• Title/Summary/Keyword: Filling Time

Search Result 789, Processing Time 0.035 seconds

Estimation of Hydrogen Filling Time Using a Dynamic Modeling (동적 모델링에 의한 수소 충전 시에 걸리는 시간의 산출)

  • NOH, SANGGYUN
    • Transactions of the Korean hydrogen and new energy society
    • /
    • v.32 no.3
    • /
    • pp.189-195
    • /
    • 2021
  • A compressed hydrogen tank is to be repressurized to 40 bar by being connected to a high-pressure line containing hydrogen at 50 bar and 25℃. Hydrogen filling time and the corresponding hydrogen temperature has been estimated when the filling process stopped according to several thermodynamic models. During the process of cooling the hydrogen tank, hydrogen temperature and pressure vs. time estimation was performed using Aspen Dynamics. Filling time, hydrogen temperature after filling hydrogen gas, cooling time and the final tank pressure after tank filling process have been completed according to the thermodynamic models are almost same.

Flow Characteristics and Filling Time Estimation for Underfill Process (언더필 공정에 대한 유동 특성과 침투 시간 예측 연구)

  • Sim, Hyung-Sub;Lee, Seong-Hyuk;Kim, Jong-Min;Shin, Young-Eui
    • Journal of Welding and Joining
    • /
    • v.25 no.3
    • /
    • pp.45-50
    • /
    • 2007
  • The present study is devoted to investigate the transient flow and to estimate the filling time fur underfill process by using the numerical model established on the fluid momentum equation. For optimization of the design and selection of process parameters, this study extensively presents an estimation of the filling time in the view points of some important factors related to underfill materials and flip-chip geometry. From the results, we conclude that the filling time changes with respect to the under fill materials because of different viscosity, surface tension coefficient and contact angle. It reveals that, as the gap height increases, the filling time decreases substantially, and goes to the saturated values.

Development of an implicit filling algorithm (암시적 방법을 이용한 충전 알고리즘의 개발)

  • Im, Ik-Tae;Kim, U-Seung
    • Transactions of the Korean Society of Mechanical Engineers B
    • /
    • v.22 no.1
    • /
    • pp.104-112
    • /
    • 1998
  • The mold filling process has been a central issue in the development of numerical methods to solve the casting processes. A mold filling which is inherently transient free surface fluid flow, is important because the quality of casting highly depends on such phenomenon, Most of the existing numerical schemes to solve mold filling process have severe limitations in time step restrictions or Courant criteria since explicit time integration is used. Therefore, a large computation time is required to analyze casting processes. In this study, the well known SOLA-VOF method has been modified implicitly to simulate the mold filling process. Solutions to example filling problems show that the proposed method is more efficient in computation time than the original SOLA -VOF method.

A Study on the Filling and Solidification Process During Gravity Casting Using Implicit VOF Method (암시적 VOF법을 이용한 중력주조에서의 충전 및 응고과정에 대한 연구)

  • Im, Ik-Tae;Kim, Woo-Seung
    • Transactions of the Korean Society of Mechanical Engineers B
    • /
    • v.24 no.1
    • /
    • pp.102-113
    • /
    • 2000
  • In this study, a three-dimensional gravity casting problem has been examined to investigate a coupled phenomenon of the filling and solidification process. This work simultaneously considers the two key phenomena of metal casting : the fluid flow during mold filling, and solidification process. The VOF method is used to analyze the free surface flow during filling and the equivalent specific heat method is employed to model the latent heat release during solidification. The time-implicit filling algorithm is applied to save the computational time for analyzing the mold filling process. The three-dimensional benchmark problem used in the MCWASP VII has been solved using both the implicit and explicit algorithm, and the present results are compared with the benchmark experimental results and the other numerical results.

Effect of additives and filling methods on whole plant corn silage quality, fermentation characteristics and in situ digestibility

  • Jiao, Ting;Lei, Zhaomin;Wu, Jianping;Li, Fei;Casper, David P.;Wang, Jianfu;Jiao, Jianxin
    • Animal Bioscience
    • /
    • v.34 no.11
    • /
    • pp.1776-1783
    • /
    • 2021
  • Objective: This project aimed to evaluate the effects of both different additives and filling methods on nutritive quality, fermentation profile, and in situ digestibility of whole plant corn silage. Methods: Whole plant corn forage harvested at 26.72% dry matter (DM) was chopped and treated with two filling methods, i) fill silos at one time (F1), ii) fill silos at three times (F3), packing samples into one/three silo capacity at the first day, another one/three capacity at the second day, then one/three at the third day, three replicates. For each replicate, samples were treated with three additives, i) control (CTRL, no additive), ii) Sila-Max (MAX, Ralco Nutrition Inc., Marshall, MN, USA), and iii) Sila-Mix (MIX, Ralco Nutrition Inc., USA). With three replicates of each secondary treatment, there were nine silos, 54 silos in total. Each silo had a packing density of 137.61 kg of DM/m3. All silos were weighed and stored in lab at ambient temperature. Results: After 60 d of ensiling, all items showed good silage fermentation under MAX filled one time or three times (p<0.01). Higher silage quality for all additives was obtained at filling one time than that filled three times (p<0.01). The highest DM and lowest DM loss rate (DMLR) occurred to MAX treatment at two filling methods (p<0.01); Digestibility of acid detergent fiber, neutral detergent fiber (NDF), and curde protein had the same results as silage quality (p<0.01). Yield of digestible DM and digestible NDF also showed higher value under MAX especially for filling one time (p<0.05). Conclusion: All corn silages showed good fermentation attributes (pH<4.0). The forage filled one time had higher silage quality than that filled three times (p<0.01). MAX with homofermentative lactic acid bacteria enhanced the lactic acid fermentation, silage quality and nutrient digestibility, and so improved the digestible nutrient yield.

