• Proceedings of the KSRS Conference
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• v.2
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• pp.804-807
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• 2006

The SRI(Super Resolution Imager) with 800mm aperture primary mirror is the ground development model of the high resolution satellite camera. The SRI focal plane electronics including detector array generates the data for high-resolution images by converting incoming light into digital stream of pixel data. Since the focal plane including a detector is the basic building block of the camera system, the main system performances is directly determined by its performance. This paper measures the SRI focal plane electronics’ performance such as the dark signal, the dark signal noise, the linearity, the PRNU(Photo Response Non-Uniformity), the SNR(Signal to Noise Ratio) and the sensor saturation capability. In addition, this paper verifies the various functionalities of the SRI focal plane electronics. The electrical test equipment with the specialized software and the optical test equipments such as the integrating sphere, the rotation stage and the target are implemented and used to verify these functionalities and performances.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.1
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• pp.45-51
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• 2005

We have developed surface micromachined Infrared ray (IR) focal plane array (FPA), in which single $SiO_{2}$ layer works as an IR absorbing plate and $Pb(Zr_{0.3}Ti_{0.7})O_{2}$ thin film served as a thermally sensitive material. There are some advantages of applying $SiO_{2}$ layer as an IR absorbing layer. First of all, the $SiO_{2}$ has good IR absorbance within $8{\sim}12{\mu}m$ spectrum range. Measured value showed about 60% absorbance of incident IR spectrum in the range. $SiO_{2}$ layer has another important merit when applied to the top of Pt/PZT/Pt stack because it works also as a supporting membrane. Consequently, the IR absorbing layer forms one body with membrane structure, which simplifies the whole MEMS process and gives robustness Ito the structure.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.1
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• pp.123-131
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• 2014

An INS/vision integrated navigation algorithm is proposed for environments with insufficient number of landmarks. In the proposed algorithm, the raw measurements on the focal plane are directly used in order to cope with the situation where the number of landmarks are not sufficient. In addition to this, the combination of landmarks, which has smallest value of DOP, is used in the update of measurement in order to improve navigation performance. In order to evaluate the performance of the proposed integrated navigation system, Monte-Carlo simulation and van test was performed. The results of the simulation and experiment show that the proposed navigation system gives better navigation performance than an INS/vision integrated navigation system which does not use the raw measurements on the focal plane and the navigation system provides navigation solutions even in environments with insufficient number of landmarks.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.12
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• pp.36-47
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• 1995

The main purpose of this paper is to determine a new focal point and field distribution due to the shape deformation of reflector antenna by numerical method such as geometrical optics and the aperture field method. It is shown the 4 types deformations to be added into original shape of parabola antenna and offset antenna: linear, quadratic, cubic and hybrid distortion. These results can be applied to deformed reflector antenna in order to fit a focal point and radiation pattern.

• Proceedings of the KSRS Conference
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• 2008.10a
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• pp.220-223
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• 2008

A camera system for the satellite application performs the mission of observation by measuring radiated light energy from the target on the earth. As a development stage of the system, the signal level analysis by estimating the number of electron collected in a pixel of an applied CCD is a basic tool for the performance analysis like SNR as well as the data path design of focal plane electronic. In this paper, two methods are presented for the calculation of the number of electrons for signal level analysis. One method is a quantitative assessment based on the CCD characteristics and design parameters of optical module of the system itself in which optical module works for concentrating the light energy onto the focal plane where CCD is located to convert light energy into electrical signal. The other method compares the design\ parameters of the system such as quantum efficiency, focal length and the aperture size of the optics in comparison with existing camera system in orbit. By this way, relative count of electrons to the existing camera system is estimated. The number of electrons, as signal level of the camera system, calculated by described methods is used to design input circuits of AD converter for interfacing the image signal coming from the CCD module in the focal plane electronics. This number is also used for the analysis of the signal level of the CCD output which is critical parameter to design data path between CCD and A/D converter. The FPE(Focal Plane Electronics) designer should decide whether the dividing-circuit is necessary or not between them from the analysis. If it is necessary, the optimized dividing factor of the level should be implemented. This paper describes the analysis of the electron count of a camera system for a satellite application and then of the signal level for the interface design between CCD and A/D converter using two methods. One is a quantitative assessment based on the design parameters of the camera system, the other method compares the design parameters in comparison with those of the existing camera system in orbit for relative counting of the electrons and the signal level estimation. Chapter 2 describes the radiometry of the camera system of a satellite application to show equations for electron counting, Chapter 3 describes a camera system briefly to explain the data flow of imagery information from CCD and Chapter 4 explains the two methods for the analysis of the number of electrons and the signal level. Then conclusion is made in chapter 5.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.8
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• pp.1461-1465
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• 2007

