• Title/Summary/Keyword: Interface bonding

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Feasibility study of bonding state detection of explosive composite structure based on nonlinear output frequency response functions

  • Si, Yue;Zhang, Zhou-Suo;Wang, Hong-fang;Yuan, Fei-Chen
    • Steel and Composite Structures
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    • v.24 no.4
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    • pp.391-397
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    • 2017
  • With the increasing application of explosive composite structure in many engineering fields, its interface bonding state detection is more and more significant to avoid catastrophic accidents. However, this task still faces challenges due to the complexity of the bonding interface. In this paper, the concept of nonlinear output frequency response functions (NOFRFs) is introduced to detect the bonding state of explosive composite structure. The NOFRFs can describe the nonlinear characteristics of nonlinear vibrating system. Because of the presence of the bonding interface, explosive composite structure itself is a nonlinear system; when bonding interface of the structure is damaged, its dynamic characteristics show enhanced nonlinear characteristic. Therefore, the NOFRFs-based detection index is proposed as indicator to detect the bonding state of explosive composite pipes. The experimental results verify the effectiveness of the detection approach.

The Behavior of Intrinsic Bubbles in Silicon Wafer Direct Bonding (실리콘 웨이퍼 직접접합에서 내인성 Bubble의 거동에 관한 연구)

  • Moon, Do-Min;Jeong, Hae-Do
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.3 s.96
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    • pp.78-83
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    • 1999
  • The bonding interface is dependent on the properties of surfaces prior to SDB(silicon wafer direct bonding). In this paper, we prepared silicon surfaces in several chemical solutions, and annealed bonding wafers which were combined with thermally oxidized wafers and bare silicon wafers in the temperature range of $600{\times}1000^{\circ}C$. After bonding, the bonding interface is investigated by an infrared(IR) topography system which uses the penetrability of infrared through silicon wafer. Using this procedure, we observed intrinsic bubbles at elevated temperatures. So, we verified that these bubbles are related to cleaning and drying conditions, and the interface oxides on silicon wafer reduce the formation of intrinsic bubbles.

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Investigation of Maximum Strength and Effective Bonding Length at the Interface Between Structure and GFRP Material Under Freeze-thaw Cycles and Applied Different Bonding Materials (동결융해 및 부착재료 변화에 따른 GFRP-구조물 경계면의 최대 부착강도 및 유효부착길이 평가)

  • Choi, Hyun Kyu;Jung, Woo Young;Ahn, Mi Kyoung
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.15 no.2
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    • pp.107-115
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    • 2011
  • This research studies the behavior of the FRP-concrete interface subjected to two environmental substances. Frist is to investigate the behavior by the application of different bonding materials at the interface between FRP and concrete, second is to understand a long-term performance at the interface by Freeze-thaw actions. The parameters considered in this research are the maximum bonding strength and the effective bonding length at the FRP-concrete interface. In the first experimental phase, three types of specimens are fabricated and tested considering the number of applied bonding materials and the Freeze-thaw tests are performed to evaluate the behavior of the interface in the cycle range of 0 to 300 cycles. Finally, it is known that there is a 5~7% difference of the effective bonding length between applied bonding materials and the values for the maximum stress and the effective length under Freeze-thaw action are varied randomly as the freeze-thaw cycle is increased even though initial reduction of their capacities are occurred.

A Bonding Surface Behavior of Bi-metal Bar through Hydrostatic Extrusion (이중복합봉 정수압 압출시 접합면 거동에 관한 연구)

  • Park, Hun-Jae;Na, Gyeong-Hwan;Jo, Nam-Seon;Lee, Yong-Sin
    • Transactions of Materials Processing
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    • v.7 no.1
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    • pp.66-71
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    • 1998
  • The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the bonding conditions as well as the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding the normal pressure and the contact surface expansion are selected as process parameters governing the bonding conditions, in this study the critical normal pressure required for the local extrusion-the protrusion of virgin surfaces by the surface expansion at the interface-is obtained using a slip line method and is then used as a criteron for the bonding. A rigid plastic finite element method is used to analyze the steady state extrusion process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-cent to interface surface. The contact surface area ration and the normal pressure along the interface are calculated and compared to the critical normal pressure to check bonding. It is found that the model predictions are generally in good agreement with the experimental observations. The compar-isons of the extrusion pressure and interface profile by the finite element with those by experi-ments are also given.

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Effect of Bonding Misfit on Single Crystallization of Transient Liquid Phase Bonded Joints of Ni Base Single Crystal Superalloy (단결정 Ni기 초내열합금 액상확산접합부 단결정화에 미치는 접합방위차의 영향)

  • 김대업
    • Journal of Welding and Joining
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    • v.20 no.5
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    • pp.93-98
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    • 2002
  • The effect of bonding misfit on single crystallization of transient liquid phase (TLP) bonded joints of single crystal superalloy CMSX-2 was investigated using MBF-80 insert metal. The bonding misfit was defined by (100) twist angle (rotating angle) at bonded interface. TLP bonding of specimens was carried out at 1523K for 1.8ks in vacuum. The post-bond heat treatment consisted of the solution and sequential two step aging treatment was conducted in the Ar atmosphere. The crystallographic orientation analysis across the TLP bonded joints was conducted three dimensionally using the electron back scattering pattern (EBSP) method. EBSP analyses f3r the bonded and post bonded heat treated specimens were conducted. All bonded joints had misorientation centering around the bonded interface for as-bonded and post-bond heat treated specimens with rotating angle. The average misorientation angle between both solid phases in bonded interlayer was almost identical to the rotating angle at bonded interface. HRTEM observation revealed that the atom arrangement of both solid phases in bonded interlayer was quite different across the bonded interface. It followed that grain boundary was formed in bonded interface. It was confirmed that epitaxial growth of the solid phase occurred from the base metal substrates during TLP bonding and single crystallization could not be achieved in joints with rotating angle.

