• 제목/요약/키워드: Laminator

검색결과 15건 처리시간 0.026초

BIPV모듈의 제조공정에 관한 실험적 연구 (An Experiment Study on Manufacturing process of BIPV Module)

  • 안영섭;김성태;이성진;윤종호
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 추계학술대회 초록집
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    • pp.54-54
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    • 2010
  • In this study, the correlation between temperature and the gel-content of the module were analyzed through experiments. Amorphous thin-film solar cell used in this experiment has a visible light transmission performance of 10%. In addition, ethylene vinyl acetate(EVA) film and the clear glass have been used for the modulation. The most important process is to laminate the module in the manufacturing process of BIPV(Building integrated photovoltaic) module. Setting parameters of laminator in the lamination process are temperature, pressure and time. Setting conditions significantly affect the durability, watertightness and airtightness of module. The most important factor in the setting parameters is temperature to satisfy the gel-contents. The bottom and top surface temperature of module are measured according to setting temperature of laminator. The results showed $145^{\circ}C$ of max temperature of the bottom surface and $128^{\circ}C$ of max temperature of top surface on the module at the temperature condition of $160^{\circ}C$. And at the another temperature condition of laminator with $150^{\circ}C$, the max temperature do bottom and top are $117^{\circ}C$ and $134^{\circ}C$ respectively. The temperature difference between bottom and top of the module occurred, that is because heat has been blocked by the clear glass and the bottom of the cells absorb the heat from the laminator. In this particular, the temperature difference between setting temperature of the laminator and the surface temperature of the module showed $15^{\circ}C$, because the heat of laminator plate is transferred to the surface of the module and heat is lost at this time. As a results, gel-content showed 94.8%, 88.7% and 81.7% respectively according to the setting temperature $155^{\circ}C$, $150^{\circ}C$ and $145^{\circ}C$ of the laminator. In conclusion, the surface temperature of module increases, the gel-contents is relatively increased. But if the laminator plate temperature is too high, the gel-content shows rather decline in performance. Furthermore, the temperature difference between setting temperature and the surface temperature of the module is affected by laminating machine itself and the temperature of module should be considered when setting the laminator.

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사례기반학습법을 적용한 기계공학 교과목 설계: 라미네이터 장비 제작 (Course Design for Mechanical Engineering Applying Case-Based Learning: Manufacturing of Laminator Machine)

  • 유선중
    • 공학교육연구
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    • 제23권5호
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    • pp.61-67
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    • 2020
  • In the associate degree curriculum of the department of mechanical engineering, the results of the study are presented on the structure and content of a subject based on the case-based learning method. As an case, equipment called a laminator that is actually used in the manufacturing site was selected. Class deals with specific engineering issues at each stage of laminator manufacturing (design-machining-assembly-measurement-maintenance) in connection with general engineering topics in prerequisites in the curriculum. Topics include tolerance fit, length measurement, assembly practice, measurement design and statistics of machine maintenance, etc. Courses that apply the case-based learning method may be included in the curriculum as complementary roles to those that apply other student-centered learning method.

라미네이터장비의 부품 치수공차가 가압력 균일도에 미치는 영향에 대한 실험적 분석 (Experimental Analysis for the Effect of Part's Dimensional Tolerance on the Pressing Pressure Uniformity of Laminator Equipment)

  • 유선중
    • 반도체디스플레이기술학회지
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    • 제16권4호
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    • pp.52-58
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    • 2017
  • In this study, we tried to analyze and measure the correlation between the part dimensional tolerance empirically applied by the designer and the final performance of the equipment, which is expressed as the pressing pressure uniformity. For this purpose, the dimensional tolerances and pressing pressure uniformity of eight laminator equipments were measured actually. As a result of the correlation analysis, it was confirmed that the tolerance grade for each dimension determined by the designer was valid. In the case of laminator equipment, the driving parts and the flatness have the largest influence on the uniformity of the pressing pressure.

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태양전지 모듈 제조장치의 구성 및 Laminator의 온도 특성 (Construction of Equipment for PV Module Manufacture and Temperature Characteristics of Laminator)

  • 강기환;소정훈;정영석;정명웅;유권종
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2002년도 하계학술대회 논문집 B
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    • pp.1376-1378
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    • 2002
  • Compare and examined Full Auto Line of PV module Manufacture Equipment and PV module Manufacture Equipment in the Korea. Full Auto Line has been constructed with Cell Selection. Tabbing & Stringing. Module Setting, Lamination, Curing and Module Testing, and Module Manufacture Line in the Korea has been constructed with Tabbing & Stringing. Module Setting, Lamination and Module Testing. Laminator's temperature Control is the most important Variable in Manufacture of PV module. Temperature Transformation of Center part of PV module is most high at Lamination, and Edge part is most low.

