• IEMEK Journal of Embedded Systems and Applications
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• v.8 no.2
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• pp.87-93
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• 2013

In this paper, we implemented and evaluated the performance of a vector-based rasterization algorithm of 3D graphics using a SIMD-based many-core processor that consists of 4,096 processing elements. In addition, we compared the performance and efficiency of the rasterization algorithm using the many-core processor and commercial GPU (Graphics Processing Unit) system which consists of 7 GPUs and each of which have 512 cores. Experimental results showed that the SIMD-based many-core processor outperforms the commercial GPU system in terms of execution time (3.13x speedup), energy efficiency (17.5x better), and area efficiency (13.3x better). These results demonstrate that the SIMD-based many-core processor has potential as an embedded mobile processor.

• Journal of the Korea Society of Computer and Information
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• v.18 no.9
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• pp.1-10
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• 2013

In this paper, we implement the SIFT(Scale-Invariant Feature Transform) algorithm for feature point extraction using a many-core processor, and analyze the performance, area efficiency, and system area efficiency of the many-core processor. In addition, we demonstrate the potential of the proposed many-core processor by comparing the performance of the many-core processor with that of high-performance CPU and GPU(Graphics Processing Unit). Experimental results indicate that the accuracy result of the SIFT algorithm using the many-core processor was same as that of OpenCV. In addition, the many-core processor outperforms CPU and GPU in terms of execution time. Moreover, this paper proposed an optimal model of the SIFT algorithm on the many-core processor by analyzing energy efficiency and area efficiency for different octave sizes.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.2
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• pp.252-256
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• 2013

In order to overcome the complexity and performance limit problems of superscalar processors, the multi-core architecture has been prevalent recently. Usually, the number of cores mostly used for the multi-core processor architecture ranges from 2 to 16. However in the near future, more than 32-cores are likely to be utilized, which is called as many-core processor architecture. Using SPEC 2000 benchmarks as input, the trace-driven simulation has been performed for the 32 to 1024 many-core architectures extensively. For 1024-cores, the average performance scores 15.7 IPC, but the performance increase rate is saturated.

• IEMEK Journal of Embedded Systems and Applications
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• v.7 no.5
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• pp.277-284
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• 2012

To meet the usage of discrete wavelet transform (DWT) on potable devices, this paper implements 2-level DWT using a reference many-core processor architecture and determine the optimal many-core processor. To explore the optimal many-core processor, we evaluate the impacts of a data-per-processing element ratio that is defined as the amount of data mapped directly to each processing element (PE) on system performance, energy efficiency, and area efficiency, respectively. This paper utilized five PE configurations (PEs=16, 64, 256, 1,024, and 4,096) that were implemented in 130nm CMOS technology with a 720MHz clock frequency. Experimental results indicated that maximum energy and area efficiencies were achieved at PEs=1,024. However, the system area must be limited 140mm2 and the power should not exceed 3 watts in order to implement 2-level DWT on portable devices. When we consider these restrictions, the most reasonable energy and area efficiencies were achieved at PEs=256.

• ETRI Journal
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• v.37 no.1
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• pp.118-127
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• 2015

The power consumption of 3D many-core processors can be reduced, and the power delivery of such processors can be improved by introducing voltage island (VI) design using on-chip voltage regulators. With the dramatic growth in the number of cores that are integrated in a processor, however, it is infeasible to adopt per-core VI design. We propose a 3D many-core processor architecture that consists of multiple voltage clusters, where each has a set of cores that share an on-chip voltage regulator. Based on the architecture, the steady state temperature is analyzed so that the thermal characteristic of each voltage cluster is known. In the voltage scaling and task scheduling stages, the thermal characteristics and communication between cores is considered. The consideration of the thermal characteristics enables the proposed VI formation to reduce the total energy consumption, peak temperature, and temperature gradients in 3D many-core processors.

