• Title/Summary/Keyword: Heat Sinks

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Characteristics of CMP-PLA Heatsink Materials with Carbon Nanotube Contents (탄소나노튜브 양에 따른 CMP-PLA 방열 소재의 특성)

  • Kim, Young-Gon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.12
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    • pp.924-927
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    • 2013
  • In this study, we proposed CMP-PLAs to replace the Al heat sinks as heat sink materials, and investigated heat dissipation characteristics of the LED lighting devices using them. The crystallinity of the proposed CMP-PLA heat sinks decreased with increasing carbon nanotube contents in CMP-PLA. However, the thermal conductivity was improved with the increase of the carbon nanotube contents. The heat dissipation characteristics of the LED lighting devices using CMP-PLA heat sinks was improved with increasing carbon nanotube contents in CMP-PLA. For the LED lighting devices using CMP-PLA heat sinks with 40% carbon nanotube contents, the initial temperature measured at the heat sink plate was $27^{\circ}C$, which increased as time, and it was saturated around $56^{\circ}C$ after an hour. The LED lighting devices using CMP-PLA heat sinks are expected to be functional materials that can reduce their weight and improve their electric properties, compared to those using existing Al heat sinks.

Characteristics of LED Lighting Device Using Heat Sinks of 7.5 W CMP-PLA (7.5 W CMP-PLA 방열판을 적용한 LED 등기구 특성)

  • Kim, Young-Gon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.12
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    • pp.920-923
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    • 2013
  • In this paper, the characteristics of a carbon nanotube composite heat sink proposed to replace the advanced Al heat sinks for LED lighting devices were studied. Proposed CMP-PLA heat sink was made by mixing 20~70 wt% carbon nanotube, 20~70 wt% bio-degradable polymer of melt-blended PLA (poly lactic acid) and PBS (poly butylene succinate) and PLA nucleating agents composed of the mixture of soybean oil and biotites, at $150{\sim}220^{\circ}C$ with 1,000~1,500 rpm. Optical and electric characteristics of 7.5 W LED lighting devices using heat sinks with such prepared CMP-PLA were investigated. And, the properties of the heat, which was not released from the CMP-PLA type heat sinks, was also investigated. The color temperature of LED lighting devices using the CMP-PLA heat sinks was 5,956 K, which is x= 0.32 and y= 0.34 in the XY chromaticity, and the color rendering index was 75. The luminous flux and the luminous efficiency of LED lighting devices using the CMP-PLA heat sinks was 540.6 lm and 72.68 lm/W respectively. Measured initial temperature of the heat sinks was $27^{\circ}C$, and their temperature increased as time to be saturated at $52^{\circ}C$ after an hour.

Computational Investigation of the Thermal Performances of Polymer Heat Sinks Passively-Cooled by Seawater for Thermoelectric Waste Heat Recovery (열전폐열회수를 위해 수동적으로 해수냉각되는 폴리머 히트싱크 열성능의 수치적 연구)

  • Kim, Kyoung Joon
    • Journal of Advanced Marine Engineering and Technology
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    • v.39 no.4
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    • pp.432-436
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    • 2015
  • This study computationally explored the thermal performance of passively-cooled polymer heat sinks utilizing seawater. Polymer heat sinks are proposed as cooling modules of the cold sides of thermoelectric generators for waste heat recovery. 3-D Computational Fluid Dynamics (CFD) modelling was conducted for a detailed numerical study. Polyphenylene sulfide (PPS) and pyrolytic graphite (PG) were selected for the base materials of polymer heat sinks. The computational study evaluated the performance of the PPS and PG heat sinks at various fin numbers and fin thicknesses. Their performances were compared with those of aluminum (Al) and titanium (Ti) heat sinks. The study results showed that the thermal performance of the PG heat sink was 3~4 times better than that of the Ti heat sink. This might be due mainly to the better heat spreading of the PG heat sink than the Ti heat sink. The effect of the number of fins on the performance of the PG heat sink was dissimilar to the cases of the PPS and Ti heat sinks. This result can be explained by the interrelationships among heat spreading, surface area enhancement, and fluidic resistance incorporating with an increase in the number of fins.

