• Journal of the Korea Institute of Information and Communication Engineering
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• v.4 no.3
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• pp.565-573
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• 2000

In this paper, a interdigital microstrip bandpass filter is designed. A interdigital microstrip bandpass filter has many advantages such as insertion return loss, lower return loss, higher frequency selectivity and smaller in size in comparison with the conventional coupled line filter. A interdigital microstrip bandpass filter consists of quasi TEM-mode strip line resonators between parallel ground plant. Each resonator element is a quarter wavelength long of the center frequency and is short circuited at one end and open circuited at the other end. In the filter design, Ensemble software is used. Experimental results show that the bandwidth of interdigital microstrip bandpass filter is 2.52GHz, insertion loss is -1.8dB and return loss is -17.0dB at 11.20Hz.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.71-76
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• 2004

A compact embedded tapped-line combline filter with interdigital capacitors using low temperature co-fired ceramic (LTCC) technology for wireless application is proposed. Also, in-situ measurement using T-pattern microstrip resonator was performed to acquire exact knowledge of electrical properties of the LTCC substrate. The proposed filter makes it possible to realize a relatively small size, 2.7mm${\times}$2.03mm. by employing interdigital and combline structure. It shows 1.8 ㏈ insertion loss, 37.6㏈ return loss, and 280 MHz bandwidth at the center frequency of 5.09 GHz. Its small size and simple structure make it a good candidate as an integrated filter for various LTCC substrates.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.278-282
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• 2003

The rapid growth of wireless and mobile communications has stimulated the development of multilayer filter technology. In this paper, one type of aperture-coupled microstrip interdigital-loop resonators in a multilayer structure are proposed and investigated for the applications to the design of a new class of compact microstrip bandpass filter. The new filter configuration consists of two arrays of microstrip interdigital-loop resonators that can be coupled through the apertures on the common ground plane. Depending on the arrangement of the apertures, different filtering characteristics can easily be realized. The results of measurement are almost similar to those of simulation.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.7
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• pp.694-704
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• 2011

In this paper, we present a design of a 5th order Chebyshev interdigital band-pass filter using inverter and susceptance slope parameter values obtained from EM simulated multi-port Y-parameters. The shifted length of the resonator is determined when the frequency of the transmission zero is separated far away from the center frequency. For the initial dimensions of the interdigital filter, the filter is decomposed into the individual resonators, and the dimensions are obtained using EM Simulation of the decomposed resonators. However, the interdigital filter with the dimensions determined from the EM simulation of the decomposed resonators shows slightly distorted response from the desired frequency response due to the coupling between non-adjacent resonators. To obtain a EM simulation dataset, EM simulation for this filter is carried out by parameter sweep with constant ratio for the initial values. In this dataset, it is determined the final values for the filter by optimization. The fabricated filter by PCB shows an upper-shift of center frequency of about 70 MHz, which was caused by permittivity changed and tolerance of fabrication.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.12
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• pp.1706-1711
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• 2013

This paper presents the filter of a resonator comprising a shorted open gap ring(SOGR) and interdigital lines. The proposed filter has the ultra wideband characteristic operating from 3 GHz to 10.5 GHz. In order to achieve the remarkable improvement in the size-reduction of the overall filter structure, only one cell of the SOGR with the inter-digital lines is adopted. It is shown that this filter has the size of $18mm{\times}15mm$ using a metamaterial, the fractional bandwidth over 100%, the insertion loss much less than 1dB, an acceptable return loss performance in the results.

• Journal of Navigation and Port Research
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• v.31 no.5 s.121
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• pp.415-420
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• 2007

In this paper, we have designed and fabricated a new type of bandpass-filter that used rectangular ring and interdigital capacitive feeding-structure. The filter is applied the modified rectangular ring and interdigital capacitive feeding-structure in patch, which reduce rho size of filter and IEEE 802. 11 correspond to wireless LAN domain(2.45GHz and 5.2GHz) for operating. As a result, the design and fabrication process of the filter become simple and the size of it is reduced more than 60% compared with RF filter are available conventional PEMBF(Parallel Edge-coupled Microstrip Bandpass Filter) of accounted circuit by minimum stage, measurement result of fabricated filter, center frequence is down 2.408GHz and 5.075GHz. input return loss is -39.169dB at 2.408GHz, -40.922dB at 5.075GHz. insertion loss is -0.437dB at 2.408GHz, -1.669dB at 5.075GHz.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.4 no.3 s.8
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• pp.73-78
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• 2005

In this paper, a bandpass filter with excellent cut off characteristic due to transmission zero using bypass coupling capacitor and with superior harmonic characteristic by interdigital capacitor is suggested. The measurement results for SIR bandpass filter with bypass coupling capacitor and interdigital capacitor show that the insertion loss is less than 1.9 dB and the return loss is better than 15.4 dB with 4.2 % bandwidth at the center frequency of 5.78 GHz.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.2
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• pp.245-251
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• 2011

In this paper, dual-band bandpass filter by using Pseudo-Interdigital Stepped-Impedance Resonator(PI-SIR) and Open-Loop Ring Resonator(OLRR) is proposed. The first passband and second passband are formed by PI-SIR and the second passband is reinforced by an OLRR. In a PI-SIR the first band and second band are easily and exactly adjusted by characteristic impedance ratio and electrical length ratio. The proposed design method may be confirmed to be useful from fabricated and measured results for dual-band bandpass filter operated at 2.45 GHz and 5.8 GHz.

• Journal of electromagnetic engineering and science
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• v.15 no.1
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• pp.31-36
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• 2015

The design of a new compact band-pass filter is proposed, which is based on the microstrip composite right- and left-handed transmission- line (CRLH-TL) structure. Particularly, the interdigital coupled (IDC) lines of the CRLH geometry are proposed to be parted by inserting open stubs to meet the specifications on the passband. In addition, there is another pair of stubs to complete the design in a limited space. These are considered in the TL-based analysis and the design parameters are calculated by genetic algorithm optimization. The measurement is shown to be acceptable and agreeable with the circuit and electromagnetic field simulations. In addition, the zerothorder resonance (ZOR) phenomenon is verified.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.140-144
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• 2003

To investigate failure analysis of surface acoustic wave (SAW) filter for radio frequency, high temperature storage test was carried out. The failure criteria were insertion loss at passband and rejection level at stopband. As a result, the insertion loss at passband increase about 4 dB was due to damages of interdigital transducer (IDT). That is caused by poor adhesion between metal electrode(AI) and piezoelectric substrate and defects on a manufacturing process. This result indicates that good adhesion between electrode and ceramic substrate is important factor And also we investigated the demage factors of electrode. Screen possible of saw filter using high temperature storage test(HTOL) in the manufacturing phase be presented.