• Journal of Digital Contents Society
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• v.17 no.3
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• pp.173-180
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• 2016

In this paper, a design of transceiver module for real-time wire and wireless robust integrated security system to solve the problem of conventional security system and its transceiver module is proposed. The presented robust integrated security system is designed with RF control unit and wireless transceiver module. A RF controller in transceiver module works as a low-power RF transceiver system. It is designed to use specific bandwidth stored in registers and manipulate RF power of transceiver by accessing the random values of registers. Operation algorithm for RF transceiver module is also presented. The designed transceiver module and the operation algorithm are implemented and verified by experiments.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1673-1675
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• 2004

The design, modeling and measurement of RF switch module for GSM applications is presented in this paper. RF switch module is constructed using a LTCC multi-layer switching circuit and integrated low pass filter. Insertion and return loss of the low pass filter were designed less than 0.3 dB and better than 12.7 dB at 900 MHz. The RF switch module contained 10 embedded passives and 3 surface mount components integrated on $4.6{\times}4.8{\times}1.2$ mm, 6-layer multi-layer integrated circuit. The insertion loss of switch module was measured at 900 MHz was 11 dB.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.710-713
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• 2004

The design, simulation, modeling and measurement of a low temperature co-fired ceramic (LTCC) RF switch module for GSM applications is presented in this paper. RF switch module is constructed using a Rx/Tx switching circuit and integrated low pass filter. The low pass filter function was designed to operate in th GSM band. Insertion and return loss of the low pass filter were designed less than 0.3 dB and better than 12.7 dB at 900 MHz. The RF switch module contained 10 embedded passives and 3 surface mount components integrated on $4.6{\times}4.8{\times}1.2$ nm, 6-layer multi-layer integrated circuit. The insertion loss of switch module was measured at 900 MHz was 11 dB.

• ETRI Journal
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• v.32 no.2
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• pp.195-203
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• 2010

A new vertical transition between a substrate integrated waveguide in a low-temperature co-fired ceramic substrate and an air-filled standard waveguide is proposed in this paper. A rectangular cavity resonator with closely spaced metallic vias is designed to connect the substrate integrated waveguide to the standard air-filled waveguide. Physical characteristics of an air-filled WR-22 to WR-22 transition are compared with those of the proposed transition. Simulation and experiment demonstrate that the proposed transition shows a -1.3 dB insertion loss and 6.2 GHz bandwidth with a 10 dB return loss for the back-to-back module. A 40 GHz low-temperature co-fired ceramic module with the proposed vertical transition is also implemented. The implemented module is very compact, measuring 57 mm ${\times}$ 28 mm ${\times}$ 3.3 mm.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.75-76
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• 2006

A new broadcasting standard for Digital Multimedia Broadcasting(DMB) has been announced in Korea to provide audio, video, and data broadcasting services. There exist two types of DMB; terrestrial DMB and satellite DMB. And in order to service DMB on the single system, the integration of RF module is required. In this paper, we describe an integrated RF tuner module that can receive T-DMB and S-DMB at the same time, which includes an L-band down-converter, a Band III tuner, and a S-DMB tuner.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.11
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• pp.1287-1293
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• 2008

Antenna switch module(ASM) for quad-band was developed. This module was integrated by RFIPD(RF integrated passive device) and transistor switch instead of LTCC-type device using low pass filters, diodes and passive elements in RF front end module for cellular phone. This module leads to low cost and miniaturization(The area is $5{\times}5\;mm$ and the thickness is 0.8 mm). The insertion loss and the return loss of each band were averagely measured as 1.0 dB(insertion loss), 15.1 dB(GSM/EGSM return loss) and 19 dB(DCS/PCS return loss), respectively.

• Journal of Aerospace System Engineering
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• v.16 no.6
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• pp.18-23
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• 2022

This paper examines the electromagnetic shielding structure of ultra-high frequency (UHF) RF modules used in aircraft. Advances in electrical and electronic technologies have increased the need for electronic equipment in aircraft. High-frequency wireless devices have become integrated circuits in the form of UHF integrated circuits to support a wide range of frequencies and miniaturisation. To ensure the functionality and performance of these integrated devices in aviation, shielding is necessary to prevent unexpected electromagnetic interference, which could be detrimental to aircraft safety. A shield structure was designed to protect the RF chipset from malfunctioning, and the shielding effectiveness was improved through the application of various geometric shapes.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.16-21
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• 2016

In this paper, we have designed and fabricated a receiver module for 5.8GHz Microwave Wireless Power Transmission. The receiver module was composed of an antenna, BPF (Band Pass Filter) and RF-DC converter. The antenna was designed to RHCP (Right Hand Circular Polarization). And we used ${\lambda}g/2$ open-circuited stubs for the BPF. In addition, the RF-DC converter used the tripler voltage circuit for voltage multipliers. The integrated receiver RF module for 5.8GHz Microwave Wireless Power Transmission has been designed and fabricated. The voltage was measured to the distance of 50cm.

• Proceedings of the IEEK Conference
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• 2000.07b
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• pp.1119-1122
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• 2000

This paper describes on RF circuit simulation technique, especially on a RF modeling and a model extraction of a LDMOS(Lateral Diffused MOS) that has gate-width (Wg) dependence. Small-signal model parameters of the LDMOSs with various gate-widths extracted from S-parameter data are applied to make the relation between the RF performances and gate-width. It is proved that a source inductance (Ls) was not applicable to scaling rules. These extracted small-signal model parameters are also utilized to remove extrinsic elements in an extraction of a large-signal model (using HP Root MOSFET Model). Therefore, we can omit an additional measurement to extract extrinsic elements. When the large-signal model with Ls having the above gate-width dependence is applied to a high-power LDMOS module, the simulated performances (Output power, etc.) are in a good agreement with experimental results. It is proved that our extracted model and RF circuit simulation have a good accuracy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.431-434
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• 2004

The design, simulation, modeling and measurement of a RF switch module for GSM applications were presented in this paper. switch module were simulated by ADS and constructed using a LTCC multi-layer switching circuit and integrated low pass filter, designed to operate in the GSM band. Insertion and return losses at 900 MHz of the low pass filters were designed to lower than 0.3 dB and higher than 12.7 dB respectively. The switch module constructed, contained 10 embedded passives and 3 surface mounted components integrated on $4.6{\times}4.8{\times}1.2$ m volume, 6-layer integrated circuit. The insertion loss of switch module at m MHz were around 11 dB.