• Proceedings of the KIPE Conference
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• 2014.07a
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• pp.59-60
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• 2014

In this paper, development of laser diode driver with 2.5kW rating is presented. The driver is configured with interleaved PFC converter, high frequency full bridge DC-DC converter, two laser diode drivers and ${\mu}$-processor based controller. The system has two laser diode drivers for providing high current and low current. High current driver delivers normal output power of diode; low current driver is for providing critical current of diode for long lifetime. Computer simulation and experiment was performed for verification, as the results, developed driver performs well.

• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.1078-1080
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• 1999

A laser pulse generator which consists of charging resistor, energy storage capacitor laser diode, and switching elements was designed in order to generate 15ns, 20W laser pulses. And the effects of performances of SCR and FET as switching elements are compared. When SCR is used, the SCR's low maximum voltage makes the circuit so complicated, and when FET is used, the FET needs the special sate driver which improves the FET's operation.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.64 no.5
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• pp.746-750
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• 2015

In this paper, we propose a simulator to evaluate the performance of the semi-active laser guidance or the quadrant photodetector and to simulate the laser power reflected from a target. The laser pulse repetition frequency was generated and synchronized with the laser pulse repetition(PRF) code. To evaluate the performances of the proposed methods, we implemented a prototype system and performed experiments. As a result, the generated high voltage was variable in the range of DC 3V to 340V and has the rate of change of 2000 V/s. PRF code can be generated within 50ms ∼ 100ms and the error is implemented within 0.3ns. The laser output is synchronized with the PRF code and has a dynamic range of 23.6dB.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.423-426
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• 2005

A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.1
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• pp.49-58
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• 1998

In this paper, a new equivalent circuit model for quantum-well laser diode (LD) is proposed. The model includes carrier transport effects in the SCH region, and rprovides, in a stable and accurate manner, large-and small-signal responses of laser diode output power as function of injected currents. SPICE simulation was performed using the circuit model and results are presented for L-I characteristics, pulse and frequency responses under various conditions. It is expencted that the new equaivalent circuit model will find useful applications for designing and analyzing OEIC, LD driver circuits, and LD packaging.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.7 no.4
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• pp.147-150
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• 2014

In this paper, pulse current type power supply for laser diode dirver is discussed. High speed high power laser has been using widely because it becomes using on medical or manufacturing equipment, but researches have not being occurred actively. Current profiling method is proposed for improved lifetime expectancy of laser diode(LD). The current waveform of driving LD is most important factor of the performance and lifetime of LD. The proposed method improves shape and stability of current waveforms, thus will effect right direction of lifetime expectation.

• Current Optics and Photonics
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• v.6 no.4
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• pp.407-412
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• 2022

We report on a diode-laser-pumped mode-locked Yb:KGW laser system, which delivers ultrashort pulses down to 89 fs at a repetition rate of 63 MHz, with an average power of up to 5.6 W. A fiber-coupled diode laser at 981 nm, operated with a compact driver, is used to optically pump the gain crystal via an off-axis parabolic mirror. A semiconductor saturable-absorber mirror is used to initiate the pulsed operation. Laser characteristics such as the pulse duration, spectrum bandwidth, and output power are investigated by varying the intracavity dispersions via changing the number of bounces between negative-dispersive mirrors within the cavity. Short pulses with a duration of 89 fs, a center wavelength of 1,027 nm, and 3.6 W of output power are produced at a group-velocity dispersion (GVD) of -3,300 fs². As the negative GVD increases, the pulse duration lengthens but the output power at the single-pulse condition can be enhanced, reaching 5.6 W at a GVD of -6,600 fs². Because of pulse broadening at high negative GVDs, the highest peak intensity is achievable at a moderate GVD with our system.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.19 no.3
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• pp.667-673
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• 2015

A laser diode(LD) has been studied in many fields what medical, industrial processing, sensor, advertising equipment, printing equipment. And the LD is being used in industry. However, LD will require precision handling. Therefore, the actual use of LD is limited to areas of specialization. In this study, attend to the characteristics of the LD what weak to electrostatic and physical impact, current and heat. And will make a sample module that use comfortably a various wavelength LD. Furthermore, Furthermore, through the printing CTP(Computer to Plate) equipment used the 128-channel LD-Driver, compares it with a 64-channel CTP device about the print speed and resolution. And will solved the problem of delay between the dot and the dot. Finally, consider the potential of the 256-channel LD-Driver.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.53-81
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• 2006

A COG(Chip on Glass) bonding process that is one of display packaging technology and bonds between driver IC chip and a glass panel using ACF(Anisotropic Conductive Film)has been investigated by using diode laser. This method is possible to raise cure temperature of ACF within one second and can reduce the total process time for COG bonding by a conventional method such as a hot plate. Also we can get good pressure mark on the surface of electrodes and higher bonding strength than that by convention method. Results show that laser COG bonding can give low pressure bonding and decrease a warpage of panel. We believe that it can be applied to fine pitch module.

• Journal of Korea Society of Digital Industry and Information Management
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• v.10 no.2
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• pp.13-20
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• 2014

In this paper, we implemented the object scanning with nxtOSEK which is an open source platform. nxtOSEK consists of device driver of leJOS NXJ C/Assembly source code, TOPPERS/ATK(Automotive real time Kernel) and TOPPERS/JSP Real-Time Operating System source code that includes ARM7 specific porting part, and glue code make them work together. nxtOSEK can provide ANSI C by using GCC tool chain and C API and apply for real-time multi tasking features. We experimented the 3D scanning with ultra sonic and laser sensor which are made directly by laser module diode and experimented the measurement of scanning the object by knowing x, y, and z coordinates for every points that it scans. In this paper, the laser module is the dimension of $6{\times}10[mm]$ requiring 5volts/5[mW], and used the laser light of wavelength in the 650[nm] range. For detecting the object, we used the beacon detection algorithm and as the laser light swept the objects, the photodiode monitored the ambient light at interval of 10[ms] which is called a real time. We communicated the 3D scanning platform via bluetooth protocol with host platform and the results are displayed via DPlot graphic tool. And therefore we enhanced the functionality of the 3D scanner for identifying the image scanning with laser sensor modules compared to ultra sonic sensor.