• Journal of electromagnetic engineering and science
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• v.8 no.1
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• pp.28-33
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• 2008

We have proposed a novel DVB-H(Digital Video Broadcast for Handheld) antenna for folder-type mobile handheld terminal by using a coupling element, a stub, and an L-type matching circuit. The L-type matching circuit consisting of two chip inductors is used for achieving an improved impedance matching over the DVB-H frequency band ($470{\sim}702\;MHz$). Simulated results showed the stub worked to more knot the lower and upper frequency ends of the input impedance curve. The antenna exhibits a flat gain characteristic from 2 to 2.8 dBi over the DVB-H frequency band. The radiation patterns are a stable Figure-of-eight radiation pattern in the frequency range.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.26 no.11
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• pp.1686-1696
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• 2022

The impedance matching circuit design technique based on the phasor plot introduced in this paper is based on the impedance triangle of electric circuit. It is a technique that designs through the construction of a phasor figure using the values given to the matching circuit design. The design pattern is based on L-type, inverted L-type, T-type, and 𝜋-type, and unknown reactance elements are determined through phasor shapes. In this paper, using a design by phasor plot, we design several cases, such as the case where the input and output ports are pure resistance and have reactance. It was confirmed that the design value was verified by serial-parallel equivalent conversion to achieve matching. This design technique can immediately grasp the phase or size of input/output power, so it is expected to be applied mainly in a low frequency band due to rapid design change and application.

• Journal of Electrical Engineering and Technology
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• v.9 no.2
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• pp.569-575
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• 2014

A highly efficient class E power amplifier is demonstrated for application to wireless power transfer system. The amplifier is designed with an L-type matching at the output for harmonic rejection and output matching. The power loss and the effect of each component in the amplifier with the matching circuit are analyzed with the current ratio transmitted to the output load. Inductors with a quality factor of more than 120 are used in a dc feed and the matching circuit to improve transmission efficiency. The single-ended amplifier with 20 V supply voltage shows 7.7 W output power and 90.8% power added efficiency at 6.78 MHz. The wireless power transfer (WPT) system with the amplifier shows 5.4 W transmitted power and 82.3% overall efficiency. The analysis and measurements show that high-Q inductors are required for the amplifier design to realize highly efficient WPT system.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1933-1935
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• 2004

본 연구에서는 변압기형 플라즈마 전류 모델을 기초로 한 평판형 유도 결합 플라즈마 장치에 대한 회로를 분석하여 임피던스 매칭 특성을 조사하였다. 장치 임피던스는 collisional surface impedance를 기반으로 계산된 플라즈마 임피던스와 안테나 임피던스로 결정된다. 매칭 network에 사용된 회로는 Altcmatc-typc의 회로이고, 매칭 소자인 $C_T$와 $C_L$은 임피던스 매칭 조건을 이용하여 계산하였다. 완전 매칭의 경우에는 $C_T$와 $C_L$을 플라즈마 변수들의 함수로 표현하여 의존성을 분석하고, 불완전 매칭의 경우에는 반사파에 대한 반사계수, 반사율을 계산하였다.

• Proceedings of the KIPE Conference
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• 2014.07a
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• pp.47-48
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• 2014

기본적으로 전력전송개념에서 최대의 전력이 전달하기 위해서는 전력전송단과 부하단사이의 임피던스를 맞추어 주어야 최대의 전력이 전달된다. 무선전력전송 역시 RF Source와 송수신 코일간의 임피던스를 맞추어야 최대의 전력전달과 효율을 기대할 수 있다. 따라서 송수신 코일과 부하간에 임피던스 매칭은 필수적으로 필요하다. 매칭이 원할하지 않을 경우 RF Source에 반사전력이 반사되어 심각한 손실을 발생할 수 있으며, 수신부의 부하단에 최대로 전력이 전달되지 않으며 전체 시스템 효율이 나빠지게 된다. 임피던스 매칭회로 타입에는 여러가지 타입이 사용되는데 대표적으로 L type, T Type, ${\pi}$ type이 일반적으로 사용된다. 본 연구에서는 L type, T type, ${\pi}$ type 방식을 이용하여 각 타입별 매칭범위와 매칭특성에 대한 기초실험을 수행하였다.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.17 no.4
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• pp.8-12
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• 2003

Characteristics of optical transceiver module in radio frequency(RF) band were investigated with TO-can packaged Fabry-Perot laser diode(FP-LD). R-L-C parameters for equivalent circuit model of the LD were extracted with an impedance analyzer. With this model, impedance matching to the packaged LD could be performed by eliminating inductive components of the leads in the package by using lumped chip capacitors that have opposite reactance, while it shows resonance dip in low frequency band. The resonance dip could be removed using lumped elements for impedance matching by shifting the resonance frequency to the region out of interest.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.291-294
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• 2003

The circuit substrate was made from the Low Temperature Cofired Ceramics(LTCC) that a $\varepsilon_\gamma$ was 7.8. Accumulated Varactor and the low noise transistor which were a Surface Mount Device-type element on LTCC substrate. Let passive element composed R, L, C with strip-line of three dimension in the multilayer substrate circuit inside, and one structure accumulate band-pass filter, resonator, a bias line, a matching circuit, and made it. Used Screen-Print process, and made Strip-line resonator. A design produced and multilayer-type VCO(Voltage Controlled Oscillator), and recognized a characteristic with the Spectrum Analyzer which was measurement equipment. Measured multilayer structure VCO is oscillation frequency 1292[MHz], oscillation output -28.38[dBm], hamonics characteristic -45[dBc] in control voltage 1.5[V], A phase noise is -68.22[dBc/Hz] in 100 KHz offset frequency. The oscillation frequency variable characteristic showed 30[MHz/V] characteristic, and consumption electric current is approximately 10[mA].