• Elastomers and Composites
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• 제57권2호
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• pp.48-54
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• 2022

A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.

• 접착 및 계면
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• 제21권2호
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• pp.65-70
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• 2020

각각의 다른 복합재료를 연결하는 데 주로 에폭시 접착제가 사용되고 있다. 에폭시 접착제 대표적인 열경화성 수지로서 에폭시와 경화제의 경화 반응을 통해 선형구조에서 3차원의 망상 구조로 변하게 되어 접착을 한다. 경화제의 종류에 따라 비율 및 경화 조건 등이 변하며, 이러한 조건에 따라 물성이 달라진다. 접착공정이 대형화 됨에 따라 접착제를 바르고 즉시 접착하지 못하기 때문에, 대기시간동안 습도 및 온도 등 외부환경에 영향을 받아 접착제의 접착력 저하로 이어지게 된다. 본 논문에서는 유리섬유강화 복합재료에 에폭시 접착제를 사용하여 접착하였고, 단일 랩 전단 시험을 통하여 가사시간에 따른 에폭시 접착제의 접착강도를 평가하였다. 가사시간에 따른 접착력 변화를 확인하기 위하여, 복합재료에 에폭시 접착제를 바르고 상온에서 각 시간에 따라 대기한 후 접착하였다. 단일 랩 전단 강도를 통하여 일정시간 이상 가사시간을 오래 둘 수록 접착강도가 감소한다는 것을 확인하였다. 습도조건에 따른 접착력 변화를 확인하기 위하여, 경화습도 조건을 항온항습기로 조절하여 경화 시켰고, 습도조건에 따른 접착 강도를 단일 랩 전단 시험을 통해 접착력을 평가하였다. 적은 양의 수분은 에폭시 접착제의 경화 반응을 가속시켜 접착 강도를 증가시켰으나, 일정 이상의 과도한 수분은 오히려 접착강도를 감소시킴을 확인하였다.

• 한국건축시공학회지
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• 제7권3호
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• pp.107-113
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• 2007

This study is to investigate adhesive properties depending on the temperature, humidity, and freeze-thraw of the Steel plate adhesive strengthening method by the epoxy resin. The results are summarized as following. For the temperature variation, the debonding failure appear only after 1 cycle of temperature varoation because the coefficient of thermal expansion of the epoxy resin is comparatively large, and the bonding strength is decreased. The deformation properties and ultrasonic pulse velocity on each materials are similar until 4 cycles on the dry and moisture test. As the freeze-thraw test, the epoxy resin is degraded easily subjected to freeze-thaw cycle, comparatively easy, so the debonding failure may occur in short term because of the freeze-thaw repeatition.p

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2020년도 봄 학술논문 발표대회
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• pp.128-129
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• 2020

In this study, flexural strength and tile adhesion strength were evaluated by using a mortar, dry mortar and an epoxy resin reinforced mortar to examine the adhesion performance by reinforcing the epoxy resin adhesive. As a result, it was clearly confirmed that the effect of improving the adhesion strength by reinforcing the epoxy resin adhesive regardless of the type of tile, and in particular, when applying the epoxy resin adhesive to the porcelain and polishing tiles, it is judged that sufficient adhesion performance can be secured.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2019년도 추계 학술논문 발표대회
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• pp.62-63
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• 2019

Currently, polymer-based tile cement (Thin-bed method) and epoxy adhesive (Thick-bed method) are mainly used as tile adhesive for polishing and porcelain. In the case of epoxy adhesive, there is a low economic efficiency, there is a problem that the work efficiency is reduced by mixing the resin and the hardener. In particular, the epoxy contains a bisphenol A and amine component, there is a risk of workable disease when a worker is exposed to odor and harmful gases generated in the epoxy adhesive for a long time. Against this background, it is necessary to analyze the hazards of using epoxy adhesives indoors, and develop cementitious high performance tile adhesive products with significantly lower hazards than epoxy adhesives.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2018년도 추계 학술논문 발표대회
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• pp.79-80
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• 2018

Recently, the interest in remodeling of new and old buildings is increasing worldwide. As a result, the frequency of use of architectural adhesives has increased. Currently, adhesives used in buildings are made of organic materials in most cases, and epoxy resin adhesives are most widely used. However, epoxy resin adhesives contain formaldehyde and VOCs in the room during construction, which can cause sick house syndrome. In case of building fire, it may cause damage due to carbon monoxide generated from organic materials. It is urgent to study the problem of epoxy fill adhesive made of such organic materials. Therefore, the purpose of this study is to investigate the effect of the adhesion of epoxy resin adhesive, which is a problem of epoxy resin adhesive, which is an existing organic adhesive by using inorganic materials such as magnesia and phosphate, And the inorganic adhesive which does not emit the release amount as an inorganic material.

• 반도체디스플레이기술학회지
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• 제17권1호
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.688-693
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• 2002

Adhesive bonding is becoming one of the popular joining techniques in metal industries, since it has some advantages over other techniques such as welding and diffusion bonding, e.g., any dissimilar metals are easily adhesive-bonded together. In this study, the experiments were carried out in order to provide the statistical data with strength evaluation methods: tension, shear and four-point bending tests for thermoplastic epoxy resin based adhesive-bonded metal joints. We should certificate on the probability of the adhesive strength that has the tendency of brittle fracture, the adhesive bonding strength between metals with thermoplastic adhesive has the best probability at four-point bending test. The strength testing method that has higher probability is four-point bending test, shear test and tensile test in order.

• 한국해양공학회지
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• 제23권6호
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• pp.117-123
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• 2009

This paper presents a numerical simulation of guided ultrasonic waves propagating in aluminum-epoxy-aluminum adhesive plates. In particular, this study investigated the effect of the epoxy thickness on the dispersive patterns, such as the phase velocity and group velocity of guided ultrasonic waves. In addition to investigating the dispersive curves, a numerical simulation using the pulse-echo method was carried out. This simulation showed that the degree of sensitivity of the epoxy thickness is dependent on the curvature of the phase and group dispersion curves, the maximum amplitude of the received time signals, and the peak frequency of the real components of the Fourier transform. Then, the linear relations between the epoxy thickness and the received and transformed signals were constructed to estimate the epoxy thickness.

• Journal of Welding and Joining
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• 제31권5호
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• pp.71-76
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• 2013

The effect of zirconate having - NH functional group on the T-peel and lap shear strength of $CaCO_3$ containing structural epoxy adhesive for car body assembly was investigated. Curing behavior of epoxy adhesive samples were investigated by differential scanning calorimeter (DSC) techniques. The addition of zirconate up to 7.5 phr did not affect the curing mechanism of epoxy adhesive. While the small amount of zirconate addition less than 1.1 phr increased the cross-linking density, the excess addition of zirconate resulted in the increase of uncross-linked impurity. From the increase of T-peel and lap shear strength and the change of fracture mode from the adhesive failure to the mixed one, it was considered that the small addition of zirconate was effective in improving the adhesion strength of epoxy adhesive to the adherend and inorganic filler surfaces. The formation of uncross-linked impurity with the excess addition of zirconate was considered to decrease the joint strength by decreasing the cohesive strength of the cured epoxy.