• Title/Summary/Keyword: Joining Technology

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Latest Joining Technology of Metal and Plastic (금속과 플라스틱의 최신접합기술)

  • Kim, Youngsik;Kil, Sangcheol
    • Journal of Welding and Joining
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    • v.34 no.3
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    • pp.31-39
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    • 2016
  • The joining technology of the metal and engineering plastic is rising lately as the important issue in concerning with the method of reducing the weight and air pollution of the transportation structure such as automotive and vehicles. The metal/ plastic joining technology has been developed in 2 types of adhesively bonding and direct joining without adhesives. Moreover, in the direct joining method, there are 2 kinds of mechanical joining and welding. This review paper presents the present world wide status and tendency of the development of metal/plastic joining technology. This article intends to offer the materials for development and raising of the domestic metal/plastic joining technology.

Effect of Curing Agent on the Curing Behavior and Joint Strength of Epoxy Adhesive (에폭시 접착제의 경화거동 및 접합강도에 미치는 경화촉매제의 영향)

  • Kim, Min-Su;Kim, Hae-Yeon;Yoo, Se-Hoon;Kim, Jong-Hoon;Kim, Jun-Ki
    • Journal of Welding and Joining
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    • v.29 no.4
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    • pp.54-60
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    • 2011
  • Adhesive bonding is one of the most promising joining methods which may substitute for conventional metallurgical joining processes, such as welding, brazing and soldering. Curing behavior and mechanical properties of adhesive joint are largely dependent on the curing agent including hardener and catalyst. In this study, effects of curing system on the curing behavior and single-lap shear strength of epoxy adhesive joint are investigated. Dihydrazide, anhydride and dicyandiamide(DICY) were chosen as hardener and imidazole and triphenylphosphine(TPP) were chosen as catalyst. In curing behavior, TPP showed the delay of the curing rate for DICY and ADH at $160^{\circ}C$, compared to imidazole catalyst due to the high curing onset/peak temperature. DICY seemed to be most beneficial in the joint strength for both steel and Al adherends, although the type of adherends affected the shear strength of epoxy adhesive joint.

Corrosion Assessment of Al/Fe Dissimilar Metal Joint (Al/Fe 이종금속 접합부의 부식특성)

  • Kang, Minjung;Kim, Cheolhee;Kim, Junki;Kim, Dongcheol;Kim, Jonghoon
    • Journal of Welding and Joining
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    • v.32 no.4
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    • pp.55-62
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    • 2014
  • The use of light-weight Al alloys in the automotive industry is increasing to meet requirements for fuel efficiency and emission reduction. Joining Al alloy to the conventional steel sheet is also very important issue with the increased use of Al alloy, and several joining processes have been introduced to enhance joining strength between dissimilar metals. This paper deals with a galvanic corrosion in the dissimilar metal joining. Salt spray tests up to 2000 hours were conducted on a self-piercing rivet, spot welded, adhesive bonded and weld-bonded joints, and cross-sections and tensile shear strength according the salt spray duration were analyzed at every 500-hour. Self-piercing rivet joint had relative low initial strength but the joint strength did not change regardless of the salt spray duration. The strength of other joints (spot welded, adhesive bonded and weld-bonded joints) decreased with the increase of salt spray duration and the corrosion behaviour of each joint was discussed.

Research of Optimum Reflow Process Condition for 0402 Electric Parts (0402칩의 무연솔더링 최적공정 연구)

  • Bang, Jung-Hwan;Lee, Se-Hyung;Shin, Yue-Seon;Kim, Jeong-Han;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.27 no.1
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    • pp.85-89
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    • 2009
  • Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengos were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under $5^{\circ}$ and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.

Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging (3D 웨이퍼 전자접합을 위한 관통 비아홀의 충전 기술 동향)

  • Ko, Young-Ki;Ko, Yong-Ho;Bang, Jung-Hwan;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.32 no.3
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    • pp.19-26
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    • 2014
  • Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.

Assessment of Advanced Joining Technologies for Metal Pipe in the Construction Industry

  • Kim Chang-Wan
    • Korean Journal of Construction Engineering and Management
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    • v.5 no.2 s.18
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    • pp.81-89
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    • 2004
  • Pipe joining is one of the most critical aspects of most industrial projects, but it is regarded as one of the most inefficient processes in the construction industry. The primary objective of this paper is to explore the applicability of advanced joining technology to the use of metal pipe in the construction industry. This paper begins with a review of current practices with respect to metal joining in the construction industry. The current status of pipe joining is examined. Needs for, and benefits of, advanced joining technology are identified, and a tool for evaluating the applicability of various methods to construction is presented. Joining technologies, including mechanical joining, adhesive bonding, welding, and welding automation, are then introduced, and their applicability to the construction industry is assessed by means of this evaluation tool. It is concluded that there is significant benefits for improvement of piping process in the construction industry through the use of advanced joining technologies.

Evaluation of Friction Spot Joining Weldability of Al Alloys for Automotive (마찰교반 점용접(FSJ)을 이용한 자동차용 Al 합금의 접합성 평가)

  • Cho, Hyeon-Jin;Kim, Heung-Ju;Cheon, Chang-Keun;Chang, Woong-Seong;Bang, Kook-Soo
    • Journal of Welding and Joining
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    • v.24 no.1
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    • pp.50-55
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    • 2006
  • In an attempt to optimize friction spot joining process of Al alloys for automobiles, effects of joining parameters such as tool rotating speed, plunging depth, and joining time on the joints properties were investigated. A wide range of joining conditions could be applied to join Al alloys for automobile without defects in the weld zone except for certain welding conditions with a lower heat input. For sound joints without defects, tensile shear strength of joints was higher than acceptable criteria of tensile shear strength of resistance spot welded joints for aluminum.

Evaluation of Failure Mode and Strength on Baking Time of Adhesive for Hybrid Joining (접착제 경화시점에 따른 하이브리드 접합 파단모드 및 접합강도 평가)

  • Choi, Chul-Young;Saha, Dulal Chandra;Choi, Won-Ho;Kim, Jun-Ki;Kim, Jong-Hoon;Park, Yeong-Do
    • Journal of Welding and Joining
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    • v.29 no.6
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    • pp.49-55
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    • 2011
  • With the development of pre-painted steel sheets for automotive body application, a new joining method is required such as hybrid joining with combination of adhesive bonding and mechanical joining. The objective of this study is to investigate the effect of pre- and post-baking of adhesive bonding on failure mode and strength of hybrid joining of automotive steel sheets. Experiments show that the hybrid joining exhibits better bonding strength and displacement than conventional adhesive joining and mechanical fastening each. Comparison of pre- and post-baked hybrid joining results suggested that baking at $160^{\circ}C$ after mechanical joining was found to have higher joining properties than pre-baking condition. The prebaking condition changed its fracture mode from interfacial to button fracture. The changes in fracture mode with post-baking of hybrid joining was attributed to variation in neck thickness and undercut of joint.