction induced by embedding sensors into the structures such as optical fibers. However, the application of the electric method is limited only to electrically conductive composite materials. Recently, a piezoelectric method using piezoelectric characteristics of epoxy adhesives has been successfully developed for the adhesive joints because it can monitor continuously the damage of adhesively bonded structures without producing any defects. Polymeric materials for the matrix of composite materials have piezoelectric characteristics similarly to adhesive materials, and the fracture of composite materials should lead to the fracture of polymeric matrix. Therefore, it seems to be valid that the piezoelectric method can be applied to monitoring the damage of composite materials. In this research, therefore, the feasibility study of the damage monitoring for composite materials by piezoelectric method was conducted. Using carbon fiber epoxy composite and glass fiber composite, charge output signals were measured and analyzed during the static and fatigue tests, and the effect of fiber materials on the damage monitoring of composite materials by the piezoelectric method was investigated.

Product and Properties of Embedded Capacitor by Aerosol Deposition (Aerosol Deposition에 의한 Embedded Capacitor의 제조 및 특성 평가)

  • Yoo, Hyo-Sun;Cho, Hyun-Min;Park, Se-Hoon;Lee, Kyu-Bok;Kim, Hyeong-Joon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.313-313
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    • 2008
  • Aerosol Deposition(AD) method is based on the impact consolidation phenomenon of ceramic fine particles at room temperature. AD is promising technology for the room temperature deposition of the dielectrics thin films with high quality. Embedding of passive components such as capacitors into printed circuit board is becoming an important strategy for electronics miniaturization and device reliability, manufacturing cost reduction. So, passive integration using aerosol deposition. In this study, we examine the effects of the characteristics of raw powder on the thickness, roughness, electrical properties of $BaTiO_3$ thin films. Thin films were deposited on the copper foil and copper plate. Electrical and material properties was investigated as a change of annealing temperature. We final aim the effects of before and after of laminated on the electrical properties and suit of embedded capacitor.

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The characteristics of bismuth magnesium niobate multi layers deposited by sputtering at room temperature for appling to embedded capacitor (임베디드 커패시터로의 응용을 위해 상온에서 RF 스퍼터링법에 의한 증착된 bismuth magnesium niobate 다층 박막의 특성평가)

  • Ahn, Jun-Ku;Cho, Hyun-Jin;Ryu, Taek-Hee;Park, Kyung-Woo;Cuong, Nguyen Duy;Hur, Sung-Gi;Seong, Nak-Jin;Yoon, Soon-Gil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.62-62
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    • 2008
  • As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

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The Study on Chip Surface Treatment for Embedded PCB (칩내장형 PCB 공정을 위한 칩 표면처리 공정에 관한 연구)

  • Jeon, Byung-Sub;Park, Se-Hoon;Kim, Young-Ho;Kim, Jun-Cheol;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.3
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    • pp.77-82
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    • 2012
  • In this paper, the research of IC embedded PCB process is carried out. For embedding chips into PCB, solder-balls on chips were etched out and ABF(Ajinomoto Build-ip Film), prepreg and Cu foil was laminated on that to fabricate 6 layer build-up board. The chip of which solder ball was removed was successfully interconnected with PCB by laser drilling and Cu plating. However, de-lamination phenomenon occurred between chip surface and ABF during reflow and thermal shock. To solve this problem, de-smear and plasma treatment was applied to PI(polyimide) passivation layer on chip surface to improve the surface roughness. The properties of chip surface(PI) was investigated in terms of AFM(Atomic Force Micrometer), SEM and XPS (X-ray Photoelectron Spectroscopy). As results, nano-size anchor was evenly formed on PI surface when plasma treatment was combined with de-smear(NaOH+KMnO4) process and it improved thermal shock reliability ($260^{\circ}C$-10sec solder floating).

A Design of Wide-Bandwidth LDO Regulator with High Robustness ESD Protection Circuit

  • Cho, Han-Hee;Koo, Yong-Seo
    • Journal of Power Electronics
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    • v.15 no.6
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    • pp.1673-1681
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    • 2015
  • A low dropout (LDO) regulator with a wide-bandwidth is proposed in this paper. The regulator features a Human Body Model (HBM) 8kV-class high robustness ElectroStatic Discharge (ESD) protection circuit, and two error amplifiers (one with low gain and wide bandwidth, and the other with high gain and narrow bandwidth). The dual error amplifiers are located within the feedback loop of the LDO regulator, and they selectively amplify the signal according to its ripples. The proposed LDO regulator is more efficient in its regulation process because of its selective amplification according to frequency and bandwidth. Furthermore, the proposed regulator has the same gain as a conventional LDO at 62 dB with a 130 kHz-wide bandwidth, which is approximately 3.5 times that of a conventional LDO. The proposed device presents a fast response with improved load and line regulation characteristics. In addition, to prevent an increase in the area of the circuit, a body-driven fabrication technique was used for the error amplifier and the pass transistor. The proposed LDO regulator has an input voltage range of 2.5 V to 4.5 V, and it provides a load current of 100 mA in an output voltage range of 1.2 V to 4.1 V. In addition, to prevent damage in the Integrated Circuit (IC) as a result of static electricity, the reliability of IC was improved by embedding a self-produced 8 kV-class (Chip level) ESD protection circuit of a P-substrate-Triggered Silicon Controlled Rectifier (PTSCR) type with high robustness characteristics.

Characteristics of Embedded R, L, C Fabricated by Using LTCC-M Technology and Development of a PAM for LMR thereby (LTCC-M 기술을 이용한 내부실장 R, L, C 수동소자의 특징 및 LMR용 PAM개발)

  • 김인태;박성대;강현규;공선식;박윤휘;문제도
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.1
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    • pp.13-18
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    • 2000
  • Low temperature co-fired ceramics on metal (LTCC-M) is efficient for embedding passive components with good tolerance in a module due to the dimensional stability in x and y directions by the constraint of metal core during the firing. In addition, the radiation noise can be reduced by metal core. In this paper, embedded passive components were introduced and a power amplifier module (PAM) fabricated by using the passive components was explained. The embedded passive components in test patters showed the tolerance of 10~20% and the good repeatability in tolerance of embedded passives was maintained in module fabrication. The shortened traces in multi chip modules (MCMs) make the signal delay time decreased and the embedded passives simplify the packaging processes owing to the less solder points, which enhance the electrical performance and increase the reliability of the modules. The LTCC-M technology is one of the promising candidates for RF application and is expected to expand its applications to power and high performance devices.

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