BACKUP AND ULTIMATE HEAT SINKS IN CANDU REACTORS FOR PROLONGED SBO ACCIDENTS

  • Nitheanandan, T.;Brown, M.J.
    • Nuclear Engineering and Technology
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    • v.45 no.5
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    • pp.589-596
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    • 2013
  • In a pressurized heavy water reactor, following loss of the primary coolant, severe core damage would begin with the depletion of the liquid moderator, exposing the top row of internally-voided fuel channels to steam cooling conditions on the inside and outside. The uncovered fuel channels would heat up, deform and disassemble into core debris. Large inventories of water passively reduce the rate of progression of the accident, prolonging the time for complete loss of engineered heat sinks. The efficacy of available backup and ultimate heat sinks, available in a CANDU 6 reactor, in mitigating the consequences of a prolonged station blackout scenario was analysed using the MAAP4-CANDU code. The analysis indicated that the steam generator secondary side water inventory is the most effective heat sink during the accident. Additional heat sinks such as the primary coolant, moderator, calandria vault water and end shield water are also able to remove decay heat; however, a gradually increasing mismatch between heat generation and heat removal occurs over the course of the postulated event. This mismatch is equivalent to an additional water inventory estimated to be 350,000 kg at the time of calandria vessel failure. In the Enhanced CANDU 6 reactor ~2,040,000 kg of water in the reserve water tank is available for prolonged emergencies requiring heat sinks.

Cooling performance of an electronic system including electronic components mounted with heat sink (히트 싱크 부착 전자부품을 가진 통신시스템의 냉각성능 연구)

  • No, Hong-Gu;Lee, Jae-Heon
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.22 no.2
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    • pp.253-266
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    • 1998
  • A numerical study on the cooling performance for electronic components mounted with heat sink in an electronic system has been performed. The model of electronic system consisted with lower and upper modules in which the electronic components mounted with heat sink were arrayed. To find better configuration under a given fan power for effective cooling, the cases called 'No heat sink','Both heat sinks','Lower heat sinks', and 'Upper heat sinks' were tested. The results showed that the cooling performance in 'Upper heat sinks' was the best among four cases.

STEAM GENERATOR TUBE INTEGRITY ANALYSIS OF A TOTAL LOSS OF ALL HEAT SINKS ACCIDENT FOR WOLSONG NPP UNIT 1

  • Lim, Heok-Soon;Song, Tae-Young;Chi, Moon-Goo;Kim, Seoung-Rae
    • Nuclear Engineering and Technology
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    • v.46 no.1
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    • pp.39-46
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    • 2014
  • A total loss of all heat sinks is considered a severe accident with a low probability of occurrence. Following a total loss of all heat sinks, the degasser/condenser relief valves (DCRV) become the sole means available for the depressurization of the primary heat transport system. If a nuclear power plant has a total loss of heat sinks accident, high-temperature steam and differential pressure between the primary heat transport system (PHTS) and the steam generator (SG) secondary side can cause a SG tube creep rupture. To protect the PHTS during a total loss of all heat sinks accident, a sufficient depressurization capability of the degasser/condenser relief valve and the SG tube integrity is very important. Therefore, an accurate estimation of the discharge through these valves is necessary to assess the impact of the PHTS overprotection and the SG tube integrity of the primary circuit. This paper describes the analysis of DCRV discharge capacity and the SG tube integrity under a total loss of all heat sink using the CATHENA code. It was found that the DCRV's discharge capacity is enough to protect the overpressure in the PHTS, and the SG tube integrity is maintained in a total loss of all heat accident.

