• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1991.11a
• /
• pp.80-86
• /
• 1991

In this study an the development of the heat flux sensor with thermocouple, the heat-treated adhesive type film nickel gauge(Ni-Gauge) for measuring temperature was used. and this Ni-Gauge is not only comparable for platinum gauge(Pt-Gauge) in linearity, but also economically cheap. And from this viewpoint. numerical analysis is essential to investigate charateristics of sensor, since this analysis is capable of simulating precise boudary condition and practical conditions and so on. By the way. there are many types of heat flux sensor. of which adhesive type flux sensor is common, in the study this type of heat flux sensor was chogen. and analysis of the sensor is considered as a kind of open cavity figure. performed by SIMPLER algorithm. As a result. through temperature distributial of the sensor by numerical analysis in steady and unsteady state, the dracteristics of the acdhesive type heat flux sensor(lst heat flux sensor) acooodinge to heat flux, that is, outvoltage, sensitivity. and responsibilty could be evaluated. in addition, time of improved heat flux sensor(2nd heat flux sensor) could be predicted fran the reflectian of proper operating temperature(l50 $^{\circ}C$)of theNi-Gauge.

• Journal of the Korean Society for Precision Engineering
• /
• v.9 no.2
• /
• pp.52-60
• /
• 1992

In this study on the development of the heat flux sensor, unlike the common heat-flux sensor with thermocouple, the heat-treated adhesive-tupe film nickel-gauge was used in measuring temperature. The proposed its Ni-gauge is bound to be compatible with platinum gauge(Pt-Gauge) in its linearity. It is also considered to be cheap in economical sense. In the evaluation of it's performance, the numerical analysis is essential to investigate charateristics of proper sensor and the adequate analsis is depended upon boundary conditions and actual conditions. There are many types of heat flux sensor in the market, and adhexive type flux sensor is most common. In the present investigation, this type of heat flux sensor had been chosen. The figure of the sensor under consideration is an open cavity type, which is calculated numerically by SIMPLER algorithm. The temperature distributions of the sensor predicted by numerical calculation for steady and unsteady states are able to give the chacteristics of the adhesive type heat flux sensor(1st heat flux sensor) according to the heat flux. It means that the outvoltage, the sensitivity, and the performances of responsibility could be evaluated as a result. Through this analysis improved heat flux sensor(2nd heat flux sensor) could be predicted with the reflection of proper operating temperature($150^{\circ}C$) of the Ni-gauge.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.28 no.6
• /
• pp.403-407
• /
• 2015

Generally, MWCNT, with thermal, chemical and electrical superiority, is manufactured with CVD (chemical vapor deposition). Using MWCNT, it is comonly used as gas sensor of MOS-FET structure. In this study, in order to repeatedly detect gases, the author had to effectively eliminate gases absorbed in a MWCNT sensor. So as to eliminate gases absorbed in a MWCNT sensor, the sensor was applied heat of 423[K], and in order to observe how the applied heat was diffused within the sensor, the author interpreted the diffusion process of heat, using COMSOL interpretation program. In order to interpret the diffusion process of heat, the author progressed modeling with the structure of MWCNT gas sensor in 2-dimension, and defining heat transfer velocity($u={\Delta}T/{\Delta}x$), accorded to governing equation within the sensor, the author proposed heat transfer mechanism.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.61 no.9
• /
• pp.1358-1361
• /
• 2012

This paper presents a study on the analysis for activation time and threshold value of heat detection sensor using HRR(Heat Release Rate). And it is represented to quantity of heat to activate heat detection sensor. The experiment is conducted to measure activation time and HRR of fire detection sensor burning alcohol and n-heptane. In order to burn the alcohol and n-heptane using $43.5cm(L){\times}43.5cm(W){\times}5cm(D)$ and $33cm(L){\times}33cm(L){\times}5cm(D)$ steel pan and the quantity of alcohol and n-heptane are 2.5 L and 650 g, respectively. The results show that peak HRR are in case of alcohol 66.13 kW and in case of n-heptane 151.64 kW, respectively. Total heat releases of heat detection sensor are in case of alcohol approximately 20.7 MJ and in case of n-heptane approximately 18 MJ, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.9
• /
• pp.589-595
• /
• 2017

MOS-FET structured gas sensors were manufactured using MWCNTs for application as NOx gas sensors. As the gas sensors need to be heated to facilitate desorption of the gas molecules, heat dispersion plays a key role in boosting the degree of uniformity of molecular desorption. We report the desorption of gas molecules from the sensor at $150^{\circ}C$ for different sensor electrode gaps (30, 60, and $90{\mu}m$). The COMSOL analysis program was used to verify the process of heat dispersion. For heat analysis, structure of FET gas sensor modeling was proceeded. In addition, a property value of the material was used for two-dimensional modeling. To ascertain the degree of heat dispersion by FEM, the governing equations were presented as partial differential equations. The heat analysis revealed that although a large electrode gap is advantageous for effective gas adsorption, consideration of the heat dispersion gradient indicated that the optimal electrode gap for the sensor is $60{\mu}m$.

• Journal of the Korean Society for Precision Engineering
• /
• v.26 no.11
• /
• pp.138-145
• /
• 2009

A suspended membrane micro fluidic heat flux sensor that is able to measure the heat flow rate was designed and fabricated by a complementary-metal-oxide-semiconductor-compatible process. The combination of a thirty-junction gold and nickel thermoelectric sensor with an ultralow noise preamplifier, low pass filter, and lock-in amp has enabled the resolution of 50 nW power and provides the sensitivity of $11.4\;mV/{\mu}W$. The heater modulation method was used to eliminate low frequency noises from sensor output. It is measured with various heat flux fluid of DI-water to test as micro fluidic application. In order to estimate the heat generation of samples from the output measurement of a micro fluidic heat-flux sensor, a methodology for modeling and simulating electro-thermal behavior in the micro fluidic heat-flux sensor with integrated electronic circuit is presented and validated. The electro-thermal model was constructed by using system dynamics, particularly the bond graph. The electro-thermal system model in which the thermal and the electrical domain are coupled expresses the heat generation of samples converts thermal input to electrical output. The proposed electro-thermal system model shows good agreement with measured output voltage response in transient state and steady-state.

• Journal of Sensor Science and Technology
• /
• v.13 no.2
• /
• pp.139-143
• /
• 2004

This paper presents a method that the engine oil condition is detected using a natural convection heat transfer in a engine oil. A sensor circuit maintains a constant temperature difference between a heat plate and engine oil for detecting a natural convection heat transfer rate on the constant temperature. The natural convection heat transfer rate is measured by a current through the heat plate of the sensor circuit. The sensor is tested by a fresh oil. 6,000 km and 10,000 km driven oil in the oil temperature range from $20^{\circ}C$ to $100^{\circ}C$. In the experimental result, when the current through the heat plate is altered by variation of a engine oil temperature and flows driven oil more than fresh oil, the sensor could inform a engine oil deterioration to a car driver.

• Proceedings of the SAREK Conference
• /
• 2007.11a
• /
• pp.191-196
• /
• 2007

This paper presents the measuring technique for local heat transfer coefficients using a copper sensor in a rod bundle with mixing vanes. A copper sensor consists of a cartridge heater and four pieces of thermocouple. The Heater is located at the center of the copper sensor and thermocouples measure the surface temperature of the copper sensor. Unheated copper sensor and heated copper sensor are able to measure the local heat transfer coefficient at the position where the heated copper sensor is installed. However the entire region of a rod bundle is actually not heated, the decay of local heat transfer coefficients measured represents overestimated value rather than an actual value. The calibration curve for local heat transfer coefficients is presented using the correction factor calculated by CFD.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.30 no.6 s.249
• /
• pp.531-537
• /
• 2006

A lever type $NO_2$ micro gas sensor was fabricated by MEMS technology. In order to heat up the gas sensing material to a target temperature, a micro heater was built on the gas sensor. The sensing material laid on the heater and electrodes and did not contact with the silicon base to minimize the heat loss to the silicon base. The electric power to heat up the gas sensor to a target temperature was measured. The temperature distribution of micro gas sensor was analyzed by a CFD program. The predicted electric power of micro heater to heat up the sensing material to the target temperature showed a good agreement with the measured data. The design of micro gas sensor could be modified to show more uniform temperature distribution and to consume less electric power by optimizing the layout of micro heater and electrodes.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.55 no.5
• /
• pp.278-285
• /
• 2006

A micro hotplate for micro gas sensor was fabricated by MEMS technology. In order to heat up the gas sensing material to a target temperature, a micro hotplate was built on the gas sensor. The sensing material was deposited on the heater and electrodes, and did not contact with the silicon base to minimize the heat loss to the silicon base. The electric power to heat up the gas sensor was measured. The temperature distribution of micro gas sensor was analyzed by a CFD program. The predicted electric power to heat up th sensing material showed a good agreement with the measured data. The design of micro gas sensor could be modified to increase the temperature uniformity and to decrease the electric power consumption by optimizing the layout of micro hotplate and electrodes.