• Title/Summary/Keyword: Large-area mold

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Soft Mold Deformation of Large-area UV Impring Process (대면적 UV 임프린팅 공정에서 유연 몰드의 변형)

  • Kim, Nam-Woong;Kim, Kug-Weon
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.4
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    • pp.53-59
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    • 2011
  • Recently there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper we focused on the deformation of the $2^{nd}$ generation TFT-LCD sized ($370{\times}470mm^2$) large-area soft mold in the UV imprinting process. A mold was fabricated with PDMS(Poly-dimethyl Siloxane) layered glass back plate(t0.5). Besides, the mold includes large surrounding wall type protrusions of 1.9 mm width and the via-hole(7 ${\mu}m$ diameter) patterend area. The large surrounding wall type protrusions cause the proximity effect which severely degrades the uniformity of residual layer in the via-hole patterend area. Therefore the deformation of the mold was calculated by finite element analysis to assess the effect of large surrounding wall type protrusions and the flexiblity of the mold. The deformation of soft mold was verified by the measurements qualitatively.

A Study on Fabrication of Inner Structure Plate for Large-area Using Micro Patterned Press Mold (미세패턴 프레스 금형을 이용한 대면적 내부구조재 제작에 관한 연구)

  • Kim, H.J.;Je, T.J.;Choi, D.S.;Kim, B.H.;Huh, B.W.;Seong, D.Y.;Yang, D.Y.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2006.06a
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    • pp.40-44
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    • 2006
  • Sandwich structures, which are composed of a thick core between two faces, are commonly used in many engineering applications because they combine high stiffness and strength with low weight. Accordingly, the usage of sandwich structure is very widely applied to the aircraft, the automobile and marine industry, etc., because of these advantages. In this paper, we have investigated the buckling protection of an inner structure plate and the useful corrugated configuration for contact, and the fabrication method of the inner structure plate for large area using the continuous molding process. Also, we have guaranteed the accuracy of the molding process through the micro corrugated mold fabrication and secured the accuracy and analyzed aspect properties of the inner structure plate fabricated for a large area using the partial mold process.

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4 Inch Wafer-Scale Replicability Enhancement in Hot Embossing by using PDMS-Cushioned Si Mold (PDMS 쿠션을 갖는 Si 몰드에 의한 핫엠보싱 공정에서의 4 인치 웨이퍼 스케일 전사성 향상)

  • Kim Heung-Kyu;Ko Young-Bae;Kang Jeong-Jin;Heo Young-Moo
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.8 s.185
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    • pp.178-184
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    • 2006
  • Hot embossing is to fabricate desired pattern on the polymer substrate by pressing the patterned mold against the substrate which is heated above the glass transition temperature, and it is a high throughput fabrication method for bio chip, optical microstructure, etc. due to the simultaneous large area patterning. However, the bad pattern fidelity in large area patterning is one of the obstacles to applying the hot embossing technology for mass production. In the present study, PDMS pad was used as a cushion on the backside of the micro-patterned 4 inch Si mold to improve the pattern fidelity over the 4 inch PMMA sheet by increasing the conformal contact between the Si mold and the PMMA sheet. The pattern replicability improvement over 4 inch wafer scale was evaluated by comparing the replicated pattern height and depth for PDMS-cushioned Si mold against the rigid Si mold without PDMS cushion.

Deformation of a mold for large area UV-nanoimprint lithography in alignment and curing processes (UV 나노임프린트리소그래피의 정렬 공정 중 몰드의 변형해석)

  • Park, In-Soo;Won, Chong-Jin;Yim, Hong-Jae;Jeong, Jay-I.
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1939-1943
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    • 2008
  • Deformation of a mold is measured and analyzed in alignment and curing processes of UV-Imprint Lithography. We are focused on mold deformation caused by a UV resin, which is laminated between a mold and a target glass-panel. The UV resin is viscous in case of liquid state, and the resin will be solidified when being exposed by the ultra-violet light. The viscosity of the resin causes shear force on the mold during the alignment process. Moreover, the shrinkage during phase change from liquid to solid may cause residual stress on the mold. The experiments for measuring temperature and strain are made during alignment and curing process. Strain-gages and thermocouples are used for measuring the strain and variation of temperature on several points of the mold, respectively. The deformation of mold is also simulated and analyzed. The simulation results are compared with the experiments. Finally, sources of alignment errors in large area UV-nanoimprint lithography are discussed.

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Study on the Enhancement of the Uniform Contact Technology for Large Scale Imprinting with the Design of Vacuum Gripping Pad (진공척 흡착패드 형태에 따른 대면적 임프린팅 균일 접촉 향상 연구)

  • Jang, Si-Youl
    • Tribology and Lubricants
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    • v.24 no.6
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    • pp.326-331
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    • 2008
  • The contact surfaces between mold and target should be in parallel for a proper imprinting process. However, large size of contacting area makes it difficult for both mating surfaces (mold and target planes) to be in all uniform contact with the expected precision level in terms of thickness and position. This is caused by the waviness of mold and target although it is very small relative to the area scale. The gripping force for both mold and target by the vacuum chuck is other major effect to interrupt the uniform contact, which must be avoided in imprinting mechanism. In this study, the cause of non-conformal contact mechanism between mold and target is investigated with the consideration of deformation due to the vacuum gripping for the size $470{\times}370\;mm^2$ LCD panel.

