• 제목/요약/키워드: Free joint

검색결과 572건 처리시간 0.03초

Arterial or venous free flaps for volar tissue defects of the proximal interphalangeal joint: A comparison of surgical outcomes

  • Choi, Min Suk;Roh, Si Young;Koh, Sung Hoon;Kim, Jin Soo;Lee, Dong Chul;Lee, Kyung Jin;Hong, Min Ki
    • Archives of Plastic Surgery
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    • 제47권5호
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    • pp.451-459
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    • 2020
  • Background For volar soft tissue defects of the proximal interphalangeal (PIP) joint, free flaps are technically challenging, but have more esthetic and functional advantages than local or distant flaps. In this study, we compared the long-term surgical outcomes of arterial (hypothenar, thenar, or second toe plantar) and venous free flaps for volar defects of the PIP joint. Methods This was a single-center retrospective review of free flap coverage of volar defects between the distal interphalangeal and metacarpophalangeal joint from July 2010 to August 2019. Patients with severe crush injuries (degloving, tendon or bone defects, or comminuted/intra-articular fractures), thumb injuries, multiple-joint and finger injuries, dorsal soft tissue defects, and defects >6 cm in length were excluded from the study, as were those lost to follow-up within 6 months. Thirteen patients received arterial (hypothenar, thenar, or second toe plantar) free flaps and 12 received venous free flaps. Patients' age, follow-up period, PIP joint active range of motion (ROM), extension lag, grip-strength ratio of the injured to the uninjured hand, and Quick Disabilities of Arm, Shoulder & Hand (QuickDASH) score were compared between the groups. Results Arterial free flaps showed significantly higher PIP joint active ROM (P=0.043) and lower extension lag (P =0.035) than venous free flaps. The differences in flexion, grip strength, and QuickDASH scores were not statistically significant. Conclusions The surgical outcomes of arterial free flaps were superior to those of venous free flaps for volar defects of the PIP joint.

제 2족지 근위지관절 유리피판술을 이용한 수지 근위지관절 재건 후 시행한 건박리술 (Tenolysis after the reconstruction of PIP joint of the finger using second toe PIP joint free flap)

  • 박형준;이동철;김진수;기세휘;노시영;양재원
    • Archives of Plastic Surgery
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    • 제36권4호
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    • pp.450-457
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    • 2009
  • Purpose: The second toe PIP joint free flap is a method of reconstruction used for abnormalities of the PIP joint of the finger. We report the results of the additional tenolysis in patients with a difference between passive ROM and active ROM after second toe PIP joint free flap. Methods: From March 2001 to July 2008, tenolysis was performed in patients with a difference in their active and passive ROM after second toe PIP joint free transfer, performed on 14 fingers. We performed a retrospective analysis of the medical records, noting the clinical and radiological findings. In addition, we measured the preoperative and postoperative range of motion of the PIP joint. Results: The average active ROM was $22.5^{\circ}$ at the three months after the joint transfer surgery, and was $38^{\circ}$ after additional tenolysis between five months and twelve months after the joint transfer. Conclusions: Additional tenolysis, after the second toe PIP joint free flap, might be a good option for improved results in patients with difference in active and passive ROM of a transferred PIP joint.

자유관절을 가진 2링크 암의 동특성과 제어 (Dynamic Characteristics and Control of Two-Link Arm with Free Joint)

  • 유기호
    • 한국정밀공학회지
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    • 제17권1호
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    • pp.216-223
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    • 2000
  • A robot arm with free joints has some advantages over conventional ones. A light weight and low power consumed arm can be made by a reduction of the number of joint actuators. And this arm can easily overcomes actuator failure due to unexpected accident. In general such underactuated arm does not have controllability because of the lack of joint actuators. The two-link arm with a free joint introduced in this paper is also uncontrollable in the sense of linear system theory. However, the linearized system sometimes can not represent the inherent dynamic behavior of the nonlinear system. In this paper the dynamic characteristics of the two-link arm with a free joint in view of global motion including damping and friction effect of the joints is investigated. In the case of considering only the damping effect, the controllable goal positions are confined to a specific trajectories. But in the case of considering the friction effect, the system can be controlled to arbitrary positions using the friction of the free joint as a holding brake. Also numerical example of position control is presented.

