• Journal of the Korean institute of surface engineering
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• v.43 no.2
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• pp.64-72
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• 2010

CuSnZn electroplating was investigated as alternative to Ni plating. Evaluation of electrolyte and plating process was performed to control physical characteristics of the film, and to collect practical data for application. Hull-cell test was conducted for basic comparison of two commercialized products and developed product. Based on hull-cell test results, long term test of three electrolytes was performed. Various analysis on long term tested electrolyte and samples have been done. Reliable and practical data was collected using FE-SEM (FEI, Sirion), EDX (ThermoNoran SIX-200E), ICP Spectrometer (GBC Scientifi c, Integra XL), FIB (FEI, Nova600) for anlysis. Physical analysis and reliability test of the long term tested film were also carried out. Through this investigation plating time, plating speed, electrolyte composition, electrolyte metal consumption, hardness and corrosion resistance has been compared. This set of data is used to predict and control the chemical composition of the film and modify the physical characteristics of the CuSnZn alloy.

• Applied Chemistry for Engineering
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• v.17 no.2
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• pp.150-157
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• 2006

The alternate plating method was suggested by a tin-cobalt alloy plating process which has excellent mechanical characteristics and also favorable to environment. Tin-cobalt alloy plating has many advantages such as nontoxicity, variable color-tone, and no post-treatment process. In this study, the plating conditions such as temperature, pH, current density, plating time, and amount of additive (glycine) were determined in the tin-cobalt alloy plating process through Hull-cell test and surface analysis. As the result of Hull-cell analysis, brightness became superior as the amount of glycine increased. It was found that the optimum alloy ratio was 0.03 M of $SnCl_{2}{\cdot}2H_{2}O$ and 0.05 M of $CoSO_{4}{\cdot}7H_{2}O$ at $50^{\circ}C$, pH 8.5, and $0.5A/dm^2$. The optimum amount of additive was 15 g/L of glycine and 0.1 g/L of organic acid. Then, the solution including glycine was recommended as an optimum plating solution for a chromium plating process.

• Applied Chemistry for Engineering
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• v.19 no.2
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• pp.228-235
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• 2008

Nickel plating thickness increased with the electric current density, and the augmentation was more thick in $6{\sim}10A/dm^2$ than low current. Hull-cell analysis was tested to evaluate the current density. Optimum thickness was obtained at a temperature of $60^{\circ}C$, and the pH fluctuation of 3.5~4.0. Over the Nickel ion concentration of 300 g/L, plating thickness increased with the current density. The rate of decrease in nickel ion concentration was increased with the current density. The quantity of plating electro-deposition was increased at the anode surface, which was correlated with the increase of plating thickness. The plating thickness was increased because of the quick plating speed. However, the condition of the plating surface becomes irregular and the minuteness of nickel plating layer was reduced with the plating rate. After the corrosion test of 25 h, it was resulted in that maintaining low electric current density is desirable for the excellent corrosion resistance in lustered nickel plating. According to the program simulation, the thickness of diffusion layer was increased and the concentration of anode surface was lowered for the higher current densities. The concentration profile showed the regular distribution at low electric current density. The field plating process was controlled by the electric current density and the plating thickness instead of plating time for the productivity. The surface physical property of plating structure or corrosion resistance was excellent in the case of low electric current density.

• Applied Chemistry for Engineering
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• v.21 no.3
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• pp.301-305
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• 2010

In this study, the alkaline degreasing agent was developed for electroplating pretreatment process, and the efficiency and the durability was predicted. The alkaline deeping degreasing agent was prepared by blending sodium hydroxide (NaOH), sodium carbonate ($Na_2CO_3$), sodium silicate ($Na_2SiO_3$), and sodium lauric sulfate (SLS). The performance tests of the degreasing agent were evaluated in the $40{\sim}50^{\circ}C$ of the degreasing temperature and 30~40 min of the degreasing time. The efficiency and durability of the prepared degreasing agent were tested by the waterdrop formation test and Hull-cell plating test. The optimum ratio of alkaline degreasing agent was NaOH (30 g/L) + SLS (6.0 g/L) + $Na_2SiO_3$ (2.0 g/L) + $Na_2CO_3$ (40 g/L). Also, the optimum degreasing conditions were $50^{\circ}C$ of the degreasing temperature and 35 min of the degreasing time.

• Journal of the Korean institute of surface engineering
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• v.10 no.1
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• pp.1-18
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• 1977

To support the domestic plating industry concerning localized products, survey was conducted in with chemicals and properties of plating solution. Collected samples from 55 factories throughout the country were investigated by spectigated by spectrograph, Hull cell test chemical analysis method to find major chemical components of the plating solution.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.144-144
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• 2009

본 논문에서는 6가 크롬 도금의 대체 기술 중 하나인 3가 크롬 도금 공정 기술 개발에 있어 도금 소지인 Mg 합금에 온도, 전류 밀도 등의 도금 조건을 변경하여 도금 층의 두께와 형상, 미세조직 등을 분석, 최적의 도금 조건을 확인하였다. 또한 3가 크롬도금의 실 부품 적용 가능성을 검토하기 위해 상용 프로그램인 Solidworks와 Elsyca Platingmaster를 이용, 3D Hull Cell test를 전산 모사하고 실제 Hull Cell 도금과 비교 분석 하였다.

• Clean Technology
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• v.11 no.3
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• pp.153-164
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• 2005

This study found a reliable evaluation for four kinds of pb-Free plating solutions and it's layers, through pure Sn, SnAg, SnBi and SnCu. These four kind of solutions are widely used to pb-Free plating. Hull-cell, Harring-blum, coverage, throwing power, current efficiency, stability, life-time, composition, hardness, roughness, abrasion, scratch, solderability, corrosion, contact angle, morphology, SIR(Surface insulation resistance) and Whisker test were experimented. Also, Using ICP, XRF, FE-SEM, EDS, temperature/humidity chamber, solderability tester, hardness tester, roughness tester, abrasion tester, salt spray tester, contact angle tester, SIR tester, and microscope. In this paper could be shown the systematic and various analysis for reliability about four kinds of pb-Free plating solutions, processes and it's deposit surface.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.26 no.1
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• pp.1-6
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• 2003

In this paper, we proposed the optimal process conditions on the electro-gilding process. The responses are plating thickness and Sn proportion. The factors are temperature, current density, and addition. We minimized the total number of experiments based on the principle of dividing into small part. We grouped the factors using the plating process information which we already knew. We did Hull Cell test to find relationship between plating solution and electric effects, and applied ANOVA and RSM to estimate the optimal process conditions.

• Journal of the Korean Electrochemical Society
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• v.4 no.4
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• pp.160-165
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• 2001

The eletrochemical charateristics of mercapto compound additives on the copper electroplating for semi conductor metalization were investigated. Mercapto compounds including sulfur atom is known that they activate deposition rate in eletroplating. Four different types of mercapto compounds were chosen with different concentration and both the characteristics of plating and throwing power were investigated by electrochemical experiments such as Hull cell test, Haring-Blum cell, cathodic polarization, EQCM(Electrochemical Quartz Crystal Microbalance). 3-Mercapto-1-propanesulfonic acid among 4 different mercapto compounds was regarded as the most proper activator with the results of the mass change of Cu metal deposited on eletrode by cathodic polarization and EQCM. The overpotential was more shifted to 100 mV in the concentration of 20 ppm than the solution with only $Cl^-$ in cathodic scan.