• 대한수학회보
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• 제40권1호
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• pp.17-28
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• 2003

Let X be a closed, oriented, Riemannian 4-manifold with ${{b_2}^+}(x)\;>\;1$ and of simple type. Suppose that ${\sigma}\;:\;X\;{\rightarrow}\;X$ is an involution preserving orientation with an oriented, connected, compact 2-dimensional submanifold $\Sigma$ as a fixed point set with ${\Sigma\cdot\Sigma}\;{\geq}\;0\;and\;[\Sigma]\;{\neq}\;0\;{\in}\;H_2(X;\mathbb{Z})$. We show that if _X(\Sigma)\;+\;{\Sigma\cdots\Sigma}\;{\neq}\;0$ then the $Spin^{C}$ bundle $\={P}$ is not $\mathbb{Z}_2-equivariant$, where det $\={P}\;=\;L$ is a basic class with $c_1(L)[\Sigma]\;=\;0$.

• Bulletin of the Korean Chemical Society
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• 제31권4호
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• pp.959-964
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• 2010

In this work, equilibrium molecular dynamics (MD) simulations in a microcanonical ensemble are performed to evaluate the friction coefficient of a Brownian particle (BP) in a Lennard-Jones (LJ) solvent. The friction coefficients are determined from the time dependent friction coefficients and the momentum autocorrelation functions of the BP with its infinite mass at various ratios of LJ size parameters of the BP and solvent, ${\sigma}_B/{\sigma}_s$. The determination of the friction coefficients from the decay rates of the momentum autocorrelation functions and from the slopes of the time dependent friction coefficients is difficult due to the fast decay rates of the correlation functions in the momentum-conserved MD simulation and due to the scaling of the slope as 1/N (N: the number of the solvent particle), respectively. On the other hand, the friction coefficient can be determined correctly from the time dependent friction coefficient by measuring the extrapolation of its long time decay to t=0 and also from the decay rate of the momentum autocorrelation function, which is obtained by time integration of the time dependent friction coefficient. It is found that while the friction coefficient increases quadratically with the ratio of ${\sigma}_B/{\sigma}_s$ for all ${\sigma}_B$, for a given ${\sigma}_s$ the friction coefficient increases linearly with ${\sigma}_B$.

• 대한수학회보
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• 제42권4호
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• pp.817-828
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• 2005

In this note we show that there is an anti-symplectic involution $\sigma\;:\;X\;\to\;X$ on a simply-connected, closed, non-Kahler and symplectic 4-manifold X with a disjoint union of Riemann surfaces ${\amalg}^n_{i=1}{\Sigma}_i,\;n\;{\ge}\;2$ as a fixed point set. Also we show that its quotient X/$\sigma$ is homeomorphic to $\mathbb{CP}^2{\sharp}r\mathbb{CP}^2$ but not diffeomorphic to $\mathbb{CP}^2{\sharp}r\mathbb{CP}^2,\;r\;=\;b_2^-(X/{\sigma})$.

• 대한한방내과학회지
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• 제21권5호
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• pp.819-827
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• 2000

Purpose : To investigate the inhibitory effect of HCE on platelet aggragation and erythrocyte deformiability, we performed following experiments. Methods : Concentrated Hyulbuchukotang (HCE) was fed to rats for 10days. We compare normal group with $500{\beta}{\Sigma}/{\beta}{\Sigma}$-high dose group and $100{\beta}{\Sigma}/{\beta}{\Pi}$-low dose group. Results : HCE enhanced the blood filtration rate, erythrocyte deformiability, reduced the platelet aggreablilty and inhibited granule release from collagen stimulated platelet, the prostaglandin synthesis in platelat. Conclusion : HCE should inhibit thrombos formation due to platelet hyperaggraeability and reduction of erythrocyte defonmiability.

• 미생물학회지
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• 제32권4호
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• pp.264-270
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• 1994

세균의 RNA 중합효소에서 여러 ${\sigma}$ 인자들 간에 보존된 아미노산 서열중 2.3 부위와 4.2 부위의 아미노산 서열로부터 유 n하여 두가지의 PCR primer를 제작하였다. 이들을 이용하여 PCR을 수행하였을 때, E. coli와 Streptomyces coelicolor의 DNA로부터 예상되었던 480 bp 정도의 DNA가 증폭되는 것을 관찰하였다. E. coli DNA에서 증폭된 DNA를 클로닝하여 염기서열을 결정한 결과 E. coli의 rpoS 유전자로부터 유래하였음을 알았다. 이를 탐침으로 S. coelicolor에서 genomic DNA hybridization을 수행하였을 때, PvuII 절편 두가지 (3.5 kb, 2.0 kb) 와 SalI 절편 두가지(3.4kb, 1.5 kb)에 탐침이 결합하는 것을 관찰하였다. 3.5 kb의 pvuII 절편을 sublibrary로부터 클로닝하고, 탐침이 결합하는 1.0kb의 BamHI/HincII 절편의 염기서열을 분석하였다. 부분적으로 결정된 염기서열을 BLAST 프로그램을 이용하여 GenBank와 EMBL, PDB 등의 data library의 유전자들과 비교하여 본 결과Streptomyces속의 ${\sigma}$인자들을 비롯한 Synechococcus종, Anabaena종, Pseudomonas aeruginosa, Stigmatella aurantica 등의 주된 ${\sigma}$ 인자와 높은 유사성을 보였다. 현재까지 1.2 부위와 4 부위에 해당하는 부분의 염기서열을 결정하였는데, 이 부분은 S. coelicolor에서 알려진 다섯가지의 ${\sigma}$ 인자 유전자 중 hrdA와 가장 높은 유사성을 보이며, 아미노산의 유사성이 1.2부위에서는 88%, 4 부위에서는 75%인 것으로 나타났다.

