• Laser Solutions
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• v.8 no.3
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• pp.21-26
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• 2005

A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.2
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• pp.11-22
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• 2022

This paper presents the development process for a high-power diode laser for metal surface hardening. To combine the emissions from several laser bars, it is necessary to collimate the emitted light using an optical lens. Thus, to achieve a suitable power density and uniform beam profile, several optical layouts were proposed. To estimate the laser beam for a flat-top distribution, a numerical analysis was performed using the ZEMAX software, and the results were compared with the experimental results. With a focal lens assembled in a serial diode stack source, the design can utilize the advantage of compacting the overall beam size. Experimental results for a robotic system demonstrated the processing ability of this diode laser module in industrial laser hardening.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.423-426
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• 2005

A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

• Proceedings of the KIPE Conference
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• 2014.07a
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• pp.59-60
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• 2014

In this paper, development of laser diode driver with 2.5kW rating is presented. The driver is configured with interleaved PFC converter, high frequency full bridge DC-DC converter, two laser diode drivers and ${\mu}$-processor based controller. The system has two laser diode drivers for providing high current and low current. High current driver delivers normal output power of diode; low current driver is for providing critical current of diode for long lifetime. Computer simulation and experiment was performed for verification, as the results, developed driver performs well.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.7 no.4
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• pp.147-150
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• 2014

In this paper, pulse current type power supply for laser diode dirver is discussed. High speed high power laser has been using widely because it becomes using on medical or manufacturing equipment, but researches have not being occurred actively. Current profiling method is proposed for improved lifetime expectancy of laser diode(LD). The current waveform of driving LD is most important factor of the performance and lifetime of LD. The proposed method improves shape and stability of current waveforms, thus will effect right direction of lifetime expectation.

• 한국연소학회:학술대회논문집
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• 2003.05a
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• pp.75-83
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• 2003

Diode laser absorption system is advantageous of their non-invasive nature, fast response time, high sensitivity and real-time measurement capability. Furthermore, recent advances in room-temperature, near-IR and visible diode laser sources for telecommunication, optical data storage applications are enabling combustion diagnostics system based on diode laser absorption spectroscopy. So, combined with fiber-optics and high sensitive detection strategies, compact and portable sensor system are now appearing for a variety of applications. The objective of this research is to take advantage of distributed feed-back diode laser and develope new gas sensing system. It experimentally found out that the wavelength, power characteristics as a function of injection current and temperature. In addition to direct absorption and wavelength modulation spectroscopy have been demonstrated in these experiments and have a bright prospect to this diode laser system.

• Journal of the Optical Society of Korea
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• v.2 no.1
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• pp.5-8
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• 1998

A high power diode-array-pumped slab Nd:YAG laser is described. The resonator consists of three mirrors in folded geometry. The laser is operated in acousto-optic Q-switching mode and intracavity frequency doubling is tried. We demonstrate that the laser exhibits frequency doubling efficiency of ∼60% with a type I LBO crystal.

• Electrical & Electronic Materials
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• v.9 no.5
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• pp.498-505
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• 1996

In the present work, we have developed the simulator to optimize the process conditions of the AR(antireflection) and HR(high-reflection) coatings for the high power laser diode. The simulator can run on the PC. After making the simple optical model, we establish the Maxwell equations for the model by the operator conversion. By using the Mathematica, we derive a matrix for the multilayer system by applying the equations to the model and optimize the AR and HR coating process conditions by obtaining the reflection rate from the matrix. We also prove the validity of the simulator by comparing the simulation with the characteristics of the laser diode which is AR and HR coated according to the optimized conditions.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.4
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• pp.30-36
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• 2004

The development of LD(Laser Diode) tester and its control system based on the graphical programming language(LabVIEW) is addressed. The ill tester is used to check the optic power and the optic spectrum of the LD Chip. The emitter size of LD chip and the diameter of the Detector(optic fiber and photo diode) are very small, therefore the test device needs high accuracy. But each motion part of the test device could not accomplish high accuracy due to the limit of the mechanical performance. So, an image processing with machine vision is proposed to compensate for the error. By adopting our method we can reduce the error of position within $\pm$5$\mu\textrm{m}$.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.376-380
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• 2004

This paper is to develop an optical ruer displacement sensor for monitoring high speed spindle. Proper magnitude of optical power as well as amplification of output signal are necessary to improve sensitivity of the sensor. In this paper, to meet the need of improvement of the sensor resolution, we choose proper optical power and amplification level through speculating on optical power of a laser diode.