• Journal of the Korea Society of Computer and Information
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• v.16 no.1
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• pp.1-9
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• 2011

Recently, as mobile multimedia devices are used more and more, the needs for high-performance and low-energy multimedia processors are increasing. Application-specific integrated circuits (ASIC) can meet the needed high performance for mobile multimedia, but they provide limited, if any, generality needed for various application requirements. DSP based systems can used for various types of applications due to their generality, but they require higher cost and energy consumption as well as less performance than ASICs. To solve this problem, this paper proposes a single instruction multiple data (SIMD) based many-core processor which supports high-performance and low-power image data processing while keeping generality. The proposed SIMD based many-core processor composed of 16 processing elements (PEs) exploits large data parallelism inherent in image data processing. Experimental results indicate that the proposed SIMD-based many-core processor higher performance (22 times better), energy efficiency (7 times better), and area efficiency (3 times better) than conversional commercial high-performance processors.

• Journal of the Korea Society of Computer and Information
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• v.16 no.8
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• pp.119-128
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• 2011

This paper introduces design space exploration of many-core processors that meet high performance and low power required by the beamforming algorithm of image signals of mobile ultrasound. For the design space exploration of the many-core processor, we mapped different number of ultrasound image data to each processing element of many-core, and then determined an optimal many-core processor architecture in terms of execution time, energy efficiency and area efficiency. Experimental results indicate that PE=4096 and 1024 provide the highest energy efficiency and area efficiency, respectively. In addition, PE=4096 achieves 46x and 10x better than TI DSP C6416, which is widely used for ultrasound image devices, in terms of energy efficiency and area efficiency, respectively.

• ETRI Journal
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• v.42 no.4
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• pp.468-479
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• 2020

The proposed AI processor architecture has high throughput for accelerating the neural network and reduces the external memory bandwidth required for processing the neural network. For achieving high throughput, the proposed super thread core (STC) includes 128 × 128 nano cores operating at the clock frequency of 1.2 GHz. The function-safe architecture is proposed for a fault-tolerance system such as an electronics system for autonomous cars. The general-purpose processor (GPP) core is integrated with STC for controlling the STC and processing the AI algorithm. It has a self-recovering cache and dynamic lockstep function. The function-safe design has proved the fault performance has ASIL D of ISO26262 standard fault tolerance levels. Therefore, the entire AI processor is fabricated via the 28-nm CMOS process as a prototype chip. Its peak computing performance is 40 TFLOPS at 1.2 GHz with the supply voltage of 1.1 V. The measured energy efficiency is 1.3 TOPS/W. A GPP for control with a function-safe design can have ISO26262 ASIL-D with the single-point fault-tolerance rate of 99.64%.

• Journal of KIISE
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• v.44 no.9
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• pp.878-886
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• 2017

This paper discusses performance bottlenecks that may occur when executing high-performance computing MPI applications in the Intel's next generation many-core processor called Knights Landing(KNL), as well as effective resource allocation techniques to solve this problem. KNL is composed of a host processor to enable self-booting in addition to an existing accelerator consisting of a many-core processor, and it was released with a new type of on-package memory with improved bandwidth on top of existing DDR4 based memory. We empirically verified an improvement of the execution performance of multiple MPI applications and the overall system utilization ratio by studying a resource allocation method optimized for such new many-core processor architectures.

• Journal of the Korea Society of Computer and Information
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• v.17 no.6
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• pp.1-11
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• 2012

As the process technology scales down, multi-core processors cause serious problems such as increased interconnection delay, high power consumption and thermal problems. To solve the problems in 2D multi-core processors, researchers have focused on the 3D multi-core processor architecture. Compared to the 2D multi-core processor, the 3D multi-core processor decreases interconnection delay by reducing wire length significantly, since each core on different layers is connected using vertical through-silicon via(TSV). However, the power density in the 3D multi-core processor is increased dramatically compared to that in the 2D multi-core processor, because multiple cores are stacked vertically. Unfortunately, increased power density causes thermal problems, resulting in high cooling cost, negative impact on the reliability. Therefore, temperature should be considered together with performance in designing 3D multi-core processors. In this work, we analyze the temperature of the cache in quad-core processors varying cache organization. Then, we propose the low-temperature cache organization to overcome the thermal problems. Our evaluation shows that peak temperature of the instruction cache is lower than threshold. The peak temperature of the data cache is higher than threshold when the cache is composed of many ways. According to the results, our proposed cache organization not only efficiently reduces the peak temperature but also reduces the performance degradation for 3D quad-core processors.