A micromachined sensor part for an infrared focal plane array has been designed and fabricated. Amorphous silicon was adapted as a sensing material, and silicon nitride was used as a membrane material. To get a good efficiency of infrared absorption, the sensor was made as a ${\lambda}/4$ cavity structure. All the processes were done in $0.5\;{\mu}m$ iMEMS fab. in the Electronics and Telecommunication Research Institute (ETRI). The processed MEMS sensor structure had a small membrane deflection less than $0.3\;{\mu}m$. This excellent deflection property can be attributed to the rigorous balancing of the stresses of individual layers. The efficiency of infrared absorption was more than 75% in the wavelength range $8\;-\;14\;{\mu}m$.

• Journal of Broadcast Engineering
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• v.24 no.2
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• pp.281-291
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• 2019

Depth from defocus estimates the 3D depth by using a phenomenon in which the object in the focal plane of the camera forms a clear image but the object away from the focal plane produces a blurred image. In this paper, algorithms are studied to estimate 3D depth by analyzing the degree of blur of the image taken with a single camera. The optimized object range was obtained by 3D depth estimation derived from depth from defocus using one image of a single camera or two images of different focus of a single camera. For depth estimation using one image, the best performance was achieved using a focal length of 250 mm for both smartphone and DSLR cameras. The depth estimation using two images showed the best 3D depth estimation range when the focal length was set to 150 mm and 250 mm for smartphone camera images and 200 mm and 300 mm for DSLR camera images.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.1
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• pp.87-92
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• 2002

We present a simple experimental method for determination of limiting intrinsic fixed-pattern non-uniformity (NU) due to fabrication process in two-dimensional CCD multiplexers (MUXs) that are used for hybrid focal plane arrays. Here, this is done by determining separately the two NUs viz. that are $V_T$ dependent and $V_T$ independent. From these measurements, process dependent NU can be extracted. It is argued that $V_T$ dependent NU can be eliminated by designing novel input circuits whereas $V_T$ independent NU, primarily, dependent on process control and material variations may be reduced but cannot be eliminated completely and hence limits the FPA performance eventually.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.311-316
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• 2018

An antenna-coupled bolometer-type terahertz sensor was designed, fabricated, evaluated, and utilized to obtain terahertz transmission images. The sensor consists of a thin film bowtie antenna that resonates accordingly in response to an incident terahertz beam, a heater that converts the applied current in the antenna into heat, and a microbolometer that converts the rise in temperature into a change in resistance. The device is fabricated by a bulk micromachining process on a 4-inch silicon wafer. The fabricated sensor chip has a size of $2{\times}2mm$ and an active area of $0.1{\times}0.1mm^2$. The temperature coefficient of resistance (TCR) of the bolometer film (VOx) is 2.0%, which is acceptable for bolometer applications. The output sensor signal is proportional to the power of the incident terahertz beam. Transmission images were obtained with a 2-axis scanning imaging system that contained the sensor. The small active area of the sensor will enable the development of highly sensitive focal plane array sensors in terahertz imaging cameras in the future.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.1157-1158
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• 2008

This paper describes the interface designs of Optical-Camera Electronic unit with a DFPA(Detector Focal Plane Assembly) and IDHU(Image Data Handling Unit) which meet the top-level requirement of a satellite system. Especially, the designs on the image format and timing of the Header information for the correct reconstruction of the image in the Groundstation are explained in detail.