• Title/Summary/Keyword: Metal thin foil

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Micro Channel Forming with Ultra Thin Metal Foil (초미세 금속 박판의 마이크로 채널 포밍)

  • Joo, Byung-Yun;Oh, Soo-Ik;Baek, Seung-Wook
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.30 no.2 s.245
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    • pp.157-163
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    • 2006
  • Our research dealt with micro fabrication using micro forming process. The goal of the research was to establish the limit of forming process concerning the size of forming material and formed shape. Flat-rolled ultra thin metallic foils of pure copper(3.0 and $1.0{\mu}m$ in thickness)and stainless steel($2.5{\mu}m$ in thickness) were used for forming material. We obtained the various shapes of micro channels as using designed forming process. $12-14{\mu}m$ wide and $9{\mu}m$ deep channels were made on $3.0{\mu}m$ thick foil and $6{\mu}m$ wide and $3{\mu}m$deep channels were made on $1.0{\mu}m$ thick foil. Si wafer die for forming was fabricated by using etching technique. And the relation of etching time and die dimension was investigated for fabricating precisely die groove. For the forming, die and metal foil were vacuum packed and the forming was conducted with a cold isostatic press. The formed channels were examined in terms of their dimension, surface qualities and potential for defects. Base on the examinations, formability of ultra thin metallic foil was also discussed. Finally, we compared the forming result with simulation. The result of research showed that metal forming technology is promising to produce micro parts.

Development of Micro Press for Forming the Micro Thin Foil Valve (마이크로 박판 밸브 성형을 위한 마이크로 프레스 개발)

  • Lee, Hye-Jin;Lee, Nak-Kyu;Lee, Hyoung-Wook
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.5
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    • pp.166-171
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    • 2007
  • In this paper Research development about a micro metal forming manufacturing system has been developed. A micro forming system has been achieved in Japan and it's developed micro press is limited to single forming process. To coincide with the purpose to be more practical, research and development is necessary about the press which the multi forming process is possible. We set the development of the equipment including micro deep drawing, micro punching and micro restriking process to the goal. To achieve this goal, we set the application product to a micro thin foil valve which is used in the micro pump module. The compound die set has been designed and manufactured to make two step process. The material of thin foil valve is SUS-304 and its thickness is 50$\mu$m. We can get a good forming results from micro punching experiments in this paper.

Manufacturing Technology of Thin Foil Tensile Specimen Using Cold Isostatic Press and Precision Mechanical Property Measurement Technology (냉간 등방압 성형기를 이용한 미세박판 인장시험시편 가공기술 및 정밀 기계적 물성 측정기술)

  • Lee H. J.;Park H. J.;Lee N. K.;Kim S. S.;Lee H. W.;Hwang J. H.;Park J. H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.05a
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    • pp.245-248
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    • 2005
  • This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical property. This thin foil tensile specimen manufacturing technology is a method that can make a metal thin foil specimen for micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect that precision mechanical property of micro/nano material and component. Micro and Nano mechanical property can be measured using this technology and mechanical property data base of micro/nano material and component can be constructed.

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Micro channel forming of ultra thin copper foil (초미세 구리 박판의 마이크로 채널 성형)

  • Joo B. Y.;Rhim S. H.;Oh S. I.;Baek S. W.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.09a
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    • pp.49-53
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    • 2005
  • The objective of this research was to establish the size limitation of micro metal forming and analyze the formability of foil. Flat-rolled ultra thin metallic copper foil($3{\mu}m$ in thickness) was used as a forming material and foil was annealed to improve the formability at the temperature of $385^{\circ}C$. Forming die was fabricated by using etching technique of DRIE(deep reactive ion etching) and HNA isotropic etching. For the forming die and coupe. foil were vacuum packed and the forming was conducted as applying hydrostatic pressure of 250MPa to the vacuum packed unit. We successfully obtained the micro channels of $12\~14{\mu}m$ width and $9{\mu}m$ depth from micro forming process we designed. We also investigated the thickness strain distribution of foil from experiment and FE simulation result. Micro channels had a good formability of smooth surface and size accuracy. We expect that micro metal forming technology will be applied to production of micro parts.

