• Title/Summary/Keyword: Insulator-metal-insulator structure

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게이트 절연막에 의한 다이아몬드 MIS (Metal-Insulator-Semiconductor) 계면의 전기적 특성 개선과 전계효과 트랜지스터에의 응용 (Improvement of Electrical Properties of Diamond MIS (Metal-Insulator- Semiconductor) Interface by Gate Insulator and Application to Metal-Insulator- Semiconductor Field Effect Transistors)

  • 윤영
    • 한국전자파학회논문지
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    • 제14권6호
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    • pp.648-654
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    • 2003
  • 본 논문에서는 비 산화물인 불소화합물 게이트절면막을 이용하여 박막반도체 다이아몬드 MS계면(Metal-Insulator-Semiconductor Interface)의 전기적 안정화를 실현하였다. 특히 산소 게터링 효과(Oxygen-Gettering Effect)에 의한 표면준위 억제를 통해, 박막반도체 다이아몬드 MIS계면에 있어서 최적의 전기적 특성을 부여하는 BiF2 게이트절연막을 개발하였다. 본 논문의 결과에 의하면, BaF$_2$ 게이트 절연막을 이용하여 제작한 A1/BaF2/diamond MIS 다이오드와 MISFET(Metal-Insulator-Semiconductor Field Effect Transistor)로부터 저농도의 ~10101/$\textrm{cm}^2$ eV의 표면준위밀도가 관측되었고, 그리고 이제까지 발표된 다이아몬드 박막반도_체 FET중 최고치인 400 $\textrm{cm}^2$/Vs의 유효이동도가 관찰되었다.

금속/LB film/금속 구조의 절연 초박막에서의 전압 발생 (Generation of Open circuit voltage in Insulating Ultra Thin Films in Metal/LB film/Metal Structure)

  • 권영수;강도열
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1988년도 추계학술대회 논문집 학회본부
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    • pp.172-174
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    • 1988
  • Studies and measurements of open circuit voltage in a metal/insulator/metal structure where metal are electrodes, when the insulator molecules have dipole moments all oriented parallel to each other have been reported here. The measured voltage has been shown to be directed related to the dipole moment of the molecules in the films. The insulator ultra thin films was deposited on them by the Langmuir-Blodgett technique to obtain the structure referred to as z type and Hetero structure of LB films.

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Effect of Bottom Electrode on Resistive Switching Voltages in Ag-Based Electrochemical Metallization Memory Device

  • Kim, Sungjun;Cho, Seongjae;Park, Byung-Gook
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제16권2호
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    • pp.147-152
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    • 2016
  • In this study, we fabricated Ag-based electrochemical metallization memory devices which is also called conductive-bridge random-access memory (CBRAM) in order to investigate the resistive switching behavior depending on the bottom electrode (BE). RRAM cells of two different layer configurations having $Ag/Si_3N_4/TiN$ and $Ag/Si_3N_4/p^+$ Si are studied for metal-insulator-metal (MIM) and metal-insulator-silicon (MIS) structures, respectively. Switching voltages including forming/set/reset are lower for MIM than for MIS structure. It is found that the workfunction different affects the performances.

Low-energy band structure very sensitive to the interlayer distance in Bernal-stacked tetralayer graphene

  • Lee, Kyu Won;Lee, Cheol Eui
    • Current Applied Physics
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    • 제18권11호
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    • pp.1393-1398
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    • 2018
  • We have investigated Bernal-stacked tetralayer graphene as a function of interlayer distance and perpendicular electric field by using density functional theory calculations. The low-energy band structure was found to be very sensitive to the interlayer distance, undergoing a metal-insulator transition. It can be attributed to the nearest-layer coupling that is more sensitive to the interlayer distance than are the next-nearest-layer couplings. Under a perpendicular electric field above a critical field, six electric-field-induced Dirac cones with mass gaps predicted in tight-binding models were confirmed, however, our density functional theory calculations demonstrate a phase transition to a quantum valley Hall insulator, contrasting to the tight-binding model prediction of an ordinary insulator.

Factors Affecting the Magnitude of the Metal-Insulator Transition Temperature in AMo4O6 (A=K, Sn)

  • Jung, Dong-Woon;Choi, Kwang-Sik;Kim, Sung-Jin
    • Bulletin of the Korean Chemical Society
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    • 제25권7호
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    • pp.959-964
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    • 2004
  • A low-dimensional metal frequently exhibits a metal-insulator transition through a charge-density-wave (CDW) or a spin-density-wave (SDW) which accompany it's structural changes. The transition temperature is thought to be determined by the amount of energy produced during the transition process and the softness of the original structure. $AMo_4O_6$ (A=K, Sn) are known to be quasi-one dimensional metals which exhibit metalinsulator transitions. The difference of the transition temperatures between $KMo_4O_6$ and $SnMo_4O_6$ (A=K, Sn) is examined by investigating their electronic and structural properties. Fermi surface nesting area and the lattice softness are the governing factors to determine the metal-insulator transition temperature in $AMo_4O_6$ compounds.