A Semi-solid Bonding between Rolled Steel for Structural Parts and Lead Bronze Alloy (구조용 압연강재와 연청동 합금의 반용융 확산접합)

  • 김우열;박홍일;이길근;서원찬
    • Journal of Welding and Joining
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    • v.18 no.1
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    • pp.70-76
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    • 2000
  • A rolled steel for structural parts and lead bronze alloy were bonded each other by a new semi-solid diffusion bonding process to investigate the effect of the process parameters, for example bonding temperature and bonding time, on the interface characteristics, and bonding behavior. It can be possible that manufacture of the bonded steel/lead bronze which has a cylindrical shape with inserted the lead bronze alloy into the steel ring by the diffusion bonding process under the semi-solid condition of the lead bronze alloy without any pressure and flux. It has been know that the control of the amount of the liquid phase in semi-solid lead bronze alloy was very important to obtain soundness interface, since the shear strength of the bonded steel/lead bronze at 850℃ for 60 minutes under the condition of about 40% of the liquid phase in the lead bronze alloy shows maximum value, 210 MPa. The shear strength increases with an increase in bonding time and show maximum value, and then decreases.

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The Variation of Fracture Strength and Modes in $ZrO_2/NiTi$ Bond by Changing Reaction Layer ($ZrO_2/NiTi$ 접합부 반응조직에 따른 꺽임강도 및 파괴거동 변화)

  • 김영정
    • Journal of the Korean Ceramic Society
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    • v.31 no.10
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    • pp.1197-1201
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    • 1994
  • The fracture strength and fracture modes were studied in 3Y-TZP/NiNi bonding which change their interfacial structure with bonding condition. Average 4-point bending strength of 200 MPa to 400 MPa were achieved. The formation of Ti-oxide phase at the interface critically influenced the bonding strength and fracture mode. The fracture surface of Ti-oxide free interface contained multiphase in some case including ZrO2. From the result it was confirmed that in order to maximize the bonding strength crack deflection from interface to ceramic was required.

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Analysis of Bonding Characteristics of a T-shape Structure Fabricated by Superplastic Hydroforming and Diffusion Bonding using two Ti-3Al-2.5V tubes (Ti-3Al-2.5V 튜브의 초소성 하이드로포밍과 확산접합으로 제조된 T형 구조물의 접합 특성 분석)

  • Yoo, Y.H.;Lee, S.Y.
    • Journal of the Korean Society for Heat Treatment
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    • v.31 no.2
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    • pp.49-55
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    • 2018
  • A T-shape structure was manufactured by the superplastic forming and diffusion bonding process using two Ti-3Al-2.5V alloy tubes. A Ti-3Al-2.5V tube was prepared for the hydroforming in the superplastic condition until it reaches a surface area such as a roof welded in the hole of another Ti-3Al-2.5V tube. Afterward, the superplastic forming process and the diffusion bonding process were carried out simultaneously until the appropriate bonding along the interface area of two Ti-3Al-2.5V tubes was obtained. The bonding qualities were different at each location of the entire interface according to the applied process conditions such as strain, pressure, temperature, holding time, geometries, etc. The microstructures of bonding interface have been observed to understand the characteristics of the applied processes in this study.

Mechanical and metallurgical properties of diffusion bonded AA2024 Al and AZ31B Mg

  • Mahendran, G.;Balasubramanian, V.;Senthilvelan, T.
    • Advances in materials Research
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    • v.1 no.2
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    • pp.147-160
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    • 2012
  • In the present study, diffusion bonding was carried out between AZ31B magnesium and AA2024 aluminium in the temperature range of $405^{\circ}C$ to $475^{\circ}C$ for 15 min to 85 min and 5MPa to 20 MPa uniaxial loads was applied. Interface quality of the joints was assessed by microhardness and shear testing. Also, the bonding interfaces were analyzed by means of optical microscopy, scanning electron microscopy, energy dispersive spectrometer and XRD. The maximum bonding and shear strength was obtained at $440^{\circ}C$, 12 MPa and 70 min. The maximum hardness values were obtained from the area next to the interface in magnesium side of the joint. The hardness values were found to decrease with increasing distance from the interface in magnesium side while it remained constant in aluminium side. It was seen that the diffusion transition zone near the interface consists of various phases of $MgAl_2O_4$, $Mg_2SiO_4$ and $Al_2SiO_5$.

Interface Bonding of Copper Clad Aluminum Rods by the Direct Extrusion (직접압출에 의한 Cu-Al 층상 복합재료 봉의 계면접합)

  • 김희남;윤여권;강원영;박성훈;이승평
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.437-440
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    • 2000
  • Composite material consists of more than two materials and make various kinds of composite materials by combining different single materials. Copper clad aluminum composite material is composed of Al and Cu, and it has already been put to practical use in Europe because of its economic benefits. This paper presents the interface bonding according to the variation of extrusion ratio and semi-angle die by observing the interface between Cu and Al using metal microscope. By that result, we can predict the conditions of the interface bonding according to the extruding conditions.

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