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건식 필름 적층 성형기에서 고온 롤러의 열해석 (Thermal Analysis of Hot Roller in a Dry Film Laminator)

  • 임광옥;이관수
    • 대한기계학회논문집B
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    • 제25권7호
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    • pp.975-980
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    • 2001
  • The thermal analysis of the hot roller in a dry film laminator is studied numerically by steady-state two-dimensional heat transfer. In the laminating process for PDP glass or PCB, the temperature distributions in a hot roller are presented considering the effects of the roller rotation speed and the inner and outer radii of the roller. The results show that the temperature distributions are strongly dependent on Peclet number. If Pe number becomes larger, the iso-thermal lines are more concentric about the rotating axis and the temperature difference on the hot roller surface decreases exponentially. It also shows that if the contact angle between the roller and the film becomes smaller the temperature difference becomes smaller. However, the changes of the rollers inner or outer radius have little effect on the temperature difference.

고온 롤 라미네이터용 멤브레인 구조 필름형 압력 센서 개발 (Development of Membrane Film Pressure Sensor for Hot Roll Laminator)

  • 김도연;이태경;강필식
    • 한국산업융합학회 논문집
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    • 제23권6_2호
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    • pp.1059-1065
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    • 2020
  • Demand for pressure sensors is increasing in various fields such as machinery, healthcare and medical care. A recent study is being conducted to create sensors that are more sensitive and have longer linear sections based on measurement principles. In this paper, a film-type sensor with a membrane structure was developed to measure the pressure distributed in the axial direction of a hot roll laminator. Performance of sensors was evaluated by resistance and durability according to membrane diameter. The resistance of the membrane sensor varies according to the contact state and contact area of the electrode. Therefore, the membrane diameter selection is important. Experiments showed the most pronounced variation in resistance under pressure at 8 mm in diameter of membrane. Reliability evaluation of sensors was carried out at room temperature and high temperature. The pressure on the sensor was pressurized 1000 times to measure the initial resistance and the resistance after the evaluation to analyze the change. Sensors showed stable results with low resistance changes of 5.15% and 6.27%, respectively. A large area sensor manufactured using the developed sensor also showed reliable results.

데칼 공정을 적용한 고성능 MEA 개발 (Development of High Performance MEA by Decal Method for PEM Fuel Cell)

  • 이기섭;이재승;권낙현;황인철
    • 한국수소및신에너지학회논문집
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    • 제22권5호
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    • pp.585-591
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    • 2011
  • This study has focused on the development of high performance membrane-electrode assemblies (MEAs) fabricated by decal method for proton exchange membrane fuel cell (PEMFC). To study the effect of ionomer contents on performance, we fabricated MEAs with several electrodes which were prepared by varying the quantity of ionomer from 20 wt.% to 45 wt.% in catalyst layer. The MEA performance was obtained through single cell test. The MEA prepared from electrode with 25wt.% of ionomer showed the best performance. We evaluated the surface area and pore volume of electrode with BET. We found that the surface area and pore volume in electrode decreased rapidly at the electrode with 40wt.% of ionomer in catalyst layer. MEA was fabricated by roll laminator machine and the roll laminating conditions for the preparation of MEA, such as laminating press, temperature and speed, were optimized. The MEA performance is not affected by laminating temperature and speed, but roll laminating press have a great effect on MEA performance.

Dry Film Photoresist를 이용한 테프론 PCB 위 미세 피치 솔더 범프 형성 (Formation of Fine Pitch Solder Bumps on Polytetrafluoroethylene Printed Circuit Board using Dry Film Photoresist)

  • 이정섭;주건모;전덕영
    • 마이크로전자및패키징학회지
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    • 제11권1호
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    • pp.21-28
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    • 2004
  • Polytetrafluoroethylene (PTFE/Teflon ) 인쇄회로기판용 미세 피치 솔더 범프 형성을 위해 dry film photoresist (DFR)를 photolithography 공정에 적용하였다. DFR lamination을 위한 test board는 폭 100$\mu\textrm{m}$와 두께 18$\mu\textrm{m}$의 copper line들이 100-200$\mu\textrm{m}$의 간격으로 배열된 형태로 디자인하였다. 15$\mu\textrm{m}$의 두께를 갖는 DFR을 hot roll laminator를 사용하여 lamination 온도와 속도를 변화시켜가면서 lamination 공정 실험을 수행하였다. 실험 결과, PTFE 인쇄회로기판에 DFR을 lamination하는 공정의 최적 조건은 lamination 온도 $150^{\circ}C$, 속도 약 0.63cm/s였다. UV exposure 및 development 공정을 거쳐 저융점 솔더 재료인 인듐을 증착하였다. DFR 박리 순서에 따른 두 가지 다른 reflow 공정을 통해 최소 지름 50$\mu\textrm{m}$, 최소 피치 100$\mu\textrm{m}$를 갖는 인듐 솔더 범프를 형성하였다.

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Dry Film Photoresist를 이용한 테프론 PCB 위 미세 피치 솔더 범프 형성 (Formation of Fine Pitch Solder Bumps on Polytetrafluoroethylene Printed Circuit Board using Dry Film Photoresist)

  • 이정섭;주건모;전덕영
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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    • pp.169-173
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    • 2003
  • We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.

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