Filling System Analysis for Cavity in Ground using DEM (개별요소해석을 이용한 지반공동부 주입시스템 분석)

  • Han, Jung-Geun;Kim, Young-Ho;You, Seung-Kyong;Chung, Da-Som
    • Journal of the Korean Geosynthetics Society
    • /
    • v.17 no.1
    • /
    • pp.119-126
    • /
    • 2018
  • The ground cavity occurring in the downtown area is on the increase. However, when ground subsidence is occurred or a cavity that causes it to occur is found, time and economic difficulties are follwed in recovery. In advance, this study conducted to develop filling system for reinforcement material which is consist of polymer pouch and admixture as a new filler material. We developed a polymer pouch that is water soluble in the precedent study. Since the filling system is trenchless method and don't need any plant, it has time and economic benefits. This system uses air pressure to filling out cavity in a short time. We estimate this system with respect to filling speed and filling ratio by model experiment. In addition, we could confirm various filling condition using DEM Analysis. So, we could develop filling system and analysis it.

An Experimental Study on Internal Temperature Changes of Type Ⅳ Cylinder according to Filling with Compressed Hydrogen Gas (압축수소가스 충전에 따른 타입 IV 용기의 온도 변화에 관한 실험적 연구)

  • Lee, Seung-Hoon;Kim, Youn-Gyu;Yoon, Kee-Bong
    • 한국신재생에너지학회:학술대회논문집
    • /
    • 2009.06a
    • /
    • pp.644-647
    • /
    • 2009
  • In this paper, the study is researched for related safety standards having experiments concerning temperature changes in type IV cylinder of the Hydrogen fuel cell vehicle. Experiments were performed to acquire temperature data of type IV cylinder according to filling time. The experimental results are shown that internal temperatures of type Ⅳ vessel are over $85^{\circ}C$ at all measured points after 5 minutes at filling 35 MPa and the highest temperature is getting lower when the residual gases are more remained. Consequently, the safety standards need properly limited value through further study for filling flow rate and filling time.

  • PDF

Modeling of the filling process during resin injection/compression molding

  • Chang, Chih-Yuan
    • Advanced Composite Materials
    • /
    • v.16 no.3
    • /
    • pp.207-221
    • /
    • 2007
  • The filling process of resin injection/compression molding (I/CM) can be divided into injection and compression phases. During the resin injection the mold is kept only partially closed and thus a gap is present between the reinforcements and the upper mold. The gap results in preferential flow path. After the gap is filled with the resin, the compression action initiates and forces the resin to penetrate into the fiber preform. In the present study, the resin flow in the gap is simplified by using the Stokes approximation, while Darcy's law is used to calculate the flow field in the fiber mats. Results show that most of the injected resins enter into the gap during the injection phase. The resin injection time is extremely short so the duration of the filling process is determined by the final closing action of the mold cavity. Compared with resin transfer molding (RTM), I/CM process can reduce the mold filling time or injection pressure significantly.

A STUDY ON THE MARGINAL LEAKAGE OF ENDODONTIC CAVITY FILLING MATERIALS (근관와동 가봉재의 변연누출에 관한 실험적 연구)

  • Nho, Cheol-Jin;Lim, Sung-Sam
    • Restorative Dentistry and Endodontics
    • /
    • v.12 no.2
    • /
    • pp.17-23
    • /
    • 1987
  • The purpose of this study was to evaluate the sealing properties of endodontic cavity filling materials according to the time intervals after filling. Access cavities were prepared in extracted human premolar or molar teeth and filled with caviton, zinc oxide eugenol cement, zinc oxide eugenol cement with a base of gutta percha stopping and gutta percha stopping. After filling at the intervals of immediate, 2 days and 2 weeks the teeth were immersed for 2 weeks in 1% methylene blue solutions. Longitudinal sections were obtained from approximately center of teeth and the depth of dye penetration into the access cavities were observed by 10${\times}$macrolens. The following results were obtained. I. All the materials experimented showed varying depth of dye penetration. 2. Of the material tested, caviton showed the best marginal sealing qualities regardless of the time intervals after filling and the sealing properties of the gutta percha stopping was the worst. 3. Both in zinc oxide eugenol cement and zinc oxide eugenol cement with a base of gutta percha stopping, the fillings allowed to mature for 2 days in normal saline solution showed the best sealing properties and those with no maturing time revealed the worst sealing qualities. 4. The sealing qualities of zinc oxide eugenol cement with a base of gutta percha stopping revealed slightly lower depth of dye penetration than that of zinc oxide eugenol cements.

  • PDF

Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging (3D 웨이퍼 전자접합을 위한 관통 비아홀의 충전 기술 동향)

  • Ko, Young-Ki;Ko, Yong-Ho;Bang, Jung-Hwan;Lee, Chang-Woo
    • Journal of Welding and Joining
    • /
    • v.32 no.3
    • /
    • pp.19-26
    • /
    • 2014
  • Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.