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Laser Supported Combustion Waves and Plasma Flows (고에너지펄스를 이용한 충격파 발생과 응용)

  • ;Choi, Ji-Hae;Gwak, Min-Cheol;Yoh, Jai-Ick
    • 한국연소학회:학술대회논문집
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    • 2007.05a
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    • pp.27-30
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    • 2007
  • We have been setting up experiments on propagation of shock waves generated by the pulsed laser ablation. One side of a thin metal foil is subjected to laser ablation as a shock wave is generated from a localized spot of high intensity energy source. The resulting reactive shock wave, which penetrates through the foil is reflected by an acoustic impedance which causes the metal foil to high-strain rate deform. This short time physics is captured on an ICCD camera. The focus of our research is generating reactive shock wave and high strain rate deforming of thin metal foil for accelerating micro-particles to a very high speed on the orders of several thousand meter per second. Somce innovative applications of this device will be discussed.

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Shock Compresssion and Microparticles Acceleration using High Power Laser (고 출력 레이저 의한 충격파 현상 연구 및 응용)

  • Lee, Hyun-Hee;Yoh, Jai-Ick
    • Proceedings of the KSME Conference
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    • 2007.05b
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    • pp.1916-1919
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    • 2007
  • We have been setting up experiments on propagation of shock waves generated by the pulsed laser ablation. One side of a thin metal foil is subjected to laser ablation as a shock wave propagates through the foil. The shock wave, which penetrates through the foil is reflected by an acoustic impedance which causes the metal foil to high-strain rate deform. This short time physics is captured on an ICCD camera. The focus of our research is applying shock wave and deformation of the thin foil from the ablation to accelerating micro-particles to a very high speed.

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Shock Compression of Metal using High Energy Laser and Innovative Applications (고 에너지를 이용한 충격파 발생과 응용)

  • Lee, Hyun-Hee;Yoh, Jai-Ick
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2007.04a
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    • pp.353-357
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    • 2007
  • We have been setting up experiments on propagation of shock waves generated by the pulsed laser ablation. One side of a thin metal foil is subjected to laser ablation as a shock wave propagates through the foil. The shock wave, which penetrates through the foil is reflected by an acoustic impedance which causes the metal foil to high-strain rate deform. This short time physics is captured on an ICCD camera. The focus of our research is applying shock wave and deformation of the thin foil from the ablation to accelerating micro-particles to a very high speed.

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An experimental study on the oriented mechanical properties of aluminum micro thin foil material (알루미늄 마이크로 박판소재의 방향성에 관한 실험적 연구)

  • Lee H. J.;Lee N. K.;Choi S.;Lee H. W.;Choi T. H.;Hwang J. H.;Kwag D. G.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.10a
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    • pp.295-298
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    • 2005
  • This paper is concerned with the precision material property measurement of a micro metal thin foil that is used in MEMS technology. Since these MEMS components require great precision and accuracy, evaluation of reliability such as the lift cycle endurance test, impact test, and residual stress test is necessary for these components. However, in practice, real reliability tests are not easy to perform due to consideration of various factors. Rather than actual testing, it would be much easier to evaluate the reliability of components by the analytical approach. Although the analytical method is utilized by software tools, it is obviously necessary to acquire fundamental properties of materials through real test methods. In this paper, the oriented mechanical properties of aluminum thin foil are measured by nano scale material property measurement system.

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Silicon Thin-film Transistors on Flexible Foil Substrates

  • Wagner, Sigurd;Gleskova, Helena
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.263-267
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    • 2002
  • We are standing at the beginning of the industrialization of flexible thin-film transistor backplanes. An important group of candidates is based on silicon thin films made on metal or plastic foils. The main features of amorphous, nanocrystalline and microcrystalline silicon films for TFTs are summarized, and their compatibility with foil substrate materials is discussed.

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