• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.02a
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• pp.178-181
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• 2003

Intermediate cooling for current lead is used of thermal link in conduction cooling and cooled of itself in liquid cooling because it is put in liquid. If a existing formula for cooling load and optimal diameter-length of current lead is applied, it generate some more cooling load. Therefore, variation of thermal link height and holding depth in liquid is considered. This result is used of reducing cooling load of current lead occupying most of superconducting system load and applying liquid/conduction cooling systems.

• International Journal of Air-Conditioning and Refrigeration
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• v.16 no.2
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• pp.64-69
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• 2008

Electronic and telecommunication industries are constantly striving towards miniaturization of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In this study, liquid-cooling heat exchangers were designed and tested by varying geometry and operating conditions. In addition, air-cooling heat exchangers were tested to provide performance data for the comparison with the liquid-cooling heat exchangers. The liquid-cooling heat exchangers had twelve rectangular channels with different flow paths of 1, 2, and 12. Silicon rubber heaters were used to control the heat load to the heat exchangers. Heat input ranged from 293 to 800W, and inlet temperatures of working fluid varied from 15 to $27^{\circ}C$. The heat transfer coefficients were strongly affected by flow conditions. All liquid-cooling heat exchangers showed higher cooling performance than the air-cooling heat exchanger. The heat exchanger with 2-paths could provide more controllability on the maximum temperature than the others.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.1-6
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• 2013

3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.12
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• pp.95-103
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• 2007

This paper presents a liquid cooling concept for heat rejection of high power electronic devices existing in notebook computers etc. The design, fabrication, and performance of the planar ECF pump and farced-liquid cooling system are summarized. The electro-conjugate fluid (ECF) is a kind of dielectric and functional fluids, which generates jet flows (ECF-jets) by applying static electric field through a pair of rod-like electrodes. The ECF-jet directly acts on the working fluid, so the proposed planar ECF pump needs no moving part, produces no vibration and noise. The planar ECF pump, consists of a pump housing and electrode substrate, achieves maximum flow rate and output pressure of $5.5\;cm^3/s$ and 7.2 kPa, respectively, at an applied voltage of 2.0 kV. The farced-liquid cooling system, constructed with the planar ECF pump, liquid-cooled heat sink and thermal test chip, removes input power up to 80 W keeping the chip surface temperature below $70\;^{\circ}C$. The experimental results demonstrate that the feasibility of forced-liquid cooling system using ECF is confirmed as an advanced cooling solution on the next-generation high power electronic devices.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.197-202
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• 2007

In this study, the cooling characteristics of a liquid cooler using thermoelectric module was experimentally investigated. The experiment was conducted for various inner structures of liquid cooler (4 cases), hot fluid flow rates (0.15-0.25 L/min), number of T.E module (2, 4, 6 set), and the cooling water flow rates (200-600 cc/min) for both parallel and counter flow types. Among the results, better cooling performance geometry was selected. And experiment was also carried out to examine further enhancement of cooling performance by inserting coils (pitches: 0.2, 3, 6 mm) into the hot-fluid channel. Present results showed that the short serpentine type(case2) indicated the best cooling performance. In the case of coil pitch of 3 mm, the best cooling performance was shown, more than 10% increase of the inlet and outlet temperature difference, compared with the case of the cooler without coil. Consequently, the inserted coil pitch should be properly selected to improve cooling performance.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2003.10a
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• pp.83-88
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• 2003

An analytical study was carried out to evaluate the regenerative cooling characteristics in the liquid rocket engine of a 10tf-thrust level using kerosene as a fuel. As a supplementary cooling method, a radiative cooling was applied to the nozzle extension. It was found out from this work that the cooling system with the regenerative and radiation cooling only is not adaptable as a cooling method for the liquid rocket engine of a 10tf-thrust level using kerosene as a fuel for the 2nd stage of the space launch vehicle. So, additional cooling method, curtain cooling was introduced and analyzed. Curtain cooling was very effective to reduce the thermal and thermo-structural instability.

• Fashion & Textile Research Journal
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• v.22 no.2
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• pp.250-260
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• 2020

The purpose of the present study was to explore the most effective body region and cooling temperature to alleviate heat strain of workers in hot environments. We developed liquid cooling hood, vest, sleeves and socks and applied the water temperatures of 10, 15, 20, and 25℃ through the liquid cooling garments in a hot and humid environment (33℃ air temperature and 70% RH air humidity). A healthy young male participated in a total of 16 experimental trials (four cooling garments × four cooling temperatures) with the following protocol: 10-min rest, 40-min exercise on a treadmill and 10-min recovery. The results showed that rectal temperature, mean skin temperature, and ratings of perceived exertion during exercise; heart rate and diastolic blood pressure during recovery; and total sweat rate were lower for the vest condition than other garment conditions(p < .05). However, there was no differences in mean skin temperature among the four cooling garments when we compared the values converted by covering area(%BSA). When we classified the results by cooling temperature, there were no consistent differences in thermoregulatory and cardiovascular responses among the four temperatures, but 25℃ water temperature was evaluated as being the most ineffective cooling temperature in terms of subjective responses. In conclusion, the results indicated that wearing cooling vest with < 20℃ cooling temperature can alleviate heat strain of workers in hot and humid environments. If the peripheral body regions are cooled with liquid cooling garments, larger cooling area with lower cooling temperature than 10℃ would be effective to reduce heat strain of workers. Further studies with a vaild number of subjects are required.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.4
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• pp.111-117
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• 2004

An analytical study was carried out to evaluate the regenerative cooling characteristics in the liquid rocket engine of a 10tf-thrust level using kerosene as a fuel. As a supplementary cooling method, a radiative cooling was applied to the nozzle extension. It was found out from this work that the cooling system with the regenerative and radiation cooling only is not adaptable for the liquid rocket engine of a 10tf-thrust level using kerosene as a fuel for the $2^{nd}$ stage of the space launch vehicle, with the viewpoint of the thermal and thermo-structural instability and the excessive pressure drop in the cooling channel.

• Journal of the Korean Society of Visualization
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• v.21 no.3
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• pp.33-38
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• 2023

Spray cooling is a method of cooling high-temperature heating elements by spraying droplets. Recently, spray cooling has been proposed for use in next-generation nuclear reactors. When droplets are sprayed onto the outer wall of a heat exchanger tube, a film boiling occurs on the outer wall. Over time, the outer wall temperature decreases, and a liquid film forms on the outer wall, and the heat exchanger outer wall is subsequently cooled by the liquid film. In this case, the liquid film thickness has a great influence on the heat removal performance. In this study, an experimental study was conducted to measure the liquid film thickness distribution in a droplet spray environment. For this purpose, a method using the electrical conductivity of the liquid was adopted.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.10
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• pp.710-717
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• 2007

Electric and telecommunication industries are constantly striving towards miniaturization of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In this study, liquid-cooling heat exchangers with MPCM slurries were designed and tested by varying geometry and operating conditions. The liquid-cooling heat exchangers with 4-paths showed higher cooling performance than the others. The cooling performance of liquid cooling heat exchanger with MPCM slurries was more enhanced than that of the air cooling system. It's performance was also slightly superior to that of the water cooling system at the inlet temperature of $19^{\circ}C$.