A Study on the development of Inner Structured Plate with Micro Corrugated (미세 골판형 내부구조재 개발에 관한 연구)

  • Kim H.J.;Choi D.S.;Je T.J.;Kim B.H.;Huh B.W.;Yang D.Y.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.207-208
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    • 2006
  • Sandwich structures, which are composed of a thick core between two faces, are commonly used in many engineering applications because they combine high stiffness and strength with low weight. In this paper, we have investigated the buckling protection of an inner structure plate and the useful corrugated configuration for contact, and the fabrication method of the inner structure plate for large area using the continuous molding process. Also, we have guaranteed the accuracy of the molding process through the micro corrugated mold fabrication and analyzed aspect properties of the inner structure plate fabricated for a large area using the partial mold process.

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A study on the Large Area Rapid-Injection Compression Molding for Mold Optimum Design (대면적 쾌속 사출압축성형을 위한 금형설계 최적화)

  • Kim, T.H.;Kim, J.Y.;Kim, J.S.;Kang, J.J.;Kim, J.S.;Roh, S.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2009.10a
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    • pp.99-102
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    • 2009
  • The recent LCD TV market has made efforts to produce thinner, brighter, and clearer products, and experienced the rapid light source replacement from a line source of light CCFL to a point source of light LED. In particular, LGP(Light Guiding Panel) among key parts composing BLU(Back Light Unit) has limits of the injection molding technology as well as the mold design, its processing and manufacturing technology so that it is hard to produce large LGP over 40 inch. To produce large light-guide panels over 40 inch under the injection molding process, a mold 3D model was developed in the design process before manufacturing a mold and structure unification was processed through CAE analysis. As a result, it was possible to construct the mold design process, and it is expected to manufacture the optimized mold by applying the mold design and manufacturing process of large-scale rapid injection-compression molding that will be produced in the future.

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Development of Roll-to- Flat Thermal Imprinting Equipment and Experimental Study of Large Area Pattern Replication on Polymer Substrate

  • Lee, Moon-G.;Lan, Shuhuai;Lee, Soo-Hun;Lee, Hye-Jin;Ni, Jun;Sung, Yeon-Wook
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.18 no.3
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    • pp.307-314
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    • 2009
  • Large area micro pattern replication has promising application potential in many areas. Rolling imprint process has been demonstrated as one of the most competitive processes for such micro pattern replication, because it has advantages in low cost, high throughput and high efficiency. In this paper, we developed a prototype of roll-to-flat(R2F) thermal imprint system for large area micro pattern replication process, which is one of the key processes in the fabrication of flexible displays. Experimental tests were conducted to evaluate the feasibility of system and the parameters' effect on the process, such as flat mold temperature, loading pressure and rolling speed. 100mm $\times$ 100mm stainless steel flat mold and commercially available polycarbonate sheets were used for the tests. The experimental results showed that the developed R2F system is suitable for fabrication of various micro devices with micro pattern over large area.

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Rapid cooling of injection mold for high-curvature parts using CO2 cooling module (CO2 냉각모듈을 적용한 고곡률 성형품의 사출금형 급속냉각)

  • Se-Ho Lee;Ho-Sang Lee
    • Design & Manufacturing
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    • v.16 no.4
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    • pp.67-74
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    • 2022
  • Injection molding is a cyclic process comprising of cooling phase as the largest part of this cycle. Providing efficient cooling in lesser cycle times is of significant importance in the molding industry. Recently, lots of researches have been done for rapid cooling of a hot-spot area using CO2 in injection molding. The CO2 flows under high pressure through small, flexible capillary tubes to the point of use, where it expands to create a snow and gas mixture at a temperature of -79℃. The gaseous CO2 removes heat from the mold and releases it into the atmosphere. In this paper, a CO2 cooling module was applied to an injection mold in order to cool a large area cavity uniformly and quickly, and the cooling performance of the injection mold was investigated. The product was a high-curvature molded part with a molding area of 300x100mm. Heat cartridges were installed in a stationary mold, and CO2 cooling module was inserted inside a movable mold. Through structural analysis, it was confirmed that the maximum deformation of mold with CO2 cooling module was 0.09mm. A CO2 feed system with a heat exchanger was used for cooling experiments. The CO2 was injected into the holes on both sides of the supply pipe of the cooling module and discharged through hexagon blocks to cool the mold. It took 5.8 seconds to cool the mold from an average temperature of 140℃ to 70℃. Through the experiment using CO2 cooling module, it was found that a cooling rate of up to 12.98℃/s and an average of 10.18℃/s could be achieved.