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Theoretical and experimental modal responses of adhesive bonded T-joints

  • Kunche, Mani Chandra;Mishra, Pradeep K.;Nallala, Hari Babu;Hirwani, Chetan K.;Katariya, Pankaj V.;Panda, Subhransu;Panda, Subrata K.
    • Wind and Structures
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    • 제29권5호
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    • pp.361-369
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    • 2019
  • The modal frequency responses of adhesive bonded T-joint structure have been analyzed numerically and verified with own experimental data. For this purpose, the damped free frequencies of the bonded joint have been computed using a three-dimensional finite element model via ANSYS parametric design language (APDL) code. The practical relevance of the joint structure analysis has been established by comparing the simulation data with the in-house experimental values. Additionally, the influences of various geometrical and material parameters on the damped free frequency responses of the joint structure have been investigated and final inferences discussed in details. It is observed that the natural frequency values increase for the higher aspect ratios of the joint structure. Also, the joint made up of Glass fiber/epoxy with quasi-isotropic fiber orientation indicates more resistance towards free vibration.

Pb Free 솔더를 사용한 솔더 접합부의 접합 강도 향상에 관한 연구 (Study on Joining Strength Improvement of Solder Joint with Pb Free Solder)

  • 신영의;김영탁
    • Journal of Welding and Joining
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    • 제15권2호
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    • pp.36-42
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    • 1997
  • In this paper, stability of initial strength at solder joint with lead free solders, such as Sn-In (52-48%) and Sn-Ag (96.5-3.5wt%) was studied. To obtain at solder joint with high quality, it is very important to control the temperature at the interface of solder joints. It is found that the thermal EMF (electro motive force) occurs betwee lead frame and copper pad on a substrate during reflow soldering process using heated tip. As a result of control the temperature at interface of solder joints, variation of initial strength at solder joint decreases from about $\pm40%$ to $\pm20%$, and it is realized Pb free soldering process using Sn/In and Sn-Ag solder paste.

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다문화 가정 유아들의 함께 주의하기와 언어발달 (Joint Attention and Language Development in Infants from Multi-Cultural Families)

  • 박영신
    • 아동학회지
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    • 제31권6호
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    • pp.35-50
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    • 2010
  • Joint attention, language development, and the relationship between these two variables were compared in infants from multi-cultural and Korean families. Joint attention was observed in both the Early Social Communication Scale (ESCS) and in infant-mother free play. Language development was evaluated by means of the MacArthur-Bates Communicative Development Inventory-Korean. There were no group differences in initiating and responding to joint attention in ESCS. However, in infant-mother free play, joint attention episodes were less and shorter in duration with infants from multi-cultural families than in Korean infants. The size of both the expressive and receptive vocabulary was also smaller in infants from multi-cultural families than in Korean infants. In terms of Korean infants, mean duration of joint attention episodes in free play showed a significant positive correlation with the size of the expressive vocabulary and initiating joint attention in ESCS also showed a significant positive correlation with the size of receptive vocabulary. However, none of the measures of joint attention indicated a significant relationship with the size of either expressive or receptive vocabulary in infants from multi-cultural families.

Sn-Cu-Ni계를 이용한 Pb-free wave Soldering의 공정 적용 및 신뢰성에 관한 연구 (A study on the implementation of wave soldering process and the solder joint reliability of it using Sn-Cu-Ni lead-free solder)

  • 유충식;정종만;김진수;김미진
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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    • pp.89-98
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    • 2001
  • Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shock teal. $(Cu,Ni)_6Sn_5$-type intermetallic compound of which thickness is about 5 micron was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was found at the solder joint and the newly developed product was superior to conventions; one in terms of productivity and reliability.