An Experimental Study on the Thermal Resistance Characteristics for Various Types of Heat Sinks (다양한 형상의 Heat Sink 열저항 특성에 관한 실험적 연구)

  • 김종하;윤재호;이창식
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.14 no.8
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    • pp.676-682
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    • 2002
  • This paper has been made to investigate the thermal performance characteristics for the several types of heat sinks such as extruded heat sink, aluminum foam heat sink, layered heat sink. The various types heat sinks are prepared and tested for natural convection as well as forced convection. The experimental results for natural convection are compared to those for three types of heat sink so that the appropriate heat sink can be designed or chosen according to the heating conditions. The overall heat transfer performances for layered heat sink, extruded heat sink and aluminum foam heat sink are almost comparable to those under natural convection and forced convection. The forced convection of layered heat sink become 1.2 times as high as those of extruded heat sink, and the forced convection of extruded heat sink become 1.2 times as high as those of aluminum foam heat sink. This study shows that bar height, bar distance and number of bar for layered heat sink are important parameters, which have a serious influence on thermal performance for layered heat sinks.

Averaging Approach for Microchannel Heat Sinks Subjected to the Uniform Wall Temperature Condition (등온 경계 조건을 가지는 마이크로채널 히트 싱크의 열성능 해석을 위한 평균 접근법)

  • Kim, Dong-Kwon;Kim, Sung-Jin
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.1247-1252
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    • 2004
  • The present paper is devoted to the modeling method based on an averaging approach for thermal analysis of microchannel heat sinks subjected to the uniform wall temperature condition. Solutions for velocity and temperature distributions are presented using the averaging approach. When the aspect ratio of the microchannel is higher than 1, these solutions accurately evaluate thermal resistances of heat sinks. Asymptotic solutions for velocity and temperature distributions at the high-aspect-ratio limit are alsopresented by using the scale analysis. Asymptotic solutions are simple, but shown to predict thermal resistances accurately when the aspect ratio is higher than 10. The effects of the aspect ratio and the porosity on the friction factor and the Nusselt number are presented. Characteristics of the thermal resistance of microchannel heat sinks are also discussed.

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Study on the Averaging Approach for Microchannel Heat Sinks for Electronics Cooling (평균 접근법을 이용한 전자 장치 냉각용 마이크로 채널 히트 싱크에 대한 연구)

  • Kim, Dong-Kwon;Kim, Sung-Jin
    • Proceedings of the KSME Conference
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    • 2004.04a
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    • pp.1430-1435
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    • 2004
  • The present paper is devoted to the modeling based on an averaging approach for microchannel heat sinks. Firstly, analytic solutions for velocity and temperature distributions for low-aspect-ratio microchannel heat sinks are presented by using the averaging approach. When the aspect ratio of the microchannel is smaller than 1, analytic solutions accurately evaluate thermal resistances of heat sinks while the previous model cannot predict thermal resistances. Secondly, asymptotic solutions for velocity and temperature distributions at low-aspect-ratio limit and at high-aspect-ratio limit are presented by using the scale analysis. Asymptotic solutions are very simple, but shown to predict thermal resistances accurately.

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Development of Thermal Design Program for an Electronic Telecommunication System Using Heat Sink (히트싱크를 이용한 전자통신 시스템의 방열설계 프로그램 개발)

  • Lee, Jung-Hwan;Kim, Jong-Man;Chun, Ji-Hwan;Bae, Chul-Ho;Suh, Myung-Won
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.31 no.3 s.258
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    • pp.256-263
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    • 2007
  • The purpose of this study is to investigate the cooling performance of heat sinks for an electronic telecommunication system by adequate natural convection. Heat generation rates of electronic components and the temperature distributions of heat sinks and surrounding air are analyzed experimentally and numerically. In order to perform the heat transfer analysis for the thermal design of telecommunication system a program is developed. The program used the graphic user interface environment to determine the arrangement of heat sources, interior fan capacity, and heat sink configuration. The simulation results showed that the heat sinks were able to achieve a cooling capacity of up to 230W at the maximum temperature difference of $19^{\circ}C$. To verify the results from the numerical simulation, an experiment was conducted under the same condition as the numerical simulation, and their results were compared. The design program gave good prediction of the effects of various parameters involved in the design of a heat sinks for an electronic telecommunication system.