• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.10 no.6
• /
• pp.373-377
• /
• 2000

For 6H-SiC single crystals which was obtained by sublimation growth (modified Lely process), the relation between the defects and the etch pits to be formed at the site of dislocations were discussed. Typical hexagonal etch pits were formed on (0001) basal plane. The similar hexagonal etch pit shapes were formed on the site of micropipe defects and it was realized that internal planar defects was formed with the same matrix crystal structure as grown crystals, through the observation of the etching morphology at those internal defects.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.22 no.6
• /
• pp.261-264
• /
• 2012

In this paper, we investigated characteristics of etching induced surface morphology variation by wet etching of GaN epilayer were grown on sapphire (0001) substrate by hydride vapor phase epitaxy (HVPE). As a results of scanning electron microscope (SEM) observation, three types of hexagonal etch pits (Edge, Screw, Mixed) were formed by the GaN epilayer thickness variations. A lot of etch pits, attributed to screw and mixed type TD, were observed at thinner epilayer, leading to high etch pit density. On the other hand, the thickness of GaN epilayer increased with the number of etch pits corresponding to edge and mixed dislocations, which are the majority of TDs are observed.

• Corrosion Science and Technology
• /
• v.10 no.1
• /
• pp.37-42
• /
• 2011

Aluminum was electrochemically etched in acid solution and the surface area was magnified by the formation of etch pits. Etched aluminum was covered with a compact and dense dielectric oxide film by anodization and applied to the aluminum electrolytic capacitor electrode. Capacitance of aluminum electrolytic capacitor is closely related with surface area, which depends on size and number of etch pits. Size of etch pits need to be controlled because inside of the pits can be buried by the formation of dielectric oxide film. In this work, the effect of ultrasound pretreatment on the aluminum etch pit formation and capacitance were investigated. Additionally, the relationship between the second etching effect on pit size and capacitance was studied.

• Journal of the Korean institute of surface engineering
• /
• v.30 no.1
• /
• pp.44-56
• /
• 1997

Influence of electrochemical etching conditions on capacitance gain of aluminium electrolytic on capacitor foil has been investigated by etching cubic textured high purity aluminum foil in dilute hydrochloric acid. Uniformly distributed etch pit tunnels on aluminum surface have been obtained by pretreatment aluminium foil in 10% NaOH solution for 5 minutes followed by electrochemical etching. Electrostatic capacitance of etched aluminium foil anodized to high voltage increased with the increase of current density, total charge, temperature and concentration of electrolyte up to maximum CV-value and then deceased. Election optical observation of the etched foil revealed that the density of etch of etch pits increased with the increase of current density and concentration of electrolyte. this increase of etch pit density enlarged of the increase of capacitance. However, abnormal high current density and high electrolyte concentration induced the local dissolution of the foil surface which resulted the decrease of foil capacitance.

• Korean Journal of Materials Research
• /
• v.10 no.5
• /
• pp.369-374
• /
• 2000

In order to investigate the effects of addition of 1M sulfuric acid to the etching solution or 1M hydrochloric acid on the etching behavior of aluminum foil for electrolytic capacitors, the changes in the density of etch pit, the length and diameter of etch tunnels and the capacitance were analyzed using SEM, TEM, LCR meter etc. Sulfate ion as a corrosion inhibitor was contributed to the increase of the surface area comparing with chloride ion. By adding sul-furic acid the density of etch pit and the length of etched tunnel increased and the diameter of the tunnel decreased, resulting in the increase of capacitance. It was also shown that the capacitance decreased when the current density was below $0.9A/\textrm{cm}^2$, while remarkably increased in the other case.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.07a
• /
• pp.407-408
• /
• 2005

High surface area electrodes for aluminum electrolytic capacitors are produced by AC electrochemical processes. Optimization of crystallographic etch pit growth on aluminium during AC etching of cathode film for aluminium as electrolytic capacitor has been established. In this work, we present the observations of pit distributions by galvanostatic measurements. The effects of electrolyte concentration, current density, frequency, various pre-treatments and etching time have been studied. The specimen was pretreated in 0.5M NaOH and 1M HCl at $40\sim60^{\circ}C$, and transferred into a cell containing 1M HCl, then various mol $H_2SO_4$ etchant was added. Pit size distributions were determined with scanning electron microscopy (SEM).

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.08a
• /
• pp.223.1-223.1
• /
• 2013

Since sapphire single crystal is one of the materials that have excellent mechanical and optical properties, the single crystal is widely used in various fields, and the demand for the use of substrate of LED devices is increasing rapidly. However, crystal defects such as dislocations and stacking faults worsen the properties of the single crystal intensely. When sapphire wafer of single crystal is used as LED substrate, especially, crystal defects have a strong influence on the characteristics of a film deposited on the wafer. In such a case quantitative assessment of the defects is essential, and the evaluation technique is now becoming one of the most important factors in commercialization of sapphire wafer. Wet etching is comparatively easy and accurate method to estimate dislocation density of single crystal because etching reaction primarily takes place where dislocations reached crystal surface which are chemically weak points, and produces etch pit. In the present study, the formation behavior of etch pits and etching time dependence were studied systematically. Etch pit density(EPD) analysis using optical microscope was also conducted and measurement uncertainty of EPD was studied to confirm the reliability of the results. EPDs and measurement uncertainties for 4 inch sapphire wafers were analyzed in terms of 5 and 21 points EPD readings. EPDs and measurement uncertainties in terms of 5 points readings for 4 inch wafers were compared by 2 organizations. We found that the average EPD value in terms of 5 points readings for a 4 inch sapphire wafer may represent the EPD value of the wafer.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.7 no.4
• /
• pp.560-566
• /
• 1997

Dislocation behavior in the ZnSe crystal grown by seeded vapor transport was investigated. Etch pit shape with the ZnSe plane and dislocation arrangement were shown. Also the variation of the dislocation density in the crystal was disclosed. The dislocation density along the lateral growth direction was not changed but the dislocation density along the vertical growth direction was reduced as the crystal grew. The average dislocation density of the grown crystal was $4{\times}10^4 /\textrm{cm}^2$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.24 no.10
• /
• pp.779-783
• /
• 2011

The morphology of etch pits in commercial 4H-SiC epi-wafer were investigated by molten-KOH etching. The etching process was optimized in $525{\sim}570^{\circ}C$ at 2~10 min and the novel type of etch pits was revealed. This type of etch pits have been considered as TED (threading edge dislocation) II, its origin and nature, however, are not reported yet. In this work, the morphology and evolution of etch pits during epitaxial growth were analyzed and the different behavior between TED and TEDII was discussed.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.8 no.3
• /
• pp.454-462
• /
• 1998

Mechanisms and conditions for rounding of AUC particles were examined during AUC precipitation. Rounding of AUC particle was possible only by external circulation using pump, not by internal circulation using agitator. The rate of AUC rounding $(dn_p/dt)$ was proporational to operation conditions such as magma density $(M_t:g-U/{\iota}l)$, turn over ratio $(T_o)$ and impeller tip velocity of pump (U); $ dn_p/dt{\propto}M_t{\cdot}T_o{\cdot}U^2$. The validity of this relationship was qualitatively confirmed by comparing the expermental results. Two rounding mechanisms were suggested. One is crack formation mechanism and the other etch-pit formation mechanism on the surface of AUC particle. It was found that the crack formation is more dominant at the initial stage and the etch-pit formation at the final stage of the AUC precipitation.