• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.10-10
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• 2008

Flip chip technology is keeping pace with the increasing connection density of the ICs and is capable of transferring semiconductor performance to the printed circuit board. One of the most general flip chip technology is CPB technology presented by Intel. The CPTB technology has similar benefits with CPB but has simpler process and better reliability characteristics. In this paper, process sequence and structure of CPTB are presented.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.3-3
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• 2001

Two companies plating baths were selected for plating on phenol and epoxy resin boards as well as on flexible p polyimide boards. After plating, deposited i&IIk&.ness al1d physical properties, as well as solder wettabilities by aging with $150^{\circ}C$ heating and 100% humidity were compared. After plating and aged with two different tin baths, deposited thickness and physical properties were not so great differences, but solder wettabilities were superior used polymer catalyst than the other. Furthermore depend upon the compactness and fineness of metallic sturctures of the base copper, the amounts of the plated copper were big differel1lces. These differences seems to be inherited from the kind and amount of additives. as well as current densities, which are influences upon structures of Copper layers. Generally the tin thickness are hetween 0.5 to $1.0\mu\textrm{m}$ and thicker the solder wettabilities are the better, and also me compact structures of deposits showed gooo soidierabiiities. In this study, with our own deveiotaedl plating equipment could get more than $0.5\mu\textrm{m}$ of till thickness and piating speed was $0.1\mu\textrm{m}$ per minutes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.148-149
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• 2007

현재 전자부품 시장은 RoHS 규정으로 인하여 lead free화가 진행되고 있으며 많은 주목을 받고 있다. 본 논문에서는 반도체 패키지 및 부품표면일장에서 사용 되는 무전해 주석 도금과정 중 산 탈지 후 막의 표면 거칠기 정도가 도금 후의 표면 거칠기 정도에 미치는 영향을 평가 한다. 실험의 효율성을 높이기 위해 통계적인 실험계획법을 사용하였으며 실험의 횟수를 줄이고 표면 거칠기 정도는 이미지 프로세싱을 통하여 분석하였으며 통계적인 모델링을 통해 micro etch가 도금 표면의 거칠기에 주는 영향을 분석하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.184-185
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• 2011

In this study, in order to obtain a high reflectivity for the LED lead frame, tin dip coating and tin plating were conducted respectively, and wettability of LED lead frame with tin solder also was tested by wetting balance tester. A Cu sheet was plated in Cu brighten electroplating bath and followed by immersion in a Sn electro-less plating bath [1]. On the other hand, in the dip coating process, a Cu sheet was dipped into molten tin. In the progress of wetting test, besides wetting balance curve, the maximum measured force($F_m$), the maximum withdrawal force($F_w$) and zero-cross time($t_0$) were obtained in various temperatures. With the maximum withdrawal force, the surface tension was calculated at different temperatures. The Cu sheet plated with bright Cu and Sn show a silver bright property while that of Cu dipped with Sn possessed a high reflectance density of 1.34GAM at $270^{\circ}C$.

• The Journal of Korean Academy of Prosthodontics
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• v.29 no.1
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• pp.13-22
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• 1991

This study investigated the effects of surface treatment on the tensile bond strength of resinbonded prosthesis. The Rexillium III specimens were treated with $50{\mu}m\;Al_2O_3$ blasting. Type IV gold alloy specimens were treated with $400^{\circ}C$ heating and tin plating method. All specimens were bonded with MBAS composite resin cement and followed by immersion test into the $37^{\circ}C$ water bath for 7 days. The specimens were debonded in tension with an Instron machine and observed with SEM. The modes of failure were recorded also. The following conclusions were obtained : 1. The tensile bond strength decreased in following order. $50{\mu}m\;Al_2O_3$ basted Resillium III group, Type IV gold alloy group treated with $400^{\circ}C$ heat and tin plating type IV gold alloy group, and statistical significant differences were observed(p<0.05). 2. The tensile bond strength decreased in all groups after 7 days immersion test, but statistical significant differences were observed in Rexillium III specimens only. 3. The sharp and irregular surface were observed in Rexillium III, but $400^{\circ}C$ heat treated and tin plated groups had round and broad surface in SEM. 4. The models of bond failure were cohesive-adhesive failure mainly.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.78-78
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• 2014

PCB 무전해 주석도금의 원리와 주요 품질특성치, 그리고 최신 무전해 주석도금 약품의 기술개발 현황을 소개하고 적용사례를 소개한다. 특히 자동자용 전장제품의 무연화가 2016년부터 적용됨에 따라 현재 가장 유력한 HASL 대체 표면처리가 무전해 주석도금 (Immersion tin plating)으로 알려져 있어서 이에 대한 전반적인 소개 및 새로운 적용분야 등에 대해 발표한다.

• The korean journal of orthodontics
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• v.27 no.1
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• pp.157-171
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• 1997

This study was conducted to see the effect of TiN ion-plating on the bond strength of orthodontic bracket. Three stainless-steel brackets with different base types were chosen; when TiN ion-plated brackets and non iorrplated brackets were bonded to the teeth, initial and long-term bond strength were measured, The observations oi bonding surface and failure sites through the scanning electron microscope were analysed and compared. The summary of this study was as follows; ${\cdot}$ When TiN ion-plating was not applied, the Micro-Loc type was the highest in bond strength atter 24 hours as $5.89{\pm}1.77$ MPa, followed by $4,27{\pm}1.12MPa$ for Foil Mesh type and $2.64{\pm}0.58MPa$ for Undercut type(P<0.05). ${\cdot}$ Under TiN ion-plating, the bond strength after 24 hours showed: Micro-Loc type $-6.26{\pm}1.51MPa$, Foil Mesh type $-7.45{\pm}2.01MPa$, Undercut type $-2.93{\pm}0.84MPa$. Unlike in the case of non ion-plating, Foil Mesh type showed a higher strength than Micro-Loc type, with Undercut type still showing the lowest bond strength(P<0.05). The bond strength, after 24 hours, increased in case of ion-plated in all 3 types, but a significant increase was shown only in Foil Mesh type(P<0.001). ${\cdot}$ Under a long-term immersion, regardless of ion or non ion-plating, bond strength in general increased over the initial bond strength(one day), with more stability. ${\cdot}$ Through scanning electron microscopic observation of bonding surface, it was found that, regardless of the bracket base type or the application of ion-plating, the resin was thoroughly spreaded into bracket base to form a solid bonding surface between the bracket and the tooth. This was also true in case of a long-term immersion. ${\cdot}$ The scanning electron microscopic observation of failure sites revealed diverse failure patterns.