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다관절 로보트를 위한 충돌 회피 경로 계획 (Collision-free path planning for an articulated robot)

  • 박상권;최진섭;김동원
    • 한국경영과학회:학술대회논문집
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    • 대한산업공학회/한국경영과학회 1995년도 춘계공동학술대회논문집; 전남대학교; 28-29 Apr. 1995
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    • pp.629-634
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    • 1995
  • The purpose of this paper is to develop a method of Collision-Free Path Planning (CFPP) for an articulated robot. First, the configuration of the robot is formed by a set of robot joint angles derived fromm robot inverse kinematics. The joint space that is made of the joint angle set, forms a Configuration space (Cspace). Obstacles in the robot workcell are also transformed and mapped into the Cspace, which makes Cobstacles in the Cspace. (The Cobstacles represented in the Cspace is actually the configurations of the robot causing collision.) Secondly, a connected graph, a kind of roadmap, is constructed from the free configurations in the 3 dimensional Cspace, where the configurations are randomly sampled form the free Cspace. Thirdly, robot paths are optimally in order to minimize of the sum of joint angle movements. A path searching algorithm based on A is employed in determining the paths. Finally, the whole procedures for the CFPP method are illustrated with a 3 axis articulated robot. The main characteristics of the method are; 1) it deals with CFPP for an articulated robot in a 3-dimensional workcell, 2) it guarantees finding a collision free path, if such a path exists, 3) it provides distance optimization in terms of joint angle movements. The whole procedures are implemented by C on an IBM compatible 486 PC. GL (Graphic Library) on an IRIS CAD workstation is utilized to produce fine graphic outputs.

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정상인 보행에서 무릎관절의 유도된 강직에 따른 신체 보상 특성 (Characteristics of the Compensation for Gait of the Induced Knee Stiffness in Normal Subjects)

  • 우병훈
    • 한국운동역학회지
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    • 제23권4호
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    • pp.357-367
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    • 2013
  • The purposes of this study were investigated physical compensation for gait on induced knee stiffness in normal subjects. Ten subjects were participated in the experiment(age: $26.0{\pm}6.3$ yrs, height: $175.5{\pm}5.3$ cm, weight: $69.1{\pm}6.1$ kg). The study method adopted 3D analysis with five cameras and ground reaction force with two force-plate. Induced knee stiffness level were classified as gait pattern on ROM of knee(free level, $30^{\circ}$ restriction level, fix level). The results were as follows; In angular displacement of hip joint, left hip joint was the more extended in mid-stance on induced right knee stiffness. In angular displacement of knee joint, there was no physical compensation on induced right knee stiffness, but free knee level gait was more flexed in swing phase of right knee joint. In angular displacement of ankle joint, right ankle joint was the more dorsiflexed on induced right knee stiffness, and $30^{\circ}$ restriction level and fix level gait were less plantarflexed in TO2. In trunk tilt, free and $30^{\circ}$ restriction level gait was more backward tilt on induced right knee stiffness. In ROM of each joint, right knee joint was more larger and trunk tilt was more lower on induced right knee stiffness. In GRF, Fx was more bigger lateral force in free and $30^{\circ}$ restriction level gait, and was more bigger medial force in fix level gait. Fy was more bigger propulsion force in free level gait, and was was more bigger braking force in $30^{\circ}$ restriction level gait. Left braking force in $30^{\circ}$ restriction level gait was more bigger. Fz was no significant.

자동차 전장제품의 무연솔더 적용기술 및 솔더 접합부 열화거동 (Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics)

  • 홍원식;오철민
    • Journal of Welding and Joining
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    • 제31권3호
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    • pp.22-30
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    • 2013
  • Due to ELV banning, automotive electronics cannot use four kinds of heavy metal element (Pb, Hg, Cd, $Cr^{6+}$) from 2016. Therefore, this study was focused on degradation characteristics of Sn-3.0Ag-0.5Cu Lead-free solder joint with OSP and ENIG finsh under various reliability assessment method, as like to thermal shock test and high temeprature/high humidity test with test duration for cabin electronics. Also, we compared bonding strength degradation to other advanced research results of electronic control unit for engine room because of difference service temperature with mount location in automotive. Whisker growth phenomenon and mitigation method which were essentially consideration items for Pb-free car electronics were examined. Conformal coating is a strong candidate for mitigating whisker growth in automotive electronics. Necessary condition to adapt Pb-free in car electronics was shown.