• 한국결정학회지
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• 제12권3호
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• pp.171-176
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• 2001

(100), (111), (211)CdZnTe 기판 및 (100)GaAs 기판위에 HgCdTe 박막을 MOVPE 법으로 성장하였다. 기판의 방위에 따라 성장된 박막의 표면형상, 전기적 특성, 결정성 및 조성의 변화를 분석하였다. (111) CdZnTe 기판 위에서는 3차원적인 facet 형태의 성장이 일어났다. (100) CdZnTe 기판 위에 성장된 HgCdTe 박막의 경우 DCX반치폭은 55arcsec 정도로 125 arcsec의 반치폭을 보인 (100) GaAs에 비하여 우수한 결정성을 나타내었다. 그러나 전기적인 특성은 GaAs 기판의 경우, 이동도가 높은 n-형 전도성을 보였으나 CdZnTe 기판을 사용한 경우에는 10/sup 16/㎤ 이상의 운반자 농도를 갖는 p-형 전도성을 나타내었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.139-140
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• 2005

The photocurrent characteristics of CdTe/HgTe/CdTe structured nanoparticles are studied. CdTe/HgTe/CdTe multilayer structured nanoparticles were synthesized by colloidal method. CdTe/HgTe/CdTe multilayer structured nanoparticles were characterized by x-ray diffraction, high-resolution transmission electron microscopy(HRTEM), absorbance and photoluminescence(PL). PL spectrum of CdTe/HgTe/CdTe multilayer structured nanoparticles exhibits a strong exciton bond in the near infrared range. The I-V curves and photoresponses revealed that CdTe/HgTe/CdTe multilayer structured nanoparticles are very prospective materials for the photodetectors.

• 센서학회지
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• 제12권6호
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• pp.282-288
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• 2003

MBE 방법으로 Si 기판위에 성장된 CdTe(211) 박막위에 MOVPE 법으로 HgCdTe 박막을 성장하였다. 성장된 박막의 표면은 hillock 등의 결함이 없는 매우 균일한 형상을 보였다. HgCdTe 박막표면의 EPD(etch pit density) 및 (422) 결정면의 이중 결정 x-선 회절 피크의 반치폭으로 본 결정성은 GaAs 기판위에 성장된 HgCdTe 박막에 비하여 우수하였다. GaAs 기판 위에 MOVPE 법으로 성장된 HgCdTe는 기판처리 과정에서 유입된 p-형 불순물로 인해 p-형 전도성을 나타내었으나 (211)CdTe 기판 위에 성장된 박막은 77K에서 $8{\times}10^{14}/cm^3$의 운반자 농도를 갖는 n-형 전도성을 보였다. 본 연구의 결과는 최근 요구되고 있는 $1024{\times}1024$급 이상의 화소를 갖는 대면적 HgCdTe 적외선 소자 제작에 널리 적용될 것으로 판단된다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.122-122
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• 2011

HgCdTe는 고성능 적외선 센서 재료로 널리 사용되고 있다. 현재 상용화된 HgCdTe 소재는 통상적으로 액상 에피 성장법으로 제조 되고 있다. 액상 에피 성장법에 의해 제조된 HgCdTe는 갓 성장 상태에서 많은 양의 Hg-공공(vacancy)을 함유하게 되며 적외선 소자의 응용을 위해서는 이러한 Hg-공공을 채우기 위한 Hg-분위기 열처리 공정을 거치게 된다. 열처리 혹은 성장 공정 시 HgCdTe 소재 내에 발생하는 마이크로 혹은 나노스케일의 조성의 변화는 응력의 집중을 가져오며 이는 전자, 혹은 정공의 응집을 가져와 소자 동작의 불균일성을 야기한다. 본 연구에서는 액상 에피 성장법으로 성장 된 HgCdTe 박막내에 존재하는 응력의 분포와 Hg-공공을 채우기 위한 열처리 과정에서 생성 또는 소멸되는 응력의 변화를 Geometric phase strain 분석법으로 관찰하였다. 분석결과, 응력의 집중된 부분은 주로 성장 시 석출된 Te 및 Hg-공공으로 부터 기인함을 확인하였다. Hg-분위기 열처리를 통하여 석출된 Te 제거 및 Hg-공공의 감소를 확인하였고 이에 따른 응력의 집중 부분도 해소됨을 알 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.56-59
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• 2004

HgTe and HgTe/CdTe core-shell structured nanocrystals(NCs) were synthesized in aqueous solution by colloidal method. HgTe and HgTe/CdTe NCs structure showed very similar XRD patterns because of the same lattice constant and crystal structure of both samples. The absorption and photoluminescence(PL) spectrum of the synthesized HgTe NCs revealed the strong exitonic peak in the IR region. The PL spectrum of HgTe/CdTe NCs have the intense peak in about 700nm shorter than that of HgTe by 400nm. The photocurrent measurement of colloidal NCs are performed using He-Ne laser for light source. The photocurrent of HgTe NCs shows the instant increased current response to light, but HgTe/CdTe NCs revealed a decreased current when lighted to the sample. In the vacuum condition, it shows reverse result that current increased under the illumination of light and it is thought that the molecules like the hydro-oxygen gas in the air give an important effect on the current mechanism.