• 한국식품위생안전성학회지
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• 제31권3호
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• pp.222-225
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• 2016

식품에서 대장균군을 효율적으로 분리하기 위해 대장균군 선택배지 5종: Chromocult Chromocult coliform agar (Merck), Hicrome coliform agar (Sigma), CHROMagar ECC, Brilliance E.coli/coliform medium (OXOID), endo agar (Merck)을 선별하여 식품 분리 대장균군 83종 및 표준균주 21종에 대해서 민감도와 특이도를 분석한 결과 Chromocult coliform agar와 HICrome coliform agar에서 94%도 민감도가 가장 높았으며, Brilliance E.coli/coliform medium는 93%, CHROMagar ECC는 92%, ENDO agar는 74%의 민감도를 나타냈다. Chromocult coliform agar와 HICrome coliform agar는 대장균군의 회수율도 높았다. 그러므로 Chromocult coliform agar와 HICrome coliform agar는 대장균군을 분리하는데 가장 효율적인 배지로 생각된다.

• 전기전자학회논문지
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• 제19권2호
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• pp.148-154
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• 2015

차량 전장시스템은 매 순간마다 정확한 인식을 통하여 사용자에게 정확한 경보를 전달해야 한다. 따라서 차량 영상 인식 알고리즘을 적용하기 위하여 빠른 전처리 시스템이 필요하다. 본 논문은 운전자 보조 시스템의 영상 처리를 목적으로 histogram equalization과 편차를 이용한 bilateral Filter를 사용하여 blur 영상을 보정하는 방법에 대해서 제안하였다. 제안한 시스템은 영상 스케일, 평활화, 노이즈 필터, 윤곽선 추출 순으로 총 5단계로 구성되며, bilateral filter의 과 값을 운전자 보조 시스템에서 나타나는 도로의 주행 현상에 적합하게 추출하여 10픽셀 이하의 blur를 기존의 방법들보다 빠르게 처리하였다. 실험 결과는 MATLAB을 사용하여 소요시간 및 PSNR을 구하였으며 기존의 방법과 비교하여 본 논문의 결과가 처리속도가 빠름을 입증하였다.

• 한국멀티미디어학회논문지
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• 제25권8호
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• pp.1069-1074
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• 2022

IP mobility can be handled in different layers of the protocol. Mobile IP has been proposed to handle the mobility of Internet hosts in the network layer. Recently, a new method based on the SIGMA mobility architecture has been proposed to support mobility management with reduced packet loss and latency. The location management structure is not suitable for frequent mobile handover due to the high mobility of the user with this transport layer solution. In this paper, we propose a location management optimization method in a mobile communication network by applying hierarchical location management using MMPs(Mobility Management Points) for transport layer mobility management. Therefore, we propose an efficient hierarchical mobility management structure even between heterogeneous wireless networks using MMPs for the probability that a mobile terminal can change multiple location areas between two messages and calls. The proposed method shows reduction in location update cost and data retrieval cost using MMPs, and as opposed to mobility appearing in time intervals with the minimum cost required to reach 90% of the stabilized cost, the mobility location update search, location It was found that the message processing cost per area was reduced.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2000년도 춘계학술발표회 초록집
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• pp.1-1
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• 2000

The results of the modification of metal materials treated by high temperature pulst:d plasma fluxes (HTlPPF) with a specific power of incident flux changing in the $(3...100)10^5{]\;}W/cm^2$ range and a pulse duration lying from 15 to $50{\;}\mu\textrm{s}$ have been presented. The results of HTPPF action were studied on the stainless steels of 18Cr-l0Ni, 16Cr- 15Ni, 13Cr-2Mo types; on the structural carbon steels of (13...35)Cr, St. 3, St. 20, St. 45 types; on the tool steels of U8, 65G, ShHI5 types, and others; on nickel and high nickel alloy of 20Cr-45Ni type; on zirconium- and vanadium-base alloys and other materials. The microstructure and properties (mechanical, tribological, erosion, and other properties) of modified materials and surface alloying of metals exposed to HTPPF action have been investigated. It was found that the modification of materials by HTPPF resulted in a simultaneous increase of several properties of the treated articles: microhardness of the surface and layers of 40...60 $\mu\textrm{m}$ in depth, tribological characteristics (friction coefficient, wear resistance), mechanical properties ({\sigma_y}, {\;}{\sigma_{0.2}}.{\;}{\sigma_r}) on retention of the initial plasticity ($\delta$), corrosion resistance, radistanation erosion under ion irradiation, and others. The determining factor of the changes observed is the structural-phase modification of the near-surface layers, in particular, the formation of the fine cellular structure in the near-surface layers at a depth of $20{\;}{\mu\textrm{m}}$ with dimension of cells changing in the range from 0.1 to $1., 5{\;}\mu\textrm{m}$, depending on the kind of material, its preliminary treatment, and the parameters of plasma fluxes. The remits obtained have shown the possibility of purposeful surface alloying of metals exposed to HTPPF action over a depth up to 20...45 $\mu\textrm{m}$ and the concentration of alloying element (Ni, Cr, V) up to 20 wt.%. Possible industrial brunches for using the treatment have been also considered, as well as some results on modifying the serial industrial articles by HTPPF.

• 대한기계학회논문집A
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• 제28권9호
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.