• Journal of the Korean Ceramic Society
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• v.34 no.6
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• pp.601-610
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• 1997

In cofiring of multilayered alumina with tungsten, the change of camber with lamination condition was experimented and the effect of sintering shrinkage of alumina and tungsten was investigated. From the exact measurement of sintering shrinkage of tungsten thick film, as lamination pressure increased, the sintering shrinkage of alumina decreased but that of tungsten thick film was not changed. So it was though that the main factor which induced the sintering shrinkage difference between ceramics and metal with lamination condition was the change of sintering shrinkage of ceramics. In case of high lamination pressure, high green sheet density, the cofired specimen showed low camber due to low shrinkage difference between alumina and tungsten and there was a linear relation between camber and shrinkage difference. It was found that this shrinkage difference could change the thickness of tungsten film and the microstructure within via hole during cofiring.

• Journal of the Korean Ceramic Society
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• v.33 no.11
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• pp.1253-1259
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• 1996

In the fabrication of alumina-based multilayer ceramics sintering shrinkages with lamination conditions such as lamination pressure temperature and laminating with and without press die were compared. The sintering shrinkage was affected substantially by lamination pressure and temperature and in the case of laminatino without press die the lower laminated density and a large difference in shrinkage with direction were observed. These results can be explained by introducing a new factor which is the ratio of the changes of areas before and after lamination.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.161-162
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• 2005

2G HTS coated conductor wire consists of textured substrate, buffer layer, superconduct layer, Ag cap layer, stabilizer. For practical application filed, coated conductor have mechanical and electrical stability and environment protection properties. This property Cu and stainless steel strip is laminated to Ag cap layer as stabilizer materials. Lamination process join stabilizer material strip and Ag cap layer with soldering method. we have laminated HTS with continuous dipping soldering process different stabilizer Cu and stainless steel strip and changed lamination process condition. The effect of lamination stabilizer and process condition has been investigated mechanical and electrical properties.

• Proceedings of the KIEE Conference
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• 2003.07b
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• pp.1365-1367
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• 2003

In this paper, element technologies such as soldering. arrangement and lamination processes for photovoltaic module manufacture were examined and described as main processes. Especially solder paste and temperature condition in soldering process, loss factor in arrangement process and process conditions in lamination process are investigated to minimize the electrical loss. As a results, temperature condition in soldering process was found to be critical to contact resistance of electrode and life-time. Productivity of the process decreases dramatically by physical damage during arrangement process. Pressure level and press condition of upper chamber in lamination process were important parameters for the reliability. According to the test result of photovoltaic module, electrical properties dropped about $5{\sim}25%$ after 5 years.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.811-812
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• 2008

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.458-462
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• 2005

This paper deal with the optimal lamination condition of cylindrical shell applied new composite URN300 for a study of composite empirical formula. Finite element analyses for isotropic materials considered element numbers and boundary conditions are compared with existing empirical formulas to apply FE analysis for composite. And composite tensile test is done to know the composite material applied FE analysis for composite. The results of FE analyses for isotropic materials have indicated that Optimal element number and boundary condition were 1600 and both simple support. These conditions were applied in composite FE analyses. Ply orientations and lamination patterns in FE analyses for composite were considered. Ply orientations are $0^{\circ},\;15^{\circ},\;30^{\circ},\;45^{\circ},\;60^{\circ},\;75^{\circ},\;and\;90^{\circ}$. Lamination patterns are $[\pm\theta/0/90]_{14s]$ and $[\pm\theta_{14}/0_{14}/90_{14}]_s$ in FE analysis. Lamination pattern $[\pm\theta_{14}/0_{14}/90_{14}]_s$ is the equivalent model of $[\pm\theta/0/90]_{14s}$. At the result of this study, the FE analyses for composite have indicated that the optimized ply orientation $75^{\circ}$ is and real model must use in FE analysis for accurate results.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.67-70
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• 2007

LTCC (Low Temperature Co-fired Ceramic) has been emerged as a promising technology in packaging industry. In this technology the lamination and the sintering process are very important because they change the permittivity of ceramics and the dimension of metal pattern which have influences on electric property. In this paper we studied on influence of the permittivity and the dimension change by lamination pressure and sintering temperature of LTCC process. As a results, permittivity increase along with increasing of lamination pressure and sintering temperature.

• Transactions of Materials Processing
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• v.16 no.5 s.95
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• pp.396-400
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• 2007

LTCC(Low Temperature Co-fired Ceramic) which offers a good performance to produce multilayer structures with electronic circuits and components has emerged as an attractive technology in the electronic packaging industry. In LTCC module fabrication process, the lamination and the sintering are very important processes and affect the electrical characteristics of the final products because the processes change the permittivity of ceramics and the dimension of the circuit patterns which have influences on electronic properties. This paper discusses the influence of lamination pressure and sintering temperature on the permittivity and the dimensional change of LTCC products. In the present investigation, it is shown that the permittivity increases along with increasing of the lamination pressure and the sintering temperature.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.21-28
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• 2004

We have demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon ) printed circuit board (PCB). The copper lines were formed with 100$\mu\textrm{m}$ width and 18$\mu\textrm{m}$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200$\mu\textrm{m}$. The DFRs of 15$\mu\textrm{m}$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100{\circ}C$ to 15$0^{\circ}C$ and laminating speed from 0.28-0.98cm/s. We have found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50$\mu\textrm{m}$ with pitch of 100$\mu\textrm{m}$.

• Journal of the Korea Society for Simulation
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• v.1 no.1
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• pp.17-24
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• 1992

The capacity of the drilling process in Multi-Layer PCB fabrication can be affected by various process parameters determining material flows in the unit operations. The ratio of mass-lamination to pin lamination and the number of stacks as the most critical paramaters, among them, were chosen on the basis of exhaustive field evaluation to study their effects on the capacity of the process. The best alternative condition for maximum capacity of the process was selected by simulation of process.