Metal-insulator Transition in $(Sr_{0.75},\;La_{0.25})TiO_3$ Ultra-thin Films

  • Choi, Jae-Du;Choi, Eui-Young;Lee, Yun-Sang;Lee, Jai-Chan
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 추계학술발표대회
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    • pp.19.2-19.2
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    • 2011
  • The $(Sr_{0.75},\;La_{0.25})TiO_3$ (SLTO) ultra-thin films with various thicknesses have been grown on Ti-O terminated $SrTiO_3$(100) substrate using Laser-Molecular Beam Epitaxy (Laser MBE). By monitoring the in-situ specular spot intensity oscillation of reflection high energy electron diffraction (RHEED), we controlled the layer-by-layer film growth. The film structure and topography were verified by atomic force microscopy (AFM) and high resolution thin film x-ray diffraction by the synchrotron x-ray radiation. We have also investigated the electronic band structure using x-ray absorption spectroscopy (XAS). The ultra thin SLTO film exhibits thickness driven metal-insulator transition around 8 unit cell thickness when the film thickness progressively reduced to 2 unit cell. The SLTO thin films with an insulating character showed band splitting in Ti $L_3-L_2$ edge XAS spectrum which is attributed to Ti 3d band splitting. This narrow d band splitting could drive the metal-insulator transition along with Anderson Localization. In optical conductivity, we have found the spectral weight transfer from coherent part to incoherent part when the film thickness was reduced. This result indicates the possibility of enhanced electron correlation in ultra thin films.

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Properties of Dy-doped $La_2O_3$ buffer layer for Fe-FETs with Metal/Ferroelectric/Insulator/Si structure

  • Im, Jong-Hyun;Kim, Kwi-Jung;Jeong, Shin-Woo;Jung, Jong-Ill;Han, Hui-Seong;Jeon, Ho-Seung;Park, Byung-Eun
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.140-140
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    • 2009
  • The Metal-ferroelectric-semiconductor (MFS) structure has superior advantages such as high density integration and non-destructive read-out operation. However, to obtain the desired electrical characteristics of an MFS structure is difficult because of interfacial reactions between ferroelectric thin film and Si substrate. As an alternative solution, the MFS structure with buffer insulating layer, i.e. metal-ferroelectric-insulator-semiconductor (MFIS), has been proposed to improve the interfacial properties. Insulators investigated as a buffer insulator in a MFIS structure, include $Ta_2O_5$, $HfO_2$, and $ZrO_2$ which are mainly high-k dielectrics. In this study, we prepared the Dy-doped $La_2O_3$ solution buffer layer as an insulator. To form a Dy-doped $La_2O_3$ buffer layer, the solution was spin-coated on p-type Si(100) wafer. The coated Dy-doped $La_2O_3$ films were annealed at various temperatures by rapid thermal annealing (RTA). To evaluate electrical properties, Au electrodes were thermally evaporated onto the surface of the samples. Finally, we observed the surface morphology and crystallization quality of the Dy-doped $La_2O_3$ on Si using atomic force microscopy (AFM) and x-ray diffractometer (XRD), respectively. To evaluate electrical properties, the capacitance-voltage (C-V) and current density-voltage (J-V) characteristics of Au/Dy-doped La2O3/Si structure were measured.

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Basic characteristics of metal-ferroelectric-insulator-semiconductor structure using a high-k PrOx insulator layer

  • Noda, Minoru;Kodama, Kazushi;Kitai, Satoshi;Takahashi, Mitsue;Kanashima, Takeshi;Okuyama, Masanori
    • E2M - 전기 전자와 첨단 소재
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    • 제16권9호
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    • pp.64.1-64
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    • 2003
  • A metal-ferroelectric [SrBi$_2$Ta$_2$O$\_$9/ (SBT)-high-k-insulator(PrOx)-semiconductor(Si) structure has been fabricated and evaluated as a key part of metal-ferroelectric-insulator-semiconductor-field-effect-transistor MFIS-FET memory, aiming to improve the memory retention characteristics by increasing the dielectric constant in the insulator layer and suppressing the depolarization field in the SBT layer. A 20-nm PrOx film grown on Si(100) showed both a high of about 12 and a low leakage current density of less than 1${\times}$ 10e-8 A/$\textrm{cm}^2$ at 105 MV/cm. A 400-nm SBT film prepared on PrOx/Si shows a preferentially oriented (105) crystalline structure, grain size of about 130 nm and subface roughness of 3.2 nm. A capacitance-voltage hysteresis is confirmed on the Pt/SBT/PrOx/Si diode with a memory window of 0.3V at a sweep voltage width of 12 V. The memory retention time was about 1 104s, comparable to the conventional Pt/SBT/SiO$\_$x/N$\_$y/(SiO$\_$N/)/Si. The gradual change of the capacitance indicates that some memory degradation mechanism is different from that in the Pt/SBT/SiON/Si structure.

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