• 한국표면공학회지
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• 제29권5호
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• pp.325-329
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• 1996

We report on p-type arsenic doping of metalorganic vapor phase epitaxially (MOVPE) grown HgCdTe on (100) GaAs. HgCdTe was grown at $370^{\circ}C$ in a horizontal reactor with using dimethy-cadmium, diisoprophyltelluride, and elemental Hg. We used tris-dimethylaminoarsenic (DMAAs) as the metalorganic for p-doping. 4micron thick CdTe and subsequently 10micron thick HgCdTe were grown on (100) GaAs substrate. Interdiffused multilayer process in which thin CdTe and HgTe layers are grown alternately and interdiffused to obtain homogeneous HgCdTe alloys was used. Arsenic was doped during CdTe growth cycle. After growth HgCdTe was annealed at $415^{\circ}C$ for 15 min and then annealed again at $220^{\circ}C$ for 3 hr, both with Hg-saturate condition. We could obtain p-doping from 2.5$\times$$10^{16}$ to 6.6$\times$$10^{17}$$cm^{-3}$, depending on the DMAAs partial pressure. With the dual Hg-annealing, activation of arsenic was aboutt 90%, which was confirmed by SIMS measurement. With only low temperature annealing at $220^{\circ}C$ for 3hr, activation efficiency was about 50%.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.973-976
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• 2004

The results of numerous studies in III-V semiconductors show that sulfur treatment improves the electrical parameters of III-V compound devices. In this article, we examine the effects of sulfidation of HgCdTe surface on the interfacial characteristics of metal-ZnS-HgCdTe structures. Different from sulfidation in III-V material, S can not be act as an impurity because II-S compounds (ZnS, CdS) generally used as passivant for HgCdTe. Our studies of sulfur-treatment on HgCdTe surface show that sulfur agent forms the S- S, II-S bonds at the surface layer. These bonds are very effective to improve the electrical properties of ZnS layer on HgCdTe by reducing the possibility of native oxides formation. After the sulfidation process, MIS capacitors of HgCdTe show great improvement in electrical properties, such as low density of fixed charge and reduced hystereisis width.

• 센서학회지
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• 제19권5호
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• pp.398-402
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• 2010

The liquid phase epitaxy(LPE) method was widely used to growth of mercury cadmium telluride(MCT) thin films. However, this method lead to Hg-vacancies in MCT thin film, because Hg has high vapor pressure at this temperature range. This is a well known defect in HgCdTe grown by LPE method. In this study, we report the development of techniques for improving the crystalline quality and controlling the composite uniformity of HgCdTe thin films using high- pressure Hg-ambient annealing method. As a result, we achieved the improvement of the composite uniformity of HgCdTe thin films. It was observed by the high angle annular dark field scanning TEM(HAADF-STEM) analysis. Moreover, new HgTe phase and a shrinking of lattice fringe were observed.

• 한국기계가공학회지
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• 제6권4호
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• pp.50-56
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• 2007

This study aims to find the optimal cutting conditions, when are IR Detection device HgCdTe is machined with diamond tool of diamond turning machine. Machining technique for HgCdTe with single point diamond turning tool is reported in this paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. It has been found HgCdTe has more and more important applications in the field of modern optics. The purpose of our research is to find the optimum machining conditions for ductile cutting of HgCdTe and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle materials.

• 전자공학회논문지A
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• 제32A권2호
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• pp.89-95
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• 1995

The structure of boron ion-implanted pn junctio in the vacancy-doped p-type HgCdTe was investigated with the differential Hall measurement. The as-implanted junction showed the electron concentration as high as 1${\times}10^{18}/cm^{3}$ and the junction depth of 0.6.mu.m. When the HgCdTe junction was heated in oven, the electron concentration near the junction decreased and the junction depth increased as the annealing temperature and time increased. The junction structure after the thermal annealing was n$^{+}$/n$^{-}$/p. For the 200.deg. C 20min annealed sample, the electron mobility was 10$^{4}cm^{2}/V{\cdot}$s near the surface(n$^{+}$), and was larger thatn 10$^{5}cm^{2}/V{\cdot}$s near the junction(n$^{+}$). The junction formation mechanism is conjectured as follows. When HgCdTe is ion-implanted, the ion energy generates crystal defecis and displaced Hg atoms HgCdTe is ion-implanted, the ion energy generates crystal defecis and displaced Hg atoms near the surface. The displaced Hg vacancies diffuse in easily by the thernal treatment and a fill the Hg vacancies in the p-HgCdTe substrate. With the Hg vacancies filled completely, the GfCdTe substrate becomes n-type because of the residual n-type impurity which was added during the wafer growing. Therefore, the n$^{+}$/n$^{-}$/p regions are formed by crystal defects, residual impurities, and Hg vacancies, respectively.