• Proceedings of the Materials Research Society of Korea Conference
• /
• 1998.11a
• /
• pp.32-32
• /
• 1998

• Korean Journal of Materials Research
• /
• v.10 no.7
• /
• pp.482-488
• /
• 2000

The deposition characteristics of Cu film by MOCVD using (hfac)Cu(1,5-COD)(1,1,1,5,5,5-hexafluro-2,4-pentadionato Cu(I) 1,5-cryclooctadiene) as a precursor have been investigated in terms of substrate conditions. Two different substrates such as air-exposed TiN and non-contaminated TiN were used for the MOCVD of Cu. MOCVD of Cu on the air-exposed TiN affected the nucleation rate of Cu as well as its growth, resulting in the Cu films having poor interconnection between particles with relatively small grains. On the other hand, in-situ MOCVD of Cu led to the Cu films having a significantly improved interconnection between particles with larger grains, indicating the resistivity as low as $2.0{\mu}{\Omega}-cm$ for the films having more than 1900$\AA$ thickness. Moreover, better adhesion of Cu films to the TiN by using in-situ MOCVD has been obtained. Finally, initial coalescence mechanism of Cu was suggested in this paper in terms of different substrate conditions by observing the surface morphology of the Cu films deposited by MOCVD.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2000.11a
• /
• pp.27-27
• /
• 2000

TDEAT precursor를 이용하여 DC-Pulse Plasma MOCVD 방법과 Thermal MOCVD 방법으로 각각 TiN 박막을 증착하였다. 본 논문에서는 DC-Pulse Plasma MOCVD 방 법으로 증착된 TiN 박막과 Therrnal MOCVD 방법으로 증착된 TiN 박막의 전기적 특성에 관하여 비교 분석하였다. 동일한 조건 하에서 각각의 방법으로 증착된 박막은 4-point probe를 이용하여 면저항을 측정하였고, XRD를 이용하여 박막의 성장방향을 관찰하였으며, FE-SEM을 이용하여 박막의 두께와 단면 사진, 표면형상을 관찰하였으며, AES depth profile을 통해 두께에 따른 Ti, N, 잔류 C와 0의 함량을 분석하였으며, XPS를 통해 C의 결합형태를 파악하고자 하였다. 분석결과 DC-Pulse Plasma MOCVD 방법으로 증착된 TiN 박막이 Thermal MOCVD 방법으로 증착된 TiN 박막에 비해 전기적 특성은 매우 우수하였으며, 치밀한 구조의 박막을 가지는 것으로 나타났다. 또한, 잔류 C, O의 함량이 낮은 것으로 나타났다.

• Applied Chemistry for Engineering
• /
• v.17 no.2
• /
• pp.194-200
• /
• 2006

Titanium oxide films were deposited by the nozzle type HCP RT-MOCVD for the application of metal-oxide films. In the case of TTNB, after depositing films, films must be annealed at a proper temperature, but in the case of titanium ethoxide, titanium oxide films could be directly deposited by titanium ethoxide without general annealing. We could confirm that ratio of O to Ti in the films was about 2 : 1 at RF-power of 240 watt, distance between cathode and substrate of 3 cm, deposition time of 20 min, and ratio of Ar to $O_2$ of 1 : 1. Therefore, we could obtain the titanium oxide film deposited by the nozzle type HCP RT-MOCVD without an annealing process and could apply in the metal-oxide deposition process at a low temperature.

• Proceedings of the IEEK Conference
• /
• 1999.06a
• /
• pp.279-282
• /
• 1999

Acceleration in integration density and speed performance of ULSI circuits require miniaturization of CMOS and interconnections as well as higher current density capabilities for transistors. A leading candidate to substitute A1-alloy is Cu, which has lower resistivity and higher melting point. So we can expect much higher electromigration resistance. In this paper, we are going to explain the major features of EM for MOCVD Cu according to variant conditions. We compared the life time and activation energy of MOCVD Cu with those of E-beam Cu and Al in The same conditions.

• Journal of the Korean Vacuum Society
• /
• v.9 no.3
• /
• pp.197-206
• /
• 2000

The deposition characteristics of MOCVD Cu using the (hfac)Cu(1,1-COD)(1,1,1,5,5,5-hexafluoro-2,4-pentadionato Cu(I) 1,5-cyclooctadine) have been investigated in terms of the effects of carrier gas such as hydrogen and argon as well as the effects of H(hfac) ligand addition. MOCVD Cu using a hydrogen carrier gas led to a higher deposition rate and lower resistivity than an argon carrier gas system. The improvement in the surface roughness of the MOCVD Cu films and the (111) preferred orientation texture was obtained by using a hydrogen carrier gas. However, the adhesion characteristics of the films showed relatively weaker compared to the Ar carrier gas system, probably due to the larger amount of F content in the films, which was confirmed by the AES analyses. When an additional H(hfac) ligand was added, the deposition rate was significantly enhanced in the case of an argon + H(hfac) carrier gas system while significant change in the deposition rate of MOCVD Cu was not observed in the case of the hydrogen carrier gas system. However, the addition of H(hfac) in both carrier gases led to lowering the resistivity of the MOCVD Cu films. In conclusion, this paper suggests the deposition mechanism of MOCVD Cu and is expected to contribute to the enhancement of smooth Cu films with a low resistivity by manipulating the deposition conditions such as the carrier gas and addition of H(hfac) ligand.

• Journal of the Korean Vacuum Society
• /
• v.14 no.4
• /
• pp.222-228
• /
• 2005

Undoped GaN epitaxial layer was grown on c-plane sapphire substrate by a two-step growth with metalorganic chemical vapor deposition(MOCVD). We have investigated the effects of the variation of final growth temperature on surface morphology, roughness, crystal quality, optical property, and electrical property In a horizontal MOCVD reactor, the film was grown at 300 Tow low-pressure with a fixed nucleation temperature of $500^{\circ}C$, varing the final growth temperature from $850\~1050^{\circ}C$ . The undoped GaN epilayers were characterized by atomic force microscopy, high-resolution x-ray diffractometer, photoluminescence, and Hall effect measurement.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1997.10a
• /
• pp.129-129
• /
• 1997

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.11a
• /
• pp.59-59
• /
• 2003

ZnO는 상온에서 3.37 eV의 넓은 밴드갭을 가지는 직접천이형 반도체이다. 상온에서 60 meV의 큰 엑시톤 결합에너지를 가짐으로 인해 엑시톤 재결합에 의한 강한 UV 레이저 발진효과를 기대할 수 있다. 이러한 장점을 갖는 ZnO 박막을 이용하여 광소자 등에 응용하기 위하여 양질의 ZnO 박막성장이 필수적이며, 이를 위해 MBE, MOCVD, PLD, rf magnetron sputtering 등 다양한 증착방법을 통한 연구결과가 보고되고 있다. 또한 p형 불순물인 As과 N 도핑 및 Ga과 N의 co-doping 방법 등을 통하여 p형 ZnO 박막을 제조하였음이 보고되고 있으나 재현성 문제 등으로 인해 계속적인 연구가 진행되고 있다. 본 연구에서는 MOCVD를 이용하여 A1$_2$O$_3$(0001) 기판 위에 ZnO 박막을 성장시켰다. Zn 전구체로 DEZn을 사용하였으며, 산소 source로 $O_2$를 사용하였다. 증착온도, Ⅵ/II 비율, 반응기 압력 등 MOCVD의 중요한 공정변수들의 체계적인 변화에 따른 박막성장 양상을 조사하였다. 증착 조건에 따라 ZnO 입자의 모양이 주상(column), nano-rod, nano-needle, nano-wire 등으로 급격하게 변화됨을 확인하였으며, 이러한 입자의 모양과 결정성장 방향 및 광학적 특성과의 상관관계의 해석을 시도하였다.

• Journal of the Korean Vacuum Society
• /
• v.4 no.S1
• /
• pp.138-144
• /
• 1995

It is commonly believed that high permittivity materials will be necessary for future high density Gbit DRAMs. In a first part, we explain the choice of SrTiO3 by ECR MOCVD for Gbit-scale DRAMs. In a second part, after describing the ECR MOCVD system and presenting the requirements SrTiO3 thin films should meet for use in Gbit-scale DRAMs, the physical and electrical properties of srTiO3 thi film prepared by ECR MOCVD are then studied. A stacked capacitor technology, suitable for use in 1 Gbit DRAM, and comprising high permittivity SrTiO3 thin films prepared by ECR MOCVD at $450^{\circ}C$ on electron beam and RIE patterned RuO2/TiN storage nodes is finally described.