• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.59-60
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• 2008

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.41-46
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• 2017

This study aims to select suitable co-solvents and to obtain optimal process conditions in order to improve process efficiency and productivity through experimental results obtained under various experimental conditions for the etching and rinsing process using liquid carbon dioxide and supercritical carbon dioxide. Acetone was confirmed to be effective through basic experiments and used as the etching solution for MEMS-wafer etching in this study. In the case of using liquid carbon dioxide as the solvent and acetone as the etching solution, these two components were not mixed well and showed a phase separation. Liquid carbon dioxide in the lower layer interfered with contact between acetone and Mems-wafer during etching, and the results after rinsing and drying were not good. Based on the results obtained under various experimental conditions, the optimum process for treating MEMS-wafer using supercritical CO2 as the solvent, acetone as the etching solution, and methanol as the rinsing solution was set up, and MEMS-wafer without stiction can be obtained by continuous etching, rinsing and drying process. In addition, the amount of the etching solution (acetone) and the cleaning liquid (methanol) compared to the initial experimental values can be greatly reduced through optimization of process conditions.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.163-170
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• 2006

By removing sacrificial layer through ashing process, movable MEMS structure on substrate can be fabricated in surface micromachining. However, MEMS structure includes, during the ashing process, the warping or buckling effects due to stress gradient along the vertical direction of thin film. In this study, we presented method for counteracting the unwanted deflection of MEMS structure and designed using character of deposit process to overcome limited design conditions. Unit cell patterns were designed with character of deposit shape, and their final shapes were adopted using Finite Element Method. Finally, RF MEMS switch was fabricated by surface micro machining as test vehicles. We checked out that alleviation effect for deformation of switch improved by 35%.

• Transactions of Materials Processing
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• v.11 no.7
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• pp.596-600
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• 2002

The ultrasonic bonding method and its feasibility are investigated in this work for joining the micro components and MEMS packaging. The ultrasonic bonding process is analyzed using a lumped mode, and preliminary experiments using the eutectic solder and copper pin were carried out to verify possibility to MEMS packaging. The ultrasonic bonding process appears to be adequate for MEMS packaging by providing localized heating at the selected area. Microscopic behavior of the bond joint through ultrasonic vibration needs further investigation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.376-377
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• 2006

Chemical Mechanical Planarization (CMP) has emerged as an enabling technology for the manufacturing of multi-level metal interconnects used in high-density Integrated Circuits (IC). Recently, multi-level structures have been also widely used m the MEMS device such as micro engines, pressure sensors, micromechanical fluid pumps, micro mirrors and micro lenses. Especially, among the thin films available in IC technologies, polysilicon has probably found the widest range of uses in silicon technology based MEMS. This paper presents the characteristic of polysilicon CMP for multi-level MEMS structures. Two-step CMP process verifies that is possible to decrease dishing amount with two type of slurries characteristics. This approach is attractive because two-step CMP process can be decreased dishing amount considerably more then just one CMP process.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.8
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• pp.1466-1470
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• 2007

MEMS design flow based on DFM concept is presented and applied to gyroscope design as a test case. It is purposed to contribute to the yield improvement by considering the process-related parameters from the design phase. After defining the performance requirements, the sensitivity analysis should be done on the draft design(s) to find out the key parameters related with the device performance. By doing so, TEG can be designed for the selected process and/or material parameters. Through a set of test runs, the process capability is characterized and the material properties are extracted using the TEG. Then we can estimate the virtual yield of the current process for the designed device by running Monte Carlo analysis where the process and/or material property variations are considered. The estimated yield will make us redesign the device to be more robust or improve the current process to have the smaller variations.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.137-140
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• 2002

The main objectives in the first year include selection of the MEMS bonding methods and feasibility study of selected methods. The ultrasonic bonding method is chosen for MEMS packaging, and the processes to provide localized heating are proposed. The ultrasonic bonding process is analyzed using a lumped model. Preliminary experiments using the eutectic solder and copper pin were performed to verify possibility to MEMS packaging. The preliminary results show possibility of the ultrasonic bonding method for MEMS packaging.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2009.10a
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• pp.119-123
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• 2009

Recently, a MEMS gyroscope has been broadly fabricated and used due to development of a micromachining. However, there is a difference between the modeling design and the actual product and this difference can lead to the performance variation of a MEMS gyroscope. A classical design method does not exactly estimate the performance of a MEMS gyroscope. Therefore a design process considering the design variable uncertainty has to be employed to design MEMS gyroscope model. In this paper, the equation of motion of a MEMS gyroscope model is obtained to analyze the performance of a MEMS gyroscope and the effects of the design variables on the MEMS gyroscope performance are investigated. Finally the performance of MEMS gyroscope is estimated through a statistical analysis based on sample statistics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.6
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• pp.458-464
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• 1998

This paper gives characterization of substrate and PZT(53/47) thin film deposited by metalorganic decomposition, which is concerned in deposition process and device fabrication process, to fabricate micro electro mechanical system (MEMS) device with piezoelectric material. The PZT thin films deposited by MOD at 700^{\circ}C$ for 30 minutes had a polycrystallinity, that is, no substrate dependence, while different interface were developed depending on the bottom electrodes. Such a structural variation could influence on not only the properties of the PZT film but also etching process for fabricating MEMS devices. Therefore the electrode structure is a very important factor in the deposition of the PZT film during etching process by HF acid for MEMS device with piezoelectric material. Piezoelectric coefficients of the PZT films on the different substrates were 40 and 80 pm/V at an applied voltage of 4V. Based in these results, it was possible for deposition of the PZT film by MOD to apply MEMS device fabrication process based on piezoelectricity after selection of proper bottom electrode.

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.157-162
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• 2006

Chemical-mechanical polishing (CMP), one of the dominant technology for ULSI planarization, is used to flatten the micro electro-mechanical systems (MEMS) structures. The objective of this paper is to achieve good planarization of the deposited film and to improve deposition efficiency of subsequent layer structures by using surface-micromachining process in MEMS technology. Planarization characteristic of poly-Si film deposited on thin oxide layer with MEMS structures is evaluated with different slurries. Patterns used for this research have shapes of square, density, line, hole, pillar, and micro engine part. Advantages of CMP process for MEMS structures are observed respectively by using the test patterns with structures larger than 1 urn line width. Preliminary tests for material selectivity of poly-Si and oxide are conducted with two types of silica slurries: $ILD1300^{TM}\;and\;Nalco2371^{TM}$. And then, the experiments were conducted based on the pretest. A selectivity and pH adjustment of slurry affected largely step heights of MEMS structures. These results would be anticipated as an important bridge stone to manufacture